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      <title>Small Form Factors</title>
      <description>PC/104 and Small Form Factors magazine is the engineer’s journal for modular embedded design. Our editorial content and product database focus around PC/104, PC/104-Plus, and other small embedded form factors and their related technologies.</description>
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      <pubDate>Thu, 23 Feb 2012 02:09:41 +0000</pubDate>
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         <title>Eurocom adds Intel 520 series Solid State Drives SATA 6 GB/s in RAID 0/1/5/10 to Mobile Workstation and Mobile Server Offerings</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/oUWmfnBaB7E/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;Eurocom Corporation (&lt;a rel="nofollow" target="_blank" href="http://www.eurocom.com"&gt;www.eurocom.com&lt;/a&gt;) announces support for Intel's new high performance 520 Series of Solid-State Drives inside their Mobile Workstations and Mobile Server solutions.&lt;/p&gt;&lt;p&gt;
The addition of the Intel 520 series of SSD's to Eurocom&amp;#8217;s extensive list of storage drives gives customers an even greater choice when customizing their purpose built systems. Customers have a myriad of choices between Hard Disk Drives, Solid State Drives and Hybrid Drives.&lt;/p&gt;&lt;p&gt;
Eurocom Mobile Workstations are built to offer unmatched performance, long lifespan and full upgradeability of the processor, memory, storage, operating system and VGA technology, and are designed with the most innovative technology and components available, including RAID 0/1/5/10 support to dual GPU support.&lt;/p&gt;&lt;p&gt;
RAID stands for Redundant Array of Independent Disks, and is a technology that provides increased data storage abilities through redundancy. Multiple drives are arranged in units where data are distributed across the drives in different RAID levels. The ultimate goal of RAIDing ones drives is to provide increased levels of data reliability and backup as well as increased levels of read/write performance. Different levels of RAID correspond with varying levels of performance and redundancy.&lt;/p&gt;&lt;p&gt;
Intel Solid-State Drive 520 series accelerates SATA throughput by utilizing SATA 6 gigabits per second performance and NAND based SSD technology. The Intel 520 series supports data transfers up to 550 megabytes per second (MB/s), with sequential write times up to 520 MB/s.&lt;/p&gt;&lt;p&gt;
Intel Solid State Drive 520 series consists of 60GB, 120GB, 180GB, 240GB and 480GB capacities.&lt;/p&gt;&lt;p&gt;
Eurocom&amp;#8217;s usage of NAND based SSD technology and SATA 6GB/s drives allow for super quick system responsiveness, boot times, application launches, file loads, sleep recovery and benchmarks.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;The 520 drives make use of the Sandforce SF-2281 controller to offer blazing speeds.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Intel also offers an unprecedented 5 year warranty on all 520 series drives.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
"The Intel 520 series SSDs gives Eurocom clients looking for the most powerful mobile workstations on the market a super fast storage option, that is rugged, efficient and performance oriented" explains Eurocom President Mark Bialic.&lt;/p&gt;&lt;p&gt;
Intel 520 series SSDs support Advanced Encryption Standard (AES) 256-bit Encryption, which is an industry standard in data security, providing a hardware-based mechanism for encryption and decryption of user data. End-to-end data protection helps protect data from being corrupted across the data path by using cyclic redundancy check (CRC), parity, and error correction code (ECC) checks in the data path from the host interface to the NAND, and back.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Eurocom Storage Drive Options&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 80GB MLC SSD; Intel 310 series; SATA-300&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 250GB; G-Force Protection; SATA-300 NCQ; 7,200rpm; 16MB cache;&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 320GB; SATA-300; 7,200rpm; 16MB cache; Seagate&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 500GB; G-Force Protection; SATA-300 NCQ; 7,200rpm; 16MB cache;&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 750GB; SSHD; Seagate Momentus XT Hybrid; 8GB SLC NAND Flash&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 750GB 5400rpm SATA-300; 16MB cache;&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 750GB; 7200rpm; 16MB cache; Seagate Momentus&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 500GB; Solid State Hybrid Drive; Seagate Momentus XT; 32MB cache/4GB SLC Flash&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 640GB; 5400rpm; 3Gb/s; 8MB cache; WD Scorpio Blue&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 256GB SSD MLC; SATA-600; Marvell controller; Crucial/Micron RealSSD C300&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 128GB MLC SSD; Micron C300 RealSSD; SATA-600&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 120GB MLC SSD; Intel 510 series; SATA-600;&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 120GB MLC SSD; Intel 320 series; SATA-300;&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 250GB MLC SSD; Intel 510; SATA-600; Marvell 9174 controller&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 600GB SSD MLC; Intel 320 series; SATA-300;&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 160GB MLC SSD; Intel X25-M Gen2 34nm; SSDSA2MH160G2C1&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 512GB SSD MLC; Micron/Crucial M4;&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 240GB MLC Solid State Drive; Solidata X8; SandForce-1200;&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; 1TB; 5400rpm; 8MB cache; WD Scorpio Blue&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Intel SSD 510 Series Specifications&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; Capacity: 60GB, 120GB, 180GB, 240GB and 480GB&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; Components:&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o Intel&amp;#174; 25nm NAND Flash Memory&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o Multi-Level Cell (MLC)&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; Form Factor: 2.5&amp;#8221;&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; SATA 6Gb/s&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o Sustained sequential read: up to 550 MB/s&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o Sustained sequential write: up to 520MB/s&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; Read and Write IOPS&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o Random 4KB reads: up to 50 000 IOPS&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o Random 4KN writes: up to 80 000 IOPS&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; AES 256-bit Encryption&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; Power Consumption (TYP)&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o Active 850 mW&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o Idle: 600 mW&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; Operating Voltage&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o Min 4.75 V&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o Max 5.25 V&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; Mean Time Between Failures&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o 1,200,000 hours&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#183; Minimum Useful Life/Endurance Rating&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;o 5 years&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Eurocom:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Eurocom is a leading developer of long lifespan, fully upgradable notebooks, high performance mobile workstations and mobile servers since 1989. The company has produced many firsts and continues to engineer computer systems and VGA solutions that inspire and enable individuals and companies to reach great possibilities. Eurocom has been a leading innovator in the mobile computer industry since 1989, is currently the only developer in the world offering a Mobile Server solution along with a full line of Mobile Workstation supporting RAID 0/1/5/10 with up to 4 hard drives. For more information on Eurocom please visit (&lt;a rel="nofollow" target="_blank" href="http://www.eurocom.com"&gt;www.eurocom.com&lt;/a&gt;).&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/oUWmfnBaB7E" height="1" width="1"/&gt;</description>
         <author>Eurocom</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31304</guid>
         <pubDate>Wed, 22 Feb 2012 22:36:27 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31304</feedburner:origLink></item>
      <item>
         <title>Aeroflex and EF Johnson Technologies Announce Availability of Aeroflex 3920 Digital Radio Test Set for Automated Tests and Alignment of ES Series Radios</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/LCx1GqfXACE/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;LAS VEGAS&amp;#8212;International Wireless Communications Expo (IWCE 2012)&amp;#8212;February 22, 2012&amp;#8212;Aeroflex Incorporated, a wholly owned subsidiary of Aeroflex Holding Corp. (NYSE:ARX), announced today a collaboration with EF Johnson Technologies, Inc. to provide automated test and alignment capabilities for EFJohnson P25 radios on the Aeroflex 3920 Digital Radio Test Set. Initial test capabilities will be focused on the 5100ES and 5300ES Series APCO Project 25 conventional radios.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The Aeroflex Automated Test and Alignment procedure provides fully automated test and alignment of EFJohnson radios without the need for user interaction. This test system ensures consistent and reliable tests and alignment to manufacturer-recommended specifications and to industry standards, ensuring proper interoperability and a uniform standard of performance within the radio&amp;#8217;s network technology.&lt;/p&gt;&lt;p&gt;
&amp;#8220;This will be a very important tool for our dealers and end users. The automation will provide fast and consistent results in the field,&amp;#8221; said Randy O&amp;#8217;Connor, Manager of Technical Operations, EF Johnson Technologies.&lt;/p&gt;&lt;p&gt;
&amp;#8220;Aeroflex is pleased to have the opportunity to provide this unique test technology for EFJohnson radios,&amp;#8221; said Mike Fortna, Senior Product Marketing Engineer, Aeroflex. &amp;#8220;The 3920 provides an advanced method for repeatable and highly accurate test and alignment for EFJohnson radios that requires minimal technical interface. Since the 3920 provides fully automated tests and alignment processes, EFJohnson dealers and end users can now utilize their technical resources to provide higher value services.&amp;#8221;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Availability&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
 The EFJohnson Auto-Test II Option is now available. The Aeroflex 3920 has a delivery time of eight weeks upon receipt of order. For more information, contact your local Aeroflex sales office by visiting or calling Aeroflex Sales at (800) 835-2352 or info-test@aeroflex.com.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Aeroflex&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Aeroflex Incorporated is a leading global provider of high performance microelectronic components and test and measurement equipment used by companies in the space, avionics, defense, commercial wireless communications, medical and other markets.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About EF Johnson Technologies, Inc.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
 Headquartered in Irving, Texas, EF Johnson Technologies, Inc. focuses on innovating, developing, and marketing the highest quality secure communications solutions to organizations whose mission is to protect and save lives. The Company&amp;#8217;s customers include first responders in public safety and public service, the federal government, and industrial organizations. The Company&amp;#8217;s products are marketed under the EFJohnson name, and many are designed and manufactured in America. For more information, visit &lt;a rel="nofollow" target="_blank" href="http://www.EFJohnsonTechnologies.com"&gt;www.EFJohnsonTechnologies.com&lt;/a&gt;.&lt;/p&gt;&lt;/span&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=LCx1GqfXACE:nY-Xi3sIlT4:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=LCx1GqfXACE:nY-Xi3sIlT4:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=LCx1GqfXACE:nY-Xi3sIlT4:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=LCx1GqfXACE:nY-Xi3sIlT4:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=LCx1GqfXACE:nY-Xi3sIlT4:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=LCx1GqfXACE:nY-Xi3sIlT4:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=LCx1GqfXACE:nY-Xi3sIlT4:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=LCx1GqfXACE:nY-Xi3sIlT4:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=LCx1GqfXACE:nY-Xi3sIlT4:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=LCx1GqfXACE:nY-Xi3sIlT4:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/LCx1GqfXACE" height="1" width="1"/&gt;</description>
         <author>Aeroflex</author>
         <guid isPermaLink="false">http://www.mil-embedded.com/news/db/?31303</guid>
         <pubDate>Wed, 22 Feb 2012 22:32:43 +0000</pubDate>
      <feedburner:origLink>http://www.mil-embedded.com/news/db/?31303</feedburner:origLink></item>
      <item>
         <title>Agilent Technologies Offers Application Note on Wireless LAN at 60 GHz</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/uilxt8wtxkw/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;What: The new Agilent application note on 802.11ad, &amp;#8220;Wireless LAN at 60GHz - IEEE 802.11ad Explained&amp;#8221; introduces and discusses in detail the proposed 802.11ad, providing up to 7 Gbps throughput using approximately 2 GHz of spectrum at 60 GHz over a short range. It addresses the requirements and challenges of the higher data throughput to needed to support today&amp;#8217;s &amp;#8220;unwired office&amp;#8221;. &lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;When: Available now&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Where: Wireless LAN at 60GHz - IEEE 802.11ad , registration is required to download.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Additional&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Information: &lt;a rel="nofollow" target="_blank" href="http://www.agilent.com/find/WLAN"&gt;www.agilent.com/find/WLAN&lt;/a&gt;&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/gmoaHmvfTvm59FYp05wxv4jO77M/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/gmoaHmvfTvm59FYp05wxv4jO77M/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=uilxt8wtxkw:YM9I0NbQpGo:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=uilxt8wtxkw:YM9I0NbQpGo:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=uilxt8wtxkw:YM9I0NbQpGo:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=uilxt8wtxkw:YM9I0NbQpGo:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=uilxt8wtxkw:YM9I0NbQpGo:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=uilxt8wtxkw:YM9I0NbQpGo:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=uilxt8wtxkw:YM9I0NbQpGo:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=uilxt8wtxkw:YM9I0NbQpGo:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=uilxt8wtxkw:YM9I0NbQpGo:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=uilxt8wtxkw:YM9I0NbQpGo:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/uilxt8wtxkw" height="1" width="1"/&gt;</description>
         <author>Agilent Technologies</author>
         <guid isPermaLink="false">http://tech.opensystemsmedia.com/embedded-wireless/news/id/?31300</guid>
         <pubDate>Wed, 22 Feb 2012 20:21:39 +0000</pubDate>
      <feedburner:origLink>http://tech.opensystemsmedia.com/embedded-wireless/news/id/?31300</feedburner:origLink></item>
      <item>
         <title>ZTE to launch two new LTE handsets at #MWC</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/guCAqh1Rb1A/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;&lt;span class="abstract"&gt;The Chinese smartphone manufacturer ZTE has announced the launch of two new handsets ahead of Mobile World Congress (MWC) in Barcelona next week.&lt;/span&gt;&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The firm said it was planning to launch two new LTE handsets, the PF200 and N910, running Android Ice Cream Sandwich, with 1.2GHz and 1.5GHz chipsets, though didn&amp;#8217;t specify which chip would feature in which handset.&lt;/p&gt;&lt;p&gt;
4G LTE phones are expected to be a key feature at next week&amp;#8217;s MWC, with LTE networks coming online around the world. Last week saw LG announcing that it would launch its Optimus Vu and Optimus LTE Tag handsets at the show, while HTC is also expected to add more substance to its LTE push as it attempts to vie with market leaders Apple and Samsung.&lt;/p&gt;&lt;p&gt;
&amp;#8220;These LTE devices are the fore-runners of a wide range of LTE devices ZTE will bring to the market in the coming months, and as more and more LTE networks come on stream,&amp;#8221; said He Shiyou, Executive Vice President and Head of the Terminal Division of ZTE. &lt;/p&gt;&lt;p&gt;
&amp;#8220;They will be feature products &amp;#8211; among a very wide range of devices on display at the ZTE stand at Mobile World Congress 2012.&amp;#8221;&lt;/p&gt;&lt;p&gt;
The PF200, the more sophisticated of the pair, will work across all the main LTE, UMTS and GSM spectrums, and will come with Bluetooth 2.1, GPS, WiFi, A-GPS, digital living network alliance (DLNA) compatibility, mobile high-definition link (MHL) for connecting to home audio and video devices, and NFC capability.&lt;/p&gt;&lt;p&gt;
The N910 handset will work across LTE FDD, CDMA and EVDO spectrums. It has a WVGA (800 x 480) capacitive touch screen, with 5MP autofocus and flash camera with a 1080p front facing camera for video calling. Features will include GPOS, WiFi, Bluetooth and DLNA capability. &lt;/p&gt;&lt;p&gt;
There were no details yet on the expected price of each handset, but more details will no doubt be revealed in Barcelona next week. Telecoms Tech will be attending Mobile World Congress, so stay tuned for updates.&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/rNm-xU1sJONt78BxIgFSGTkxFHU/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/rNm-xU1sJONt78BxIgFSGTkxFHU/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=guCAqh1Rb1A:dekQiT2cS4c:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=guCAqh1Rb1A:dekQiT2cS4c:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=guCAqh1Rb1A:dekQiT2cS4c:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=guCAqh1Rb1A:dekQiT2cS4c:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=guCAqh1Rb1A:dekQiT2cS4c:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=guCAqh1Rb1A:dekQiT2cS4c:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=guCAqh1Rb1A:dekQiT2cS4c:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=guCAqh1Rb1A:dekQiT2cS4c:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=guCAqh1Rb1A:dekQiT2cS4c:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=guCAqh1Rb1A:dekQiT2cS4c:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/guCAqh1Rb1A" height="1" width="1"/&gt;</description>
         <author>ZTE</author>
         <guid isPermaLink="false">http://tech.opensystemsmedia.com/android/news/id/?31298</guid>
         <pubDate>Wed, 22 Feb 2012 20:13:55 +0000</pubDate>
      <feedburner:origLink>http://tech.opensystemsmedia.com/android/news/id/?31298</feedburner:origLink></item>
      <item>
         <title>ON Semiconductor Introduces New Series of Adjustable Output Low Dropout Voltage Regulators for Automotive Applications</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/ynMqc6kaps0/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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					&lt;img id="image1" alt="" align="right" border="0" width='210' title="Click to zoom" src="http://i.opensystemsmedia.com/?bg=ffffff&amp;fltr[0]=usm|40|4&amp;q=93&amp;w=210&amp;src=http%3A%2F%2Fwww.pinnaclecrc.com%2FPR_PICTURES%2FON_Semi%2FONSPR2583%2F"/&gt;
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											&lt;/td&gt;
		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;PHOENIX, Ariz. &amp;#8211; Feb. 22, 2012 &amp;#8211; ON Semiconductor (Nasdaq: ONNN), a premier supplier of high performance silicon solutions for energy efficient electronics, has announced two new low dropout (LDO) voltage regulator ICs. Building on the company&amp;#8217;s market-leading power management portfolio for automotive applications, the new devices are ideal for use in audio and infotainment systems, instrument cluster, navigation and satellite radio. &lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The new NCV47700 and NCV47701 LDOs feature an output diagnostic pin CSO that can be used to detect open and shorted loads. Using a resistor connected to the CSO provides an adjustable output current level between 10 milliamperes (mA) and 350 mA with &amp;#177;10% accuracy. Tying the ADJ pin to ground configures the NCV47700 and NCV47701 to be a current limited high-side switch. High peak input voltage tolerance and reverse input voltage protection, as well as overcurrent and overtemperature protection functions are all included to safeguard against the effects of the harsh operating conditions typical of automotive applications. An integrated current sense feature negates the need to implement a discrete solution that would use more board space and raise the total component count. &lt;/p&gt;&lt;p&gt;
Adjustable output voltage versions of the devices are available; these cover the 5 volt (V) to 20 V range, with &amp;#177; 6% accuracy for the NCV47700 and &amp;#177; 3% accuracy for the NCV47701. Both new LDO voltage regulator ICs have a junction operating temperature range of -40 &amp;#8304;C to +150 &amp;#8304;C, that matches or exceeds the specifications stipulated by the automoitive industry. &lt;/p&gt;&lt;p&gt;
&amp;#8220;These feature-packed LDOs are differentiated from alternative market offerings by integrated current sensing functionality and an array of protection mechanisms,&amp;#8221; said Jim Alvernaz, director of the Automotive product division at ON Semiconductor &amp;#8220;The devices enable electronic design engineers to implement power management subsystem diagnostics, without the employment of a discrete current measurement circuit or additional protection components. This leads to improved power regulation in the audio/infotainment systems, instrumentation clusters and navigation systems found in modern vehicles.&amp;#8221; &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Packaging and Pricing&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
The NCV47700 is offered in a SOIC&amp;#8760; package and priced at $0.72 per unit in 2500 unit quantities, while the NCV47701 is offered in SOIC&amp;#8760; package and priced at $0.77 per unit in 2500 unit quantities.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About ON Semiconductor&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
ON Semiconductor (Nasdaq: ONNN) is a premier supplier of high performance silicon solutions for energy efficient electronics. The company's broad portfolio of power and signal management, logic, discrete and custom devices helps customers efficiently solve their design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power applications. ON Semiconductor operates a world-class, value-added supply chain and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit &lt;a rel="nofollow" target="_blank" href="http://www.onsemi.com"&gt;www.onsemi.com&lt;/a&gt;.&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/CC-_G8BVnrFgtePTAOr4-S5hjjw/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/CC-_G8BVnrFgtePTAOr4-S5hjjw/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ynMqc6kaps0:yjZkjef_Jh8:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ynMqc6kaps0:yjZkjef_Jh8:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=ynMqc6kaps0:yjZkjef_Jh8:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ynMqc6kaps0:yjZkjef_Jh8:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=ynMqc6kaps0:yjZkjef_Jh8:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ynMqc6kaps0:yjZkjef_Jh8:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ynMqc6kaps0:yjZkjef_Jh8:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ynMqc6kaps0:yjZkjef_Jh8:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=ynMqc6kaps0:yjZkjef_Jh8:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ynMqc6kaps0:yjZkjef_Jh8:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/ynMqc6kaps0" height="1" width="1"/&gt;</description>
         <author>ON Semiconductor</author>
         <guid isPermaLink="false">http://www.dsp-fpga.com/news/db/?31290</guid>
         <pubDate>Wed, 22 Feb 2012 16:15:41 +0000</pubDate>
      <feedburner:origLink>http://www.dsp-fpga.com/news/db/?31290</feedburner:origLink></item>
      <item>
         <title>Sealevel Introduces High-Speed 4-Port USB 2.0 Hub with Battery Charging Downstream Port</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/quHqlfg0Las/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;Sealevel&amp;#8217;s HUB4PH is a powered USB 2.0 4-port hub that is perfect for adding high-speed USB ports to industrial computing platforms. The hub is USB 2.0 compliant, providing a full 480M bps data rate to the host, and is backwards compatible with USB 1.1 and 1.0 devices.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
As USB charging has gained popularity, the 500mA minimum found on other USB 2.0 hubs has become insufficient for devices requiring higher charging rates. The HUB4PH ships with Port 1 configured as a Charging Downstream Port (CDP) capable of supplying up to 1.5A of current to the downstream device. CDP is USB Battery Charging Specification BC1.2 Compliant, perfect for charging batteries or powering high-current USB peripherals.&lt;/p&gt;&lt;p&gt;
The remaining three ports are configured as Standard Downstream Ports (SDP) capable of supplying up to 500mA of current to the downstream device. The included power supply outputs 5VDC @ 4A and has a locking DC connector to prevent accidental removal of the power cable.&lt;/p&gt;&lt;p&gt;
The HUB4PH integrates Sealevel&amp;#8217;s SeaLATCH USB ports, which are fully compatible with standard USB cables. When used with the included USB cable with a SeaLATCH USB type B connector, the metal thumbscrew provides a secure connection to the device and prevents accidental cable disconnection. The hub's four SeaLATCH USB Type A connectors can secure downstream USB peripherals to the hub in the same way.&lt;/p&gt;&lt;p&gt;
The HUB4PH is also available in a board only (HUB4PH-OEM) version and an iPorthole design (HUB4PH-KT) suitable for mounting in customer applications.&lt;/p&gt;&lt;p&gt;
Supported in Windows, Linux, and other USB aware operating systems, the hub requires no separate drivers and is easy to install. Simply provide power to the hub using the included power supply, plug the hub into an available USB port with the included cable, and the hub is automatically recognized. Standard operating temperature range is 0&amp;#8304;C to 70&amp;#8304;C and extended temperature range (-40&amp;#8304;C to +85&amp;#8304;C) is available. All products are in-stock and pricing begins at $159.00. &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Sealevel Systems, Inc.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Sealevel Systems, Inc., founded in 1986, provides industrial computing solutions in addition to a variety of communications and I/O products including PCI Bus cards, Ethernet serial servers, USB serial adapters, PCMCIA cards, and PC/104 modules. The product line includes multi-port RS-232, RS-422/485, RS-232/422/485 multi-interface high-speed sync/async, and digital/relay I/O. For more information, visit &lt;a rel="nofollow" target="_blank" href="http://www.sealevel.com"&gt;www.sealevel.com&lt;/a&gt; or call +1 864-843-4343.&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/gu7G-xgmt_nKrg0tsFx4SfAVNBo/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/gu7G-xgmt_nKrg0tsFx4SfAVNBo/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=quHqlfg0Las:CnJ5gb8goe4:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=quHqlfg0Las:CnJ5gb8goe4:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=quHqlfg0Las:CnJ5gb8goe4:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=quHqlfg0Las:CnJ5gb8goe4:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=quHqlfg0Las:CnJ5gb8goe4:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=quHqlfg0Las:CnJ5gb8goe4:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=quHqlfg0Las:CnJ5gb8goe4:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=quHqlfg0Las:CnJ5gb8goe4:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=quHqlfg0Las:CnJ5gb8goe4:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=quHqlfg0Las:CnJ5gb8goe4:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/quHqlfg0Las" height="1" width="1"/&gt;</description>
         <author>Sealevel Systems, Inc.</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31289</guid>
         <pubDate>Wed, 22 Feb 2012 16:00:02 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31289</feedburner:origLink></item>
      <item>
         <title>Automated online generation of test plans for wireless products - with Interlab LIVE</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/L8v84jlNXCE/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;So far, test plan generation for wireless products has been time-consuming, know-how intensive and prone to error, especially if the product in questions supports a multitude of features, or if the technology is new or test requirements change frequently. &lt;/p&gt;&lt;p&gt;
This is about to change with InterLab LIVE: Users can now create and download up-to-date test plan packages that are specially geared to the features of their product, within less than an hour and on a pay-per-use basis. The test plan packages are created fully automatically via the easy-to-follow InterLab guide. Correctness of the test plans is ensured by 7Layers&amp;#8217; know-how, experience and scope of accreditations. InterLab LIVE test plans are always structured in the same way. This enables users to streamline the test process and provides a valuable benefit for example when comparing several product variations.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;The comprehensive test plan packages include&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;- applicable test specifications&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;- mandatory test cases and tests&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;- optional test cases and tests&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;- overview of matching test systems&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;
InterLab LIVE has been set up as an easily extendable web-platform that allows other parties specializing in wireless standards and regulations to participate. By feeding the system with further technology information, the scope of available test plans and downloadable documents etc. can be continuously enlarged. This will make InterLab LIVE even more valuable for all users concerned with wireless communications. Organizations interested in participating are invited to contact info@interlab-live.com&lt;/p&gt;&lt;p&gt;
Currently InterLab LIVE features combined and stand-alone test plan packages for GCF, PTCRB and for LTE (based on 3GPP), with further test plan packages under development. Make a point of keeping an eye on InterLab LIVE at &lt;a rel="nofollow" target="_blank" href="http://www.interlab-live.com"&gt;www.interlab-live.com&lt;/a&gt;, and watch its continuous growth and diversification.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About 7Layers&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
7Layers, an international group of test &amp; service centers, supports industries using wireless technologies such as LTE, GSM family, GPS, TETRA, W-LAN, Bluetooth etc. End product manufacturers, component manufacturers, network operators and technology associations benefit from working with 7Layers. 7Layers runs accredited Test Houses in USA, Germany, China, Korea and Japan offering conformance and interoperability testing, certification and global type approval. The 7Layers&amp;#8217; Systems House offers product development and integration support, development of test specifications and test cases, as well as InterLab test solutions and test management systems. The 7Layers&amp;#8217; Software House provides the InterLab Software System, for the systematic verification &amp; validation of complex high-tech products. &lt;/p&gt;&lt;p&gt;
More information at www.7Layers.com and &lt;a rel="nofollow" target="_blank" href="http://www.interlab-live.com.PR"&gt;www.interlab-live.com.PR&lt;/a&gt; contact for 7Layers: Brigitte.Lewis@7Layers.com or contact: 7Layers AG, Borsigstrasse 11, 40880 Ratingen, Germany&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/r_QVKUBYfWOmw1Eab4kbac_HbnU/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/r_QVKUBYfWOmw1Eab4kbac_HbnU/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L8v84jlNXCE:u7Le0x-p2gc:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L8v84jlNXCE:u7Le0x-p2gc:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=L8v84jlNXCE:u7Le0x-p2gc:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L8v84jlNXCE:u7Le0x-p2gc:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=L8v84jlNXCE:u7Le0x-p2gc:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L8v84jlNXCE:u7Le0x-p2gc:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L8v84jlNXCE:u7Le0x-p2gc:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L8v84jlNXCE:u7Le0x-p2gc:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=L8v84jlNXCE:u7Le0x-p2gc:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L8v84jlNXCE:u7Le0x-p2gc:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/L8v84jlNXCE" height="1" width="1"/&gt;</description>
         <author>7Layers</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31287</guid>
         <pubDate>Wed, 22 Feb 2012 14:31:53 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31287</feedburner:origLink></item>
      <item>
         <title>Acrosser Technology in Vehicle Computers Power the Operation Efficiency of a Huge Fleet</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/YBJIwbabjjY/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
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				&lt;a rel="nofollow" id="news_image_2" target="_blank" href="http://i.opensystemsmedia.com/?bg=ffffff&amp;q=90&amp;w=871&amp;f=jpg&amp;src=http%3A%2F%2Fosmnewsphotos.s3.amazonaws.com%2F4f448f32c44a6%2Far-v5403fl.-...c..1.jpg" title=""&gt;
					&lt;img id="image2" alt="" align="right" border="0" width='210' title="Click to zoom" src="http://i.opensystemsmedia.com/?bg=ffffff&amp;fltr[0]=usm|40|4&amp;q=93&amp;w=210&amp;src=http%3A%2F%2Fosmnewsphotos.s3.amazonaws.com%2F4f448f32c44a6%2Far-v5403fl.-...c..1.jpg"/&gt;
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;A giant telecommunication carrier company in USA selects Acrosser Technology, the leading in vehicle computer designer and manufacturer, AR-V5403 Core 2 Duo in vehicle computers as the hardware platform to install in their 40 thousands service trucks. This project integrated the RF ID reader, OBD2 terminal, sensors and hand held terminals to improve the operation efficiency of the huge fleet.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The AR-V5403 in vehicle computer collects real time data from RF ID reader, OBD2, sensors, GPS and held data terminal. The processed data are connected directly to cloud server through build in 3.5G module. Drivers are able to receive real time dispatching information from the server.&lt;/p&gt;&lt;p&gt;
The customer thanks the powerful computing technology which enables continuously adding new functions to this in vehicle computer in the future without worrying lack of computing power.&lt;/p&gt;&lt;p&gt;
Acrosser Technology provides a complete scalable line of in vehicle computers ranges from Intel Atom E640, D525, Core 2 Duo up to Core i5 and i7. In addition to standard industrial PC I/O interfaces such as VGA/DVI, Ethernet, USB, WiFi, Bluetooth and RS-232/485, these ruggedized in vehicle computers also feature intelligent in vehicle power management, CAN bus, Digital I/O, i-Button(One Wire), GPS and 3.5G wireless. To meet the harsh power environment in the vehicles, Acrosser&amp;#8217;s in vehicle computers power subsystem are all protected by over-voltage, over-current and surge protection which make them comply with E-Mark and ISO-7637 in-vehicle power standard. All these features make Acrosser&amp;#8217;s in vehicle computer the most suitable platform for all kind of vehicles such as Taxi, cab, truck, bus and heavy duty vehicles.&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/VWpmwhIi6zT8vpmEzSdnSfA59AE/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/VWpmwhIi6zT8vpmEzSdnSfA59AE/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=YBJIwbabjjY:0r0NBvQ6scQ:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=YBJIwbabjjY:0r0NBvQ6scQ:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=YBJIwbabjjY:0r0NBvQ6scQ:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=YBJIwbabjjY:0r0NBvQ6scQ:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=YBJIwbabjjY:0r0NBvQ6scQ:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=YBJIwbabjjY:0r0NBvQ6scQ:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=YBJIwbabjjY:0r0NBvQ6scQ:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=YBJIwbabjjY:0r0NBvQ6scQ:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=YBJIwbabjjY:0r0NBvQ6scQ:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=YBJIwbabjjY:0r0NBvQ6scQ:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/YBJIwbabjjY" height="1" width="1"/&gt;</description>
         <author>Acrosser</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31277</guid>
         <pubDate>Wed, 22 Feb 2012 06:43:41 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31277</feedburner:origLink></item>
      <item>
         <title>yaSSL Offers New Open-Source Security Tools</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/Xe3fGuav3Nw/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;San Francisco, CA &amp;#8213; February 21, 2011 &amp;#8213; yaSSL, the open-source, embedded SSL provider, has made IT-level security tools available for the Open Source Community, ensuring that mature, advanced security tools like Kerberos, wpa_supplicant, and OpenSSH are readily available for devices. By making security services commonly used for enterprise authentication and encryption available for Android and other device platforms, yaSSL enables developers to simplify and secure device connectivity and to close the door on hackers trying to break through Internet security using the backdoor of a device, such as a router, smartphone, printer, or game console. &lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
&amp;#8220;Our homes and businesses depend on network-connected devices,&amp;#8221; noted Larry Stefonic, Founder of yaSSL. &amp;#8220;The need for secure, authenticated exchange, whether for a gaming console or an Android smartphone, has become essential. We understood the pain developers had creating their own security solution or kludging tools together that were then slow and took too much memory. We&amp;#8217;ve reduced that stress by providing the resources needed to protect and secure both the network and the device.&amp;#8221; &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;yaSSL&amp;#8217;s commitment to the Open-Source Community has sparked a number of efforts:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Kerberos to Android&amp;#8213;yaSSL ported Kerberos and a Java interface for the Generic Security Services API (GSSAPI) to enable development for the Android platform with the same secure, mutually authenticated and encrypted communication that&amp;#8217;s the de facto standard used by Microsoft, Google, Apple and Linux on enterprise and desktop computers. To provide an easy entry point for Android developers interested in Kerberos, yaSSL created a sample Android NDK application that wraps the functionality of kinit, klist, kvno, kdestroy, and Java GSSAPI client into a simple GUI front-end. With these capabilities in place, developers know their applications prevent eavesdropping and replay attacks. yaSSL also embedded CyaSSL&amp;#8217;s cryptography library CTaoCrypt in Kerberos to deliver very fast cryto implementations that are 20 times smaller and use less memory than the standard OpenSSL. &lt;/p&gt;&lt;p&gt;
OpenSSH for embedded RTOSs&amp;#8212;Used for secure remote access, OpenSSH encrypts passwords, sessions, and data for common UNIX and desktop environments, but is far too big and slow for the typical device. By using CyaSSL to do the heavy cryptography for OpenSSH, yaSSL introduces OpenSSH secure access tools that are smaller, faster and more portable. With very fast stream ciphers (e.g., RABBIT and HC-128) and public key support (e.g., NTRU), CyaSSL enables secure remote access for any CyaSSL-supported RTOS environments, including embedded Linux, iOS, QNX, VxWorks, and others. With an already integrated OpenSSH/CyaSSL solution, developers gain secure file copy and remote access to embedded devices without writing their own or kludging different solutions together, greatly decreasing time to market. CyaSSL&amp;#8217;s crypto libraries are simply implemented via a build option. &lt;/p&gt;&lt;p&gt;
Wi-Fi Protected Access (WPA) for devices&amp;#8212;wpa_supplicant, a WPA and WPA2 client for 802.11i, offers a secure, out-of-the-box wireless LAN for Linux, BSD, Mac OS X, and Windows. wpa_supplicant&amp;#8217;s small code size and clean design make it ideal for secure key negotiations that control the wireless connection of embedded devices. Integration with CyaSSL takes support a step further by securing the Internet connection and adding very fast cipher suites, such as TLS_RSA_WITH_128_CBC_SHA and TLS_NTRU_RSA_WITH_AES_128_CBC_SHA that are not part of the default installation. With support for embedded Linux, iOS, Android, QNX, VxWorks, and other RTOSs, CyaSSL significantly reduces both development time and cost and eliminates the need for developers to write, purchase, or patch their own solution.&lt;/p&gt;&lt;p&gt;
&amp;#8220;Lean, fast, and portable embedded application security is critical in this environment of ever-growing connectivity,&amp;#8221; said Stefonic. &amp;#8220;By bringing such widely adopted standards as Kerberos, OpenSSH, and wpa_supplicant to developers, yaSSL gives developers the resources they need to easily integrate their applications with the larger enterprise infrastructure and market. We appreciate being able to give back to the Open Source Community in this way and look forward to the development opportunities this added security will bring.&amp;#8221; &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About yaSSL&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Founded in 2004, yaSSL offers open-source, embedded security solutions that are fast, small, portable and standards-compliant, including: CyaSSL, the C-language SSL library for embedded and RTOS environments; yaSSL, the embedded C++ SSL library; and yaSSL embedded web server, a fast, embeddable, secure web server. Dual-licensed, yaSSL caters to the security applications in industrial automation, smart energy, surveillance, medical, military, and telecommunications markets as well as the open-source community. yaSSL is headquartered in Bozeman, Montana, and employs a worldwide distributor network. For more information about yaSSL solutions, please visit the company&amp;#8217;s Web site at &lt;a rel="nofollow" target="_blank" href="http://www.yassl.com"&gt;www.yassl.com&lt;/a&gt;, call +1 206 369 4800, or e-mail info@yassl.com.&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/i5XFCnhhjlHUsNZYUWpaZU3uvyk/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/i5XFCnhhjlHUsNZYUWpaZU3uvyk/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/Xe3fGuav3Nw" height="1" width="1"/&gt;</description>
         <author>yaSSL</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31264</guid>
         <pubDate>Tue, 21 Feb 2012 16:38:05 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31264</feedburner:origLink></item>
      <item>
         <title>Aeroflex Announces New Automated Tests and Alignment for MOTOTRBO(tm) Radios</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/PnvXSrGddag/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;WICHITA, Kan. &amp;#8212;February 20, 2012&amp;#8212;Aeroflex Incorporated, a wholly owned subsidiary of Aeroflex Holding Corp. (NYSE:ARX), announced today automated test and alignment capabilities for MOTOTRBO portable radios on the Aeroflex 3920 Digital Radio Test Set. &lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The Aeroflex Automated Test and Alignment procedure provides fully automated test and alignment of MOTOTRBO portable radios without the need for user interaction. This test system ensures consistent and reliable tests and alignment to manufacturer-recommended specifications and to industry standards, ensuring proper interoperability and a uniform standard of performance within the radio&amp;#8217;s network technology.&lt;/p&gt;&lt;p&gt;
&amp;#8220;Aeroflex is pleased to have the opportunity to provide this unique test technology for Motorola Solutions MOTOTRBO portable radios,&amp;#8221; said Rob Barden, Director of Product Marketing, Aeroflex. &amp;#8220;The 3920 provides an advanced method for repeatable and highly accurate test and alignment for MOTOTRBO portable radios that requires minimal technical interface. Since the 3920 provides fully automated tests and alignment processes, Motorola dealers and end users can now utilize their technical resources to provide higher value services.&amp;#8221;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Availability&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
 Delivery for the Motorola MOTOTRBO Auto-Test II Option is expected in four weeks. The Aeroflex 3920 has a delivery time of 8 weeks upon receipt of order. For more information, contact your local Aeroflex sales office by visiting or calling Aeroflex Sales at (800) 835-2352 or info-test@aeroflex.com.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Aeroflex&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Aeroflex Incorporated is a leading global provider of high performance microelectronic components and test and measurement equipment used by companies in the space, avionics, defense, commercial wireless communications, medical and other markets.&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/PnvXSrGddag" height="1" width="1"/&gt;</description>
         <author>Aeroflex</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31261</guid>
         <pubDate>Tue, 21 Feb 2012 16:32:11 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31261</feedburner:origLink></item>
      <item>
         <title>Honeywell launches new RTY hall effect sensor for harsh industrial &amp; transport applications</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/frl-AmIRXe0/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;MINNEAPOLIS, February 21, 2012 &amp;#8211; Honeywell (NYSE:HON) today introduces its RTY Series Hall-Effect Rotary Position Sensors that provide a cost-effective rotary position sensor solution with a variety of options (e.g., sensing range, pinout, voltage) that allow customers to customize the sensor configuration to meet their specific application needs, especially those in harsh environments.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
&amp;#8220;Design engineers need an absolute position sensing solution that meets their specifications without being over-engineered,&amp;#8221; said Chris Gottlieb, senior global product marketing manager for Honeywell Sensing and Control. &amp;#8220;The cost-effective, configurable RTY Series is an ideal solution. Design engineers will appreciate the sensor&amp;#8217;s industry-leading 12 million cycle product life and eight operating ranges, up to 360&amp;#176;, that often allow OEMs the range of travel needed for the application.&amp;#8221; &lt;/p&gt;&lt;p&gt;
The RTY Series&amp;#8217; solid-state Hall-effect technology provides non-contact operation and low torque actuation which reduces worn-out mechanisms and provides a minimum 12M cycle product life. The sensor&amp;#8217;s IP67-sealed package has an integral connector. The integrated reverse polarity protection provides protection against installation errors. Robustness against electromagnetic interference is proven out by automotive-grade EMI/EMC testing. Industry-standard AMP termination, 32 mm mounting pitch, North American and European pinout styles, and the compact package provide easier drop-in replacement in existing applications.&lt;/p&gt;&lt;p&gt;
The RTY Series uses a magnetically biased, Hall-effect integrated circuit (IC) to sense rotary movement of the actuator shaft over a set operating range. Rotation of the actuator shaft changes a magnet&amp;#8217;s position relative to the IC. The resulting flux density change is converted to a linear output. The IC, together with conditioning and protection circuitry, and the permanent magnet, is sealed in an IP67-qualified package for durability in most harsh environments.&lt;/p&gt;&lt;p&gt;
Eight operating ranges (50&amp;#176;, 60&amp;#176;, 70&amp;#176;, 90&amp;#176;, 120&amp;#176;, 180&amp;#176;, 270&amp;#176;, and 360&amp;#176;) are tolerant to over-travel and allow OEMs to choose the range of travel needed for their specific application. Low voltage and high voltage versions cover an input voltage range of 4.5 Vdc to 30 Vdc. Most applications require no lever, and no brackets are necessary.&lt;/p&gt;&lt;p&gt;
Potential transportation applications for the RTY Series sensor include position and movement detection of pedals, throttles, gear shift, levers, steering, linkages, and hitches (trucks, buses, off-road vehicles, industrial/construction/agricultural vehicles and equipment, cranes), suspension displacement/kneeling (buses, trucks), and tilt/trim position (boat engines, tilling equipment).&lt;/p&gt;&lt;p&gt;
Potential industrial applications for the RTY Series sensor include valve and HVAC damper control, and irrigation pivot control.&lt;/p&gt;&lt;p&gt;
Get more information on this product - &lt;a rel="nofollow" target="_blank" href="http://sensing.honeywell.com/rty%20series%20rotary%20position%20sensor"&gt;sensing.honeywell.com/rty%20series%20rotary%20p[...]&lt;/a&gt;&lt;/p&gt;&lt;p&gt;
Download the high resolution image - &lt;a rel="nofollow" target="_blank" href="http://sensing.honeywell.com/multimedia/S_C_Website/pressreleases/photos/2012/RTY%20Series_300dpi.jpg"&gt;sensing.honeywell.com/multimedia/S_C_Website/pr[...]&lt;/a&gt;&lt;/p&gt;&lt;p&gt;
Learn more about Honeywell Sensing and Control - &lt;a rel="nofollow" target="_blank" href="http://sensing.honeywell.com/"&gt;sensing.honeywell.com/&lt;/a&gt;&lt;/p&gt;&lt;p&gt;
Honeywell International (&lt;a rel="nofollow" target="_blank" href="http://www.honeywell.com"&gt;www.honeywell.com&lt;/a&gt;) is a Fortune 100 diversified technology and manufacturing leader, serving customers worldwide with aerospace products and services; control technologies for buildings, homes and industry; automotive products; turbochargers; and specialty materials. Based in Morris Township, N.J., Honeywell&amp;#8217;s shares are traded on the New York, London, and Chicago Stock Exchanges. For more news and information on Honeywell, please visit &lt;a rel="nofollow" target="_blank" href="http://www.honeywellnow.com"&gt;www.honeywellnow.com&lt;/a&gt;. &lt;/p&gt;&lt;p&gt;
This release contains &amp;#8220;forward-looking statements&amp;#8221; within the meaning of Section 21E of the Securities Exchange Act of 1934. All statements, other than statements of fact, that address activities, events or developments that we or our management intend, expect, project, believe or anticipate will or may occur in the future are forward-looking statements. Forward-looking statements are based on management&amp;#8217;s assumptions and assessments in light of past experience and trends, current conditions, expected future developments and other relevant factors. They are not guarantees of future performance, and actual results, developments and business decisions may differ from those envisaged by our forward-looking statements. Our forward-looking statements are also subject to risks and uncertainties, which can affect our performance in both the near- and long-term. We identify the principal risks and uncertainties that affect our performance in our Form 10-K and other filings with the Securities and Exchange Commission.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Contact:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Mark Shapiro&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;SRS Tech PR&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;(619) 249-7742&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;mshapiro@srs-techpr.com&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Contact:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Robyn Seykora&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Honeywell Sensing and Control&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;(763) 954-5378&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;robyn.seykora@honeywell.com&lt;/h3&gt;&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/frl-AmIRXe0" height="1" width="1"/&gt;</description>
         <author>Honeywell Sesning &amp; Control</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31257</guid>
         <pubDate>Tue, 21 Feb 2012 15:53:49 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31257</feedburner:origLink></item>
      <item>
         <title>Onano Touts Embedded Electronic Connector Technology</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/CvV3wpLxJJw/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;Onanon, a leader in the highly automated design and manufacture of custom electronic connectors, announces the availability of its embedded electronics connector technology to all OEM application markets. &lt;/p&gt;&lt;p&gt;
Onanon's unique "breadboard" automated manufacturing methods have cost effectively produced connectors with low-profile integrated devices in applications as diverse as medical devices and military avionics, giving engineers the power to design greater functionality than ever before into connectors.&lt;/p&gt;&lt;p&gt;
Onanon draws upon its expertise in advanced PC board and mass production IC placement techniques. Onanon first introduced the use of PC boards as connector pin substrates 32 years ago. The company has been building electronic circuits into connectors for most of its 32 years in business. &lt;/p&gt;&lt;p&gt;
Beginning with terminating resistors, more complex circuits followed. Operational amplifiers were introduced to boost signal strength or to lower impedance to reduce or eliminate EMI and RFI. Low level, high impedance signals distorted by electrical noise can be converted to high level, low impedance signals by placing op-amps on the connector substrate. &lt;/p&gt;&lt;p&gt;
Connector embedded op-amps can be used to convert differential signals to single ended signals. The small currents needed to read a thermistor, for example, can then be introduced by the connector&amp;#8217;s circuitry.&lt;/p&gt;&lt;p&gt;
A processor with associated analog and digital circuits with an analog-to-digital converter integrated into the connector plug can greatly reduce the number of connector pins needed to bring all the signals to the outside world. When the output is fully digitally multiplexed, the number of signal output pins can be just one (with common). The number of signal input pins can be also just one to carry back commands to the processor.&lt;/p&gt;&lt;p&gt;
Today, Onanon is placing full-fledged computers between connector pins. This makes it possible for OEMs to embed value added, intelligent, micro-scale systems into their new connector designs, and dramatically enhances capabilities that engineers can introduce into products from the connector. Drop-in replacement connectors can include small circuit boards for tasks such as device ID, use-limiters, EEPROM functions and fine-tuning.&lt;/p&gt;&lt;p&gt;
"What&amp;#8217;s really important is that our rapid wire termination technology makes connecting wires to a PC board connector substrate as easy as making connections on the PC board connector substrate. It&amp;#8217;s done cheaply and quickly, with high quality by automatic machines,&amp;#8220; says Dennis Johnson, CEO of Onanon. &amp;#8220;The real beauty of our system is where the 'intelligent' part comes in. Future instruments will have intelligence built into their connectors. Upgrades will be in their replaceable connectors."&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Onanon Embedded Connectors Summary of Features:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; The power to integrate greater functionality than ever before into connectors.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; Designers can embed value added, intelligent, micro-scale systems into connectors.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; Dramatically enhances capabilities that engineers can introduce into products from the connector.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; Drop-in replacement connectors permit easy upgrading of electronic systems.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; High quality, cost effective automated manufacturing methods.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Applications&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Onanon embedded electronics connector technology is applicable to fields such as automotive, avionics, military and medical devices. Since the manufacture of these connectors is highly automated, they are high quality, cheap and disposable.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Pricing and Availability&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Onanon Embedded Connectors are available now, with JIT delivery. Contact Onanon for pricing information.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Onanon&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Onanon OEM connectors are globally competitive and American made. Onanon engineers work closely with customers to efficiently develop products that are high quality, cost effective and designed for manufacturing. Onanon is ISO 9001:2008 certified.&lt;/p&gt;&lt;p&gt;
Onanon engineering supports a wide range of custom requirements, and modifies its production to meet specific medical, automotive, industrial, aviation, military and commercial applications. Onanon quickly and inexpensively takes connector applications from design, prototyping and testing to production often in a matter of weeks. &lt;/p&gt;&lt;p&gt;
Contact Onanon for consultation on embedded electronics connector technology systems and applications. &lt;/p&gt;&lt;p&gt;
Phone 1-408-262-8990. Fax 1-408-262-2901. E-mail: sales@onanon.com. Website: &lt;a rel="nofollow" target="_blank" href="http://www.onanon.com"&gt;www.onanon.com&lt;/a&gt;. &lt;/p&gt;&lt;/span&gt;
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         <author>Onanon</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31256</guid>
         <pubDate>Tue, 21 Feb 2012 15:24:19 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31256</feedburner:origLink></item>
      <item>
         <title>TRW Automotive Selects VectorCAST Embedded Software Testing Solutions for ISO 26262 Compliance</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/dQ3naNqEDsg/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;Vector Software, the leading provider of dynamic software testing solutions for safety-critical embedded systems, announced today that TRW Automotive has selected VectorCAST for automated unit, integration, and regression testing on its Electric Park Brake (EPB) system.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
A world leader in automotive electronic braking systems, TRW Automotive (TRW) was first-to-market with its Electric Park Brake (EPB) on a mass production vehicle in 2001. Today, there are more than 15 million TRW EPB calipers on the world&amp;#8217;s roadways.&lt;/p&gt;&lt;p&gt;
"The TRW EPB is a state of the art park brake system with a huge amount of comfort- and safety-functions. Its technology goes well beyond the simple functionality of holding a vehicle in a parked position. We are able to provide this as a stand-alone solution or integrated, for example in an Electronic Stability Control System&amp;#8221;, stated Gundolf Schmidt, Chief Engineer EPB Software System Development, Germany.&lt;/p&gt;&lt;p&gt;
TRW engineers use VectorCAST/C++, VectorCAST/Manage, and VectorCAST/Cover to detect defects early in the development cycle and assure the highest level of software quality. The VectorCAST solution provides TRW&amp;#8217;s development team with the necessary tools and process support for compliance with ISO 26262.&lt;/p&gt;&lt;p&gt;
&amp;#8220;Competition in the automotive industry is becoming more and more challenging. Successful companies must constantly innovate and are continually introducing new features with greater complexity in embedded vehicle systems, such as electronic braking systems&amp;#8221;, stated William McCaffrey, Chief Operating Officer at Vector Software. &amp;#8220;Companies implementing the new ISO 26262 standard for functional safety in road vehicles will have a major advantage in the industry.&amp;#8221;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Vector Software, Inc.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Founded in 1989, Vector Software is the world&amp;#8217;s leading provider of innovative software testing solutions for safety and mission critical embedded applications. Vector Software&amp;#8217;s VectorCAST line of products, automate and manage the complex tasks associated with unit, integration, and system level testing. VectorCAST supports the C, C++, and Ada programming languages. Vector Software also offers support, training and consulting services to its customers worldwide. To learn more, visit Vector Software at &lt;a rel="nofollow" target="_blank" href="http://www.vectorcast.com"&gt;www.vectorcast.com&lt;/a&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;VectorCAST Product Family&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;VectorCAST/C++&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;VectorCAST/Ada&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;VectorCAST/RSP&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;VectorCAST/Cover&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
 VectorCAST/Manage&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;VectorCAST/Requirements Gateway&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
 Modified Condition / Decision Coverage (MC/DC) module&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;DO-178B, FDA, and IEC 61508 / ISO 26262 Qualification Packages&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
With 2010 sales of $14.4 billion, TRW Automotive ranks among the world's leading automotive suppliers. Headquartered in Livonia, Michigan, USA, the Company, through its subsidiaries, operates in 26 countries and employs over 60,000 people worldwide. TRW Automotive products include integrated vehicle control and driver assist systems, braking systems, steering systems, suspension systems, occupant safety systems (seat belts and airbags), electronics, engine components, fastening systems and aftermarket replacement parts and services. All references to "TRW Automotive", "TRW" or the "Company" in this press release refer to TRW Automotive Holdings Corp. and its subsidiaries, unless otherwise indicated. TRW Automotive news is available on the internet at &lt;a rel="nofollow" target="_blank" href="http://www.trw.com"&gt;www.trw.com&lt;/a&gt;.&lt;/p&gt;&lt;/span&gt;
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         <author>Vector Software</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31253</guid>
         <pubDate>Tue, 21 Feb 2012 13:32:54 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31253</feedburner:origLink></item>
      <item>
         <title>Cortus announces Processor IP Roadmap for Embedded System on Chip (SoC) Applications</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/zrwbIK474po/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;Montpellier, France 21st February, 2012. Cortus S.A., a technology leader in ultra low power, silicon efficient 32-bit processor IP, announces its plan to launch three new microcontroller IP cores as part of its processor roadmap. The new cores share common technology with the highly efficient APS3 core but address complementary market segments. The three new cores will be released over the coming six months.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
With the use of sensor, control systems and connectivity technology becoming ubiquitous it is essential that integrated circuits for embedded applications combine adequate processing power, low energy usage and minimal silicon area. The Cortus APS3 has, since entering volume production in 2008, delivered industry-leading performance in terms of DMIPS/mW and DMIPS/mm2.&lt;/p&gt;&lt;p&gt;
Michael Chapman, CEO Cortus, says &amp;#8220;Although APS3 has been very successful in low power embedded applications such as SIM cards, Bluetooth LE, smart meters, encryption/decryption and touchscreen controllers, customers have been asking for a wider range of performance and complexity options&amp;#8221;. He adds, &amp;#8220;by mid 2012, Cortus will be able to supply microcontroller cores for applications ranging from high throughput floating point control systems down to programmable finite state machines as well as everything in between&amp;#8221;.&lt;/p&gt;&lt;p&gt;
Under the microcontroller core roadmap, the highly efficient APS3 will be complemented by two new integer and one floating point processor cores. The APS5 will support more complex processor sub-systems requiring caches, co-processors and multi-core architectures. The FPS6 single precision floating point microcontroller core will combine high floating point throughput with a small silicon footprint and low power dissipation.&lt;/p&gt;&lt;p&gt;
For small microcontroller subsystems the Cortus will provide an entry-level 32-bit solution with the APS1 processor. This core, with a comparable silicon footprint to existing 8-bit cores such as 8051, will deliver greater computational performance and while dissipating much less power than 8-bit cores. APS1, like other Cortus processors, has been designed to be programmed with C or C++ without the need to use assembly code.&lt;/p&gt;&lt;p&gt;
All Cortus cores share a common technology base with a modern RISC architecture and native 32-bit performance. They all can use the fast, low latency APS bus with Cortus peripherals. Cortus supplies a GNU-based APS toolchain and an Eclipse-based IDE which supports the entire product family. Ports of FreeRTOS, OpenRTOS and Micrium uC/OSII are available for the processor product range.&lt;/p&gt;&lt;p&gt;
Cortus will be exhibiting from 28th February to 1st March on stand 5-143 at Embedded World 2012 in N&amp;#252;rnberg, Germany&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Cortus S.A.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Cortus S.A. is the cost/performance leader for 32 bit processor IP for embedded systems. Cortus cores are used in applications where one or more of small silicon footprint, low power consumption, good code density/small code memory size and high performance are important. &lt;a rel="nofollow" target="_blank" href="http://www.cortus.com"&gt;www.cortus.com&lt;/a&gt;&lt;/p&gt;&lt;/span&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=zrwbIK474po:E-MrIH-0u5c:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=zrwbIK474po:E-MrIH-0u5c:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=zrwbIK474po:E-MrIH-0u5c:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=zrwbIK474po:E-MrIH-0u5c:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=zrwbIK474po:E-MrIH-0u5c:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=zrwbIK474po:E-MrIH-0u5c:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=zrwbIK474po:E-MrIH-0u5c:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=zrwbIK474po:E-MrIH-0u5c:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=zrwbIK474po:E-MrIH-0u5c:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=zrwbIK474po:E-MrIH-0u5c:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/zrwbIK474po" height="1" width="1"/&gt;</description>
         <author>Cortus S.A.</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31249</guid>
         <pubDate>Tue, 21 Feb 2012 11:15:19 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31249</feedburner:origLink></item>
      <item>
         <title>Blue Chip Technology Ramps Up Computer Board Production</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/VVy_lYUMCuI/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;Chester, 18th Feb 2012 - UK computer board manufacturer Blue Chip Technology has reported an impressive end of year performance with over &amp;#163;2million in new projects alone, during 2011. The company has also expanded its manufacturing capability and recruited more expert production personnel, whilst also launching several new innovative products.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
Blue Chip Technology is one of Europe's leading designers and manufacturers of industrial and embedded computers. The company designs and manufactures computer boards for a broad range of industrial sectors such as automotive, public transportation, medical, defence and energy. Blue Chip Technology provides mission critical computer systems to engineering and media projects around the world. &lt;/p&gt;&lt;p&gt;
"Things are going very well for Blue Chip at this time," said Barry Husbands, Managing Director of Blue Chip Technology Ltd. "Indeed, we are already at our half-year target for 2012, which is quite remarkable. Existing customers have increased their orders, whilst our new ARM and Intel Atom based board designs are showing a lot of future potential. "&lt;/p&gt;&lt;p&gt;
Blue Chip develop and manufacture a range of single board computers that are then sold to be integrated into equipment such as medical diagnostic equipment, automotive systems, public display systems, traffic control systems and test and measurement equipment. Many of Blue Chip's manufacturing customers export their systems worldwide. Based near Chester, the Blue Chip factory has an advanced automated manufacturing capability and extensive research and design resources.&lt;/p&gt;&lt;p&gt;
"During this past year we have invested in a new SMT pick and place machine, new Automated Optical Inspection equipment and more Surface Mount Technology feeders to accommodate the growth in demand for our products and ensure quality," said Barry Husbands. "What's more, this is organic growth, which will position us well for the next few years. We have a great team at Blue Chip and I'm very proud of what we are achieving."&lt;/p&gt;&lt;p&gt;
During 2011 Blue Chip was able successfully to undertake a major railway project, with an order value in excess of US$1.3million. In addition to this, the company successfully launched its 'RE2' and 'RM2' products; small, low power industrial computer boards based on smartphone technology. Orders for the new boards have already outstripped expectations. &lt;/p&gt;&lt;p&gt;
"The RE2 and RM2 represent a 'new generation' of industrial computer in many ways," said Barry. "The mobile phone industry has done an enormous amount of research to optimise the performance of microprocessors. We have basically industrialised this smart phone technology, resulting in a robust, small, low-power computer that delivers an outstanding performance, in terms of networking capability, display quality and computational power."&lt;/p&gt;&lt;p&gt;
Blue Chip remains optimistic that they will need to undertake a further expansion of production towards the end of this year. The company also has plans to set up distribution channels to enhance future overseas sales. &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Blue Chip Technology Ltd&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Blue Chip Technology Ltd is a European leader in the design and manufacture of industrial and embedded computer systems. Blue Chip Technology serves a wide range of industries, from mission critical systems for the global railway industry to digital signage systems and test and diagnostics equipment. It provides a range of standard products such as COM (ETX, XTX and COM Express) and rack mounted PC's but also manufactures high volumes of customer specific hardware. In addition to its technical capabilities, Blue Chip Technology has gained a reputation for being a trustworthy and co-operative supplier, working closely with its clients during development, and reliably delivering components and products to schedule. &lt;a rel="nofollow" target="_blank" href="http://www.bluechiptechnology.co.uk"&gt;www.bluechiptechnology.co.uk&lt;/a&gt;&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/AZI3tV0fwjSTlzE_vQA07xMQKYM/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/AZI3tV0fwjSTlzE_vQA07xMQKYM/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=VVy_lYUMCuI:hyj6KEPJsB0:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=VVy_lYUMCuI:hyj6KEPJsB0:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=VVy_lYUMCuI:hyj6KEPJsB0:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=VVy_lYUMCuI:hyj6KEPJsB0:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=VVy_lYUMCuI:hyj6KEPJsB0:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=VVy_lYUMCuI:hyj6KEPJsB0:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=VVy_lYUMCuI:hyj6KEPJsB0:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=VVy_lYUMCuI:hyj6KEPJsB0:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=VVy_lYUMCuI:hyj6KEPJsB0:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=VVy_lYUMCuI:hyj6KEPJsB0:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/VVy_lYUMCuI" height="1" width="1"/&gt;</description>
         <author>Blue Chip Technology Ltd</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31244</guid>
         <pubDate>Tue, 21 Feb 2012 10:14:24 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31244</feedburner:origLink></item>
      <item>
         <title>Enjoy the High Performance Display Hosted by ARBOR Mobile Tablet PC - G1056</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/DgQCMUnRqNQ/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;ARBOR Technology has released the latest semi-rugged tablet PC G1056, powered by AMD G series T56N dual-core processor, Radeon HD6320 graphics controller and 4GB DDR3 SDRAM. Featuring high performance and excellent graphic computing, the G1056 is perfect for multi-media application.&lt;/p&gt;&lt;p&gt;
ARBOR G1056 comes with 10.4&amp;#8221; AFFS+ TFT touch panel which supports both resistive and digitizer touch. It has great heat dissipation capability while reducing energy consumption. Additionally, two hot-swappable batteries provides up to 5 hours working time. Featuring 1.8kg weight, hand strap and slip-free grip design, the G1056 is easy to carry around and use.&lt;/p&gt;&lt;p&gt;
The G1056 can be applied in variety of applications e.g. logistics and warehousing management. It is also ideal for POS, multi-media entertainment and display device by its outstanding graphic performance. To engage with different application requirements, the G1056 provides both VGA port and Mini Displayport for HD TV display. &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;G1056 features:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#65294;Onboard high performance AMD APU G-T56N &amp; Radeon HD 6320 graphics controller&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#65294;Comes with 4GB of DDR3-1333 SDRAM system memory&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#65294;10.4&amp;#8221; AFFS+ TFT Active Matrix Panel&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#65294;Supporting resistive and digitizer touch&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#65294;Multi-connectivity: HSUPA, Wi-Fi, Ethernet and Bluetooth&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#65294;Data identification devices such as RFID and CMOS camera&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;
For further information, please visit ARBOR website: &lt;a rel="nofollow" target="_blank" href="http://www.arbor.com.tw"&gt;www.arbor.com.tw&lt;/a&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;________________________________________&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About ARBOR&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Since founded in 1993, ARBOR Tech. has been specializing in embedded computing and networking solutions to help realize the vision of &amp;#8220;Digital Enterprise &amp; Digital Life.&amp;#8221; We have been delivering numerous successful projects for our customers with outstanding results in terms of adopting advanced embedded design, severe test &amp; measurement and quick response to market changes. ARBOR provides a full fleet of embedded computing platforms from board to system, which let you cover the needs of networking communication, DVR surveillance, industrial control, process control, transportation control, POS &amp; Kiosk and Tablet PC.&lt;/p&gt;&lt;p&gt;
ARBOR is an ISO-9001 certified embedded &amp; networking manufacturer and commits to deliver high quality products with international standard and well-defined production process. Also, ARBOR was awarded the "Taiwan Symbol of Excellence Award" by its products, which verifies its efforts and commitment to embedded computing. As a member of the Intel&amp;#174; Embedded and Communications Alliance, ARBOR realizes your embedded computing vision with the most advanced Intel&amp;#174; embedded computing solutions. ARBOR has intensive operations across the world and deploys embedded computing solutions to every corner wherever you are.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Media Contact: marcom@arbor.com.tw&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Inquiry Contact: info@arbor.com.tw&lt;/h3&gt;&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/DgQCMUnRqNQ" height="1" width="1"/&gt;</description>
         <author>ARBOR Tech.</author>
         <guid isPermaLink="false">http://www.pc104online.com/news/db/?31243</guid>
         <pubDate>Tue, 21 Feb 2012 09:40:01 +0000</pubDate>
      <feedburner:origLink>http://www.pc104online.com/news/db/?31243</feedburner:origLink></item>
      <item>
         <title>NEC Develops Smartphone Solution that Automatically Recommends the Appropriate Path of Incoming Calls</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/UuKp_uLv0YE/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;Tokyo, Feb 20, 2012 - NEC Corp. announced today the development of smartphone software that automatically recommends the best path for a user's incoming calls based on the software's estimate of a smartphone's movement. This solution is scheduled to be commercially available by June 2012.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
This new solution collects and analyzes data from a user's smartphone, which enables the software to estimate, for example, if the user is moving within a train, at a walking speed or stationary. The software then automatically recommends the most appropriate path for incoming calls, such as a standard ring, voice message or email, based on the results of sensor data analysis.&lt;/p&gt;&lt;p&gt;
"In recent years, the spread of smartphones and mobile devices has made communication possible throughout a wide range of circumstances, including while at the workplace, at home and in transit. There are also an increasing number of communication methods for users to choose from, such as voicemail, email and SNS," said Keiko Matsunaga, Vice President and Senior General Manager of NEC Corporation. "A person's activity, whether they are driving, in a meeting or exercising, has a significant impact on the best way to take a call. NEC's new solution facilitates smoother, less intrusive communications by automatically recommending the most appropriate contact method."&lt;/p&gt;&lt;p&gt;
Looking forward, NEC will continue to develop and provide innovative software that improves the user friendliness of smartphones and mobile devices for a wide variety of users.&lt;/p&gt;&lt;p&gt;
NEC will introduce this solution at its stand 8A125, Hall 8 at Mobile World Congress 2012, the largest event of the mobile industry held in Barcelona, Spain, from February 27-March 1, 2012. For more information regarding NEC's activities at MWC 2012, please visit &lt;a rel="nofollow" target="_blank" href="http://www.nec.com/global/event/mwc/"&gt;www.nec.com/global/event/mwc/&lt;/a&gt;.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About NEC Corporation&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
NEC Corporation (TSE: 6701) is a leader in the integration of IT and network technologies that benefit businesses and people around the world. By providing a combination of products and solutions that cross utilize the company's experience and global resources, NEC's advanced technologies meet the complex and ever-changing needs of its customers. NEC brings more than 100 years of expertise in technological innovation to empower people, businesses and society. For more information, visit NEC at &lt;a rel="nofollow" target="_blank" href="http://www.nec.com"&gt;www.nec.com&lt;/a&gt;.&lt;/p&gt;&lt;/span&gt;
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         <author>NEC</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31231</guid>
         <pubDate>Mon, 20 Feb 2012 16:37:46 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31231</feedburner:origLink></item>
      <item>
         <title>PCI-SYSTEMS Inc., a leading supplier of conduction cooled VPX systems, announces a totally new design approach to VPX backplanes to deliver PCIe Gen2 and Gen3 speeds for any backplane topology.</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/dwPAwPi6Y8A/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;Sunnyvale, CA--- February 19, 2012 ---PCI-SYSTEMS Inc., a leading supplier of conduction cooled VPX systems, announces a totally new design approach to VPX backplanes to deliver PCIe Gen2 and Gen3 speeds for any backplane topology.&lt;/p&gt;&lt;p&gt;
The backplanes have a rear I/O cartridge type PCB assembly that allows easy customization of ANY backplanes with ANY Open VPX profiles in a fast and inexpensive manner.&lt;/p&gt;&lt;p&gt;
Switches and other hardware are placed on mezzanines allowing an extremely small Rear I/O assembly that can be exchanged extremely fast and is conduction cooled using wedgelocks that clamp the cartridge to the chassis walls.&lt;/p&gt;&lt;p&gt;
Since the backplane is passive, low layer counts are possible and all MESH or STAR topologies are moved to the rear I/O mezzanines. &lt;/p&gt;&lt;p&gt;
These backplane assemblies are used on all PCI SYSTEMS chassis including Vita73, Vita48 and Vita77 chassis.&lt;/p&gt;&lt;p&gt;
.&lt;/p&gt;&lt;p&gt;
 &amp;#8220;Backplanes with high speed data transfers on PCIe Gen 3 switch fabric in a STAR configuration offer the lowest latency by tightly coupling all PCIe devices to a common 100MHz reference clock,&amp;#8221; states Claus Gross, President of PCI Systems Inc., &amp;#8221;it allows SSC in data acquisition, and our backplanes and chassis are the smallest and fastest VPX systems currently on the market. Tightly controlled heat management and many other hardware features are implemented.&amp;#8221;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;The high speed Gen2/3 cartridge features:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	6 to 14 slots 3U VPX (any profile) plus Power supply slot&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	Modular Backplane, STAR configuration, bus analyzer integrated&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	PCIe Gen 3 "noStub" routing&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	GPS integrated&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	1Hz GPS clock available on each backplane slot&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	Temperature and Humidity sensor integrated&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	3 axis shock sensor and chassis management FPGA integrated&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	8/16 lanes per slot PCIe Gen3&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;An NDA with PCI Systems Inc is needed to receive full specification details.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
PCI-SYSTEMS Inc. develops and manufactures intelligent VPX Systems, cPCI, CPU and peripheral boards as well as advanced mechanical design solutions in the US and Germany for many platforms that provide precision control of robotic and automated equipment in the semiconductor, medical and industrial equipment markets as well as for ruggedized embedded OEM applications in airborne and defense applications.&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/dwPAwPi6Y8A" height="1" width="1"/&gt;</description>
         <author>PCI Systems Inc.</author>
         <guid isPermaLink="false">http://www.vmecritical.com/news/db/?31219</guid>
         <pubDate>Sun, 19 Feb 2012 16:18:01 +0000</pubDate>
      <feedburner:origLink>http://www.vmecritical.com/news/db/?31219</feedburner:origLink></item>
      <item>
         <title>PCI-Systems Inc. announces high density low weight CrossWind ATR chassis with multiple CPU boards and integrated 16 channel Ethernet switch</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/zep1UN_vIhk/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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					&lt;img id="image1" alt="" align="right" border="0" width='210' title="Click to zoom" src="http://i.opensystemsmedia.com/?bg=ffffff&amp;fltr[0]=usm|40|4&amp;q=93&amp;w=210&amp;src=http%3A%2F%2Fosmnewsphotos.s3.amazonaws.com%2F4f3feb3e25fc5%2Fzusammenbau_4.jpg"/&gt;
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;Sunnyvale, CA--- February 19, 2012 ---PCI-SYSTEMS Inc., a leading supplier of conduction cooled VPX systems, has been awarded by a prime contractor based in Hollywood, MD, to deliver high density, low weight CrossWind ATR chassis with multiple CPU boards and integrated 16 channel Ethernet switch.&lt;/p&gt;&lt;p&gt;
Based on the CrossWind cold plate and forced air cooled ATR chassis, the system uses a PCIe Gen2 bus structure with STAR topology. Intel based i7 boards and Freescale 4080 PowerPC boards are controlling MILbus, ARINC and serial I/O boards. A integrated 16 channel Gigabit Ethernet switch is connected to several slots and to the rear I/O on MIL connectors.&lt;/p&gt;&lt;p&gt;
&amp;#8220;High speed data transfers on PCIe Gen 2 and Gen 3 switch fabric in a STAR configuration offer the lowest latency by tightly coupling all PCIe devices to a common 100MHz reference clock,&amp;#8221; states Claus Gross, President of PCI Systems Inc.,&amp;#8221;it allows CPU and peripheral boards to communicate with the fastest data rate&amp;#8221;.&lt;/p&gt;&lt;p&gt;
The leightweight 3U VPX chassis are used in demonstrating automated aircraft carrier landings with F18 fighter aircraft. &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;The high density, low weight CrossWind ATR chassis system features:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	6 slots 3U VPX plus Power supply slot&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	I7 Intel based CPU and Freescale 4080 CPU boards&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	Modular Backplane, STAR configuration, bus analyzer integrated&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	PCIe Gen 2 "noStub" routing&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	GPS integrated&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	1Hz GPS clock available on each backplane slot&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	3 axis shock sensor and chassis management FPGA integrated&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	8/16 lanes per slot PCIe Gen2&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	12 redundant MILbus channels and 16 ARINC channels integrated&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;	16 channel Gigabit Ethernet switch including magnetic designed in.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;
PCI-SYSTEMS Inc. develops and manufactures intelligent VPX Systems, cPCI, CPU and peripheral boards as well as advanced mechanical design solutions in the US and Germany for many platforms that provide precision control of robotic and automated equipment in the semiconductor, medical and industrial equipment markets as well as for ruggedized embedded OEM applications in airborne and defense applications.&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/zep1UN_vIhk" height="1" width="1"/&gt;</description>
         <author>PCI Systems Inc.</author>
         <guid isPermaLink="false">http://www.mil-embedded.com/news/db/?31216</guid>
         <pubDate>Sat, 18 Feb 2012 16:18:01 +0000</pubDate>
      <feedburner:origLink>http://www.mil-embedded.com/news/db/?31216</feedburner:origLink></item>
      <item>
         <title>NEW 5200 MHz VCO FROM CRYSTEK CORPORATION</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/L_sUL6uEeBE/</link>
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;Fort Myers, FL &amp;#8211; February 17, 2012 &amp;#8211; Crystek's CVCO33BE-5200-5200 VCO (Voltage Controlled Oscillator) operates at 5200 MHz with a control voltage range 0.5V~4.5V. This VCO features a typical phase noise of -84 dBc/Hz @ 10KHz offset and has excellent linearity. Output power is typically +3 dBm.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
Engineered and manufactured in the USA, the model CVCO33BE-5200-5200 is packaged in the industry-standard 0.5-in. x 0.5-in. SMD package. Input voltage is 5V, with a max. current consumption of 26 mA. Pulling and Pushing are minimized to 6.0 MHz and 3.0 MHz/V, respectively. Second harmonic suppression is -20 dBc typical. &lt;/p&gt;&lt;p&gt;
The CVCO33BE-5200-5200 is ideal for use in applications such as digital radio equipment, fixed wireless access, satellite communications systems, and base stations.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;For pricing details, contact Crystek Corporation.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Family datasheets are available for download at &lt;a rel="nofollow" target="_blank" href="http://www.crystek.com"&gt;www.crystek.com&lt;/a&gt;.&lt;/p&gt;&lt;p&gt;
Editor&amp;#8217;s note: Crystek Corporation&amp;#174; has been providing frequency products since 1958, including quartz crystals, XOs (clock oscillators), TCXOs (temperature compensated oscillators), VCOs (voltage controlled oscillators), and VCXOs (voltage controlled crystal oscillators). Crystek operates two divisions dedicated to frequency control. Crystek Crystal is dedicated to the development and manufacture of frequency products using quartz-based resonators. Crystek Microwave develops of frequency control and support products for the microwave industry. &lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/IE3cNQze9J48xhQbA7fQZswVlFY/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/IE3cNQze9J48xhQbA7fQZswVlFY/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L_sUL6uEeBE:pe_9GBkCCYs:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L_sUL6uEeBE:pe_9GBkCCYs:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=L_sUL6uEeBE:pe_9GBkCCYs:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L_sUL6uEeBE:pe_9GBkCCYs:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=L_sUL6uEeBE:pe_9GBkCCYs:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L_sUL6uEeBE:pe_9GBkCCYs:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L_sUL6uEeBE:pe_9GBkCCYs:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L_sUL6uEeBE:pe_9GBkCCYs:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=L_sUL6uEeBE:pe_9GBkCCYs:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=L_sUL6uEeBE:pe_9GBkCCYs:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/L_sUL6uEeBE" height="1" width="1"/&gt;</description>
         <author>Macrovision, Inc.</author>
         <guid isPermaLink="false">http://www.mil-embedded.com/news/db/?31202</guid>
         <pubDate>Fri, 17 Feb 2012 18:53:24 +0000</pubDate>
      <feedburner:origLink>http://www.mil-embedded.com/news/db/?31202</feedburner:origLink></item>
      <item>
         <title>WIN Enterprises Announces PC/104+ Module based on the Intel(r) Atom(tm) processor D525</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/Rlw2nfxm4gc/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
				&lt;a rel="nofollow" id="news_image_1" target="_blank" href="http://i.opensystemsmedia.com/?bg=ffffff&amp;q=90&amp;w=871&amp;f=jpg&amp;src=http%3A%2F%2Fosmnewsphotos.s3.amazonaws.com%2F4f3e8353a7b19%2Feditors.mb-73240.jpg" title=""&gt;
					&lt;img id="image1" alt="" align="right" border="0" width='210' title="Click to zoom" src="http://i.opensystemsmedia.com/?bg=ffffff&amp;fltr[0]=usm|40|4&amp;q=93&amp;w=210&amp;src=http%3A%2F%2Fosmnewsphotos.s3.amazonaws.com%2F4f3e8353a7b19%2Feditors.mb-73240.jpg"/&gt;
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											&lt;/td&gt;
		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;North Andover, Mass. &amp;#8211; February 10, 2012 &amp;#8211; WIN Enterprises, a world-leading provider of custom embedded solutions announces the MB-73240, a low-power PC/104+ module that offers OEM solution providers a choice of the Intel&amp;#174; AtomTM D525, D425 and N455 processors. The Intel Atom D525 and D425 processors are clocked at 1.8GHz; the N455 at 1.66 GHz. The PC/104+ module features dual GbE Ethernet ports, four USB ports, LVDS support, CFast and SATA.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Features&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; Supports dual-core Intel Atom D525 processor&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; Provides dual GbE LAN ports&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; Supports one CFast, two serial ports and four USB 2.0 ports&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; DDR3 SO-DIMM socket supports up to 2GB memory&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; Supports SMBus with Alert&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;
The MB-73240 is ideal for space-limited applications such as mobile medical, interactive kiosk, human-machine interface (HMI), in-vehicle infotainment, gaming and industrial control. The module has up to 2GB of DDR2 memory. The device provides resolution of up to 2048 x 1536 over VGA; 1366 x 768 18-bit over LVDS and support for dual display.&lt;/p&gt;&lt;p&gt;
The MB-73240 provides exceptional I/O with two GbE LAN ports, two serial ports and four USB 2.0 ports. Storage is supported by a SATA interface and CompactFlash&amp;#8482;. Other I/O interfaces include 3x RS-232, 1x RS-232/422/485, GPIO and HD audio. Operating system support includes Windows XP Embedded, Windows XP and Linux. &lt;/p&gt;&lt;p&gt;
This RoHS compliant product is available now. For more product information, visit &lt;a rel="nofollow" target="_blank" href="http://www.win-ent.com"&gt;www.win-ent.com&lt;/a&gt; or contact WIN Enterprises at sales@win-ent.com.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About WIN Enterprises, Inc.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Founded in 1991 WIN Enterprises produces custom embedded boards and appliances for OEMs. The company has developed several reference designs for leading microprocessor companies and is an affiliate member of the Intel&amp;#174; Embedded Alliance. WIN offers a complete range of services from design and manufacturing to customer fulfillment. &lt;/p&gt;&lt;p&gt;
WIN Enterprises is an Affiliate Member with the Intel&amp;#174; Embedded Alliance, a community &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;of communications and embedded developers and solution providers.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Intel&amp;#174; and Intel&amp;#174; Atom&amp;#8482; are registered trademarks of Intel&amp;#174; Corporation in the United States and other countries. &lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/Gn2FRBNTwYO2rpXK2vTxsTz139Q/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/Gn2FRBNTwYO2rpXK2vTxsTz139Q/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/Rlw2nfxm4gc" height="1" width="1"/&gt;</description>
         <author>WIN Enterprises</author>
         <guid isPermaLink="false">http://www.smallformfactors.com/news/db/?31201</guid>
         <pubDate>Fri, 17 Feb 2012 16:35:05 +0000</pubDate>
      <feedburner:origLink>http://www.smallformfactors.com/news/db/?31201</feedburner:origLink></item>
      <item>
         <title>The Design Concept behind Vincotech Power Modules</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/ed_8oYGqiw0/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;February 17th 2012 - Vincotech produces highly efficient power modules with various housings designed for a wide range of power and other applications. The offering extends beyond standard motor drive topologies such as CIB / PIM, PACK, and half-bridge modules to encompass products designed specifically for PFC, welding, solar, and UPS applications. This paper describes the underlying design concepts for Vincotech&amp;#8217;s flow 0, flow 1 and flow 2 families, as well as flowSCREW 2s and the new flowSCREW w housings. It also discusses the pros and cons of Press-fit pins, DBC substrates, and stress-relief zones. The different types of power module assemblies and topologies are described using a module with three levels as an example.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
Designers in search of utmost efficiency and reliability for their applications will find the features and benefits they seek in Vincotech modules. Designed for a power range from 500 to 1700 V and from 4 to 600 A, these power modules feature a variety of topologies and technologies to satisfy the needs of the most diverse applications. &lt;/p&gt;&lt;p&gt;
For more information please see the article describing the design concept behind Vincotech&amp;#8217;s power modules:&lt;/p&gt;&lt;p&gt;
&lt;a rel="nofollow" target="_blank" href="http://www.vincotech.com/news/articles/concepts-of-vincotech-power-modules.html?campaign_id=PMConcept"&gt;www.vincotech.com/news/articles/concepts-of-vin[...]&lt;/a&gt; &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Vincotech:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Vincotech, an independent operating unit within Mitsubishi Electric Corporation, is a market leader in power modules in development and manufacturing of high-quality electronic power components for Motion Control, and Renewable Energy applications.&lt;/p&gt;&lt;p&gt;
With some 500 employees worldwide, backed by vast experience and a long history in electronics integration, Vincotech leverages these assets to help customers attain maximum market success. &lt;/p&gt;&lt;p&gt;
For more information please see: &lt;a rel="nofollow" target="_blank" href="http://www.vincotech.com"&gt;www.vincotech.com&lt;/a&gt;&lt;/p&gt;&lt;/span&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ed_8oYGqiw0:NIXlHmE0LTY:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ed_8oYGqiw0:NIXlHmE0LTY:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=ed_8oYGqiw0:NIXlHmE0LTY:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ed_8oYGqiw0:NIXlHmE0LTY:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=ed_8oYGqiw0:NIXlHmE0LTY:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ed_8oYGqiw0:NIXlHmE0LTY:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ed_8oYGqiw0:NIXlHmE0LTY:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ed_8oYGqiw0:NIXlHmE0LTY:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=ed_8oYGqiw0:NIXlHmE0LTY:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=ed_8oYGqiw0:NIXlHmE0LTY:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/ed_8oYGqiw0" height="1" width="1"/&gt;</description>
         <author>Vincotech GmbH</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31195</guid>
         <pubDate>Fri, 17 Feb 2012 10:53:12 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31195</feedburner:origLink></item>
      <item>
         <title>LP-180 Pico-ITX with AMD Embedded G-T56N APU</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/Iz_can3_O0o/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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					&lt;img id="image1" alt="" align="right" border="0" width='210' title="Click to zoom" src="http://i.opensystemsmedia.com/?bg=ffffff&amp;fltr[0]=usm|40|4&amp;q=93&amp;w=210&amp;src=http%3A%2F%2Fosmnewsphotos.s3.amazonaws.com%2F4f3e1098601b6%2Flp-180-3ds.jpg"/&gt;
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			&lt;td style="padding-left:8px;"&gt;
				
				
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											&lt;/td&gt;
		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;Taiwan Commate Computer Inc.(COMMELL), the worldwide leader of Single Board Computers, unveils the new industrial-grade Pico-ITX (measuring just 10cm x 7.2cm )motherboard LP-180, combined the AMD dual-core 1.65GHz 18W TDP T56N Accelerated Processing Unit(APU) and the AMD A55E Fusion Controller Hub, which is especially aimed at users who require solutions with high-performance graphics at low energy-consumption levels, Designed to enable x86 to be built into embedded systems where it was previously impractical for space reasons. It is especially suitable for applications that must be contained in a limited space control systems, such as Digital Signage, Thin Client, Information Kiosk, Point-of-Sale, and Casino Gaming and Industrial control systems.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
COMMELL LP-180 miniboard based on T56N APU that integrated a low-power dual-core CPU and a discrete-level GPU(AMD Radeon HD 6320), providing one DDR3-1333 SO-DIMM SDRAM up to 4GB and an array of video interface including VGA, DVI or 18-bit single channel LVDS. The T56N APU supports single or dual-independent high resolution displays and exceptional multi-media capability with hardware decode support for H.264, VC-1, MPEG2, WMV, DivX and Adobe Flash. &lt;/p&gt;&lt;p&gt;
The LP-180 comes with PS/2 Keyboard and Mouse, 2 x RS232, 1 x SATAII interface on-board, Networking is provided by Intel 82583 Giga LAN, 4 x USB2.0 ports and HD Audio are also integrated. One PCIE mini card socket allows for easily using any other add-on cards. &lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/AKtoypsvqqRY3X-E_7ywyzYC-I0/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/AKtoypsvqqRY3X-E_7ywyzYC-I0/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Iz_can3_O0o:eh98HztdZfk:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Iz_can3_O0o:eh98HztdZfk:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=Iz_can3_O0o:eh98HztdZfk:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Iz_can3_O0o:eh98HztdZfk:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=Iz_can3_O0o:eh98HztdZfk:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Iz_can3_O0o:eh98HztdZfk:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Iz_can3_O0o:eh98HztdZfk:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Iz_can3_O0o:eh98HztdZfk:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=Iz_can3_O0o:eh98HztdZfk:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Iz_can3_O0o:eh98HztdZfk:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/Iz_can3_O0o" height="1" width="1"/&gt;</description>
         <author>COMMELL</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31188</guid>
         <pubDate>Fri, 17 Feb 2012 08:30:28 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31188</feedburner:origLink></item>
      <item>
         <title>Radisys Announces First Intel Quad-Core, Extended Temperature COM Express Module</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/FICn4C7f8sg/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;HILLSBORO, OR, U.S. - February 1, 2012 - Radisys&amp;#174; Corporation (NASDAQ: RSYS), a leading provider of embedded wireless infrastructure solutions, today announced the CEQM67HD, the first ruggedized COM Express module with quad-core Intel&amp;#174; CoreTM i7 processing and a -40 C to +85 C temperature range. The CEQM67HD combines quad-core performance with Radisys' Highly Accelerated Lifetime Test (HALT) and Highly Accelerated Stress Screening (HASS) expertise during the design and development process to provide aerospace and defense (A&amp;D) customers with the high processing power and extreme temperature range capability required for embedded technology applications in network-centric warfare.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
Entire A&amp;D networks, from base station through the core are being consolidated into small, ruggedized communications platforms based on Radisys' COM Express modules. The combination of ruggedness, reliability and performance of Radisys' COM Express modules provides the ability for an entire network to be picked up and moved, or even carried in a soldier's pack. These ultra-portable cellular networks require a combination of hardware and optimized software that meets specialized size, weight and power requirements for next generation net-centric warfare. Radisys' Trillium 3G and LTE and media server software combined with the Radisys small form factor and defense specialized COM Express computer modules provide the necessary technology for today's military portable communications networks and services.&lt;/p&gt;&lt;p&gt;
"As the military adopts more commercial-off-the-shelf (COTS) technologies to keep pace with constantly changing missions and threats, the defense community is looking for innovative partners to enable this strategy. Synexxus is one of those partners, providing its data distribution system-the Electronic Keel (EKeel)-a highly ruggedized system used in Mine Resistant Ambush Protected (MRAP) vehicles. The EKeel leverages the best of COTS manufacturing and the design and modular benefits from standards-based COM Express in order to quickly take advantage of commercial investments and migrate to newer technologies for the battlefield," said Gregory Glaros, CEO, Synexxus. "The Radisys CEQM67HD complements our design objectives and architecture needs by consistently delivering the performance and reliability that the EKeel and MRAP vehicles require and our servicemen and women deserve."&lt;/p&gt;&lt;p&gt;
Optimizing the performance of A&amp;D systems can be accomplished only by putting more processing power inside tactical platforms to receive and pre-process data prior to delivering information to the operator. This increased level of processing performance now requires the quad-core processing capabilities of Intel's 2nd Generation Core i7 processors, incorporated into compact, mobile and rugged form factors that can withstand extreme environmental conditions. The new Radisys CEQM67HD combines quad-core i7 processing with the small, 95mm x 125mm COM Express form factor over the -40 C to +85 C temperature range, addressing the performance, size and ruggedness that A&amp;D applications need.&lt;/p&gt;&lt;p&gt;
"This CEQM67HD module brings extreme processing and graphics performance into a compact COM Express form factor, supporting processing intensive applications for the A&amp;D space within smaller, more efficient designs," said Jennifer Zickel, COM Express product line manager, Radisys. "Based on a thorough understanding of the defense industry's needs, Radisys COM Express experts have given our customers a solution to successfully execute compute intensive applications in even the harshest of environments, while also providing the confidence associated with an extended product lifetime and future upgradability backed by full life-cycle support from Radisys."&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About CEQM67HD&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Radisys' CEQM67HD extended temperature product brings new graphics technology and unprecedented processing power to A&amp;D applications within a 95mm x 125mm COM Express form factor. Key product features include:&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Quad-core Intel Core i7 processor options&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Intel Core i7 2715QE processor, 2.1 GHz&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Intel Core i7 2655LE, 2.2GHz&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Intel Core i7 2610UE, 1.5GHz&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Type 6 COM Express Revision 2.0 extended temperature module&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Seven PCI Express&amp;#174; x1 ports and one PCI Express x16 PEG port&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
 Intel QM67 chipset for up to 12 USB ports (four on board), four SATA ports and DDI, HDMI, LVDS or VGA graphics&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Dual-channel DDR3, up to 16GB&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
 On-board TPM support to enable security features&lt;/p&gt;&lt;p&gt;
Radisys CEQM67HD product samples are available now and are expected for general availability in February 2012. To place an order or to receive more information, call +1 800-950-0044 or +1 503-615-1100.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Additional Resources&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Radisys' CEQM67HD datasheet&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Radisys Aerospace &amp; Defense solutions&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Radisys (NASDAQ: RSYS) is a leading provider of embedded wireless infrastructure solutions for telecom, aerospace, defense and public safety applications. Radisys' market-leading ATCA, IP Media Server and COM Express platforms coupled with world-renowned Trillium software, services and market expertise enable customers to bring high-value products and services to market faster with lower investment and risk. Radisys solutions are used in a wide variety of 3G &amp; 4G / LTE mobile network applications including: Radio Access Networks (RAN) solutions from femtocells to picocells and macrocells, wireless core network applications, Deep Packet Inspection (DPI) and policy management; conferencing and media services including voice, video and data, as well as customized mobile network applications that support the aerospace, defense and public safety markets.&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/FICn4C7f8sg" height="1" width="1"/&gt;</description>
         <author>Radisys</author>
         <guid isPermaLink="false">http://www.mil-embedded.com/news/db/?31180</guid>
         <pubDate>Thu, 16 Feb 2012 17:43:23 +0000</pubDate>
      <feedburner:origLink>http://www.mil-embedded.com/news/db/?31180</feedburner:origLink></item>
      <item>
         <title>CEQM67HD</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/Dzb6IwjI0Ws/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;The CEQM67HD provides extreme ruggedness and -40&amp;#176;C to +85&amp;#176;C temperature range combined with the second generation quad-core Intel&amp;#174; CoreTM i7 processor and the Mobile Intel&amp;#174; QM67 Express chipset to provide breakthrough processing performance on a basic size Type 6 COM Express Revision 2.0 module. The basic size 95mm x 125mm module is ideal for compute intensive applications such as defense and aerospace communications, processing, test and control that require high levels of processing performance. Radisys delivers the CEQM67 module in a COM Express Revision 2.0, Type 6 pin out, enabling customers to take advantage of new technology such as Digital Display Ports while boosting features and performance with up to 16GB memory, additional PCI Express lanes, and improved storage, graphics and audio. The CEQM67 module provides TPM support as well as support for Intel Advanced Management Technology (AMT) enabling remote access and diagnostics via the Radisys Embedded Software Platform (eSP).&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The Radisys COM Express (CE) family of products enables customers to start designing at the same time as processor release, saving months of development time and resources. OEM focus can remain on core competencies such as software and application development rather than high speed circuit design. Planned feature changes, demand fluctuations and performance upgrades can be handled without product redesigns using the CE family. CE modules can reduce service repair inventories, and simplify upgrades, contributing to the success of the product over its lifetime.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Com Expert Design Services&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
OEMs can depend on the Radisys COM Expert team to support their design at every stage, from schematic checks to the handling of entire custom carrier and system designs. Radisys COM Expert services include options for software utilities, custom BIOS, mechanical models, debug assistance and more to customers using Radisys CE processor modules. Design consulting and debug services are also available to support OEM product development at any stage. Ask your Radisys Sales Manager for more information.&lt;/p&gt;&lt;/span&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Dzb6IwjI0Ws:60ika9dOVZs:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Dzb6IwjI0Ws:60ika9dOVZs:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=Dzb6IwjI0Ws:60ika9dOVZs:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Dzb6IwjI0Ws:60ika9dOVZs:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=Dzb6IwjI0Ws:60ika9dOVZs:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Dzb6IwjI0Ws:60ika9dOVZs:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Dzb6IwjI0Ws:60ika9dOVZs:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Dzb6IwjI0Ws:60ika9dOVZs:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=Dzb6IwjI0Ws:60ika9dOVZs:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=Dzb6IwjI0Ws:60ika9dOVZs:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/Dzb6IwjI0Ws" height="1" width="1"/&gt;</description>
         <author>Radisys</author>
         <guid isPermaLink="false">http://www.advancedtca-systems.com/news/db/?31173</guid>
         <pubDate>Thu, 16 Feb 2012 17:36:40 +0000</pubDate>
      <feedburner:origLink>http://www.advancedtca-systems.com/news/db/?31173</feedburner:origLink></item>
      <item>
         <title>See our LTE &amp; LTE-Advanced design, test &amp; measurement solutions at Mobile World Congress in Barcelona, February 2012. Visit us on Stand 1E54 in Hall 1.0.</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/-47QOon5eg0/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;3G Evolution Lab - LTE Toolbox and LTE Blockset for The MathWorks MATLAB&amp;#174; and Simulink&amp;#174; is a comprehensive physical layer simulation Toolbox for Release 8 (v8.8.0/v8.9.0) of the 3GPP Evolved Universal Terrestrial Radio Access (E-UTRA) standard. The library will accelerate your algorithm and PHY development, support golden reference verification and enable custom test &amp; measurement waveform generation.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Customer Success&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Our customers range from fab and fabless semiconductor companies to national defence organisations around the globe. Here are some comments from just two of them:&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Xilinx&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
&amp;#8220;We used the Steepest Ascent LTE Toolbox to validate our LTE baseband IP cores and example design C models. This meant we could trust our own C models matched the 3GPP specification and allowed us to verify our RTL designs against the C models with confidence. Catching issues early in simulation saved a lot of time later when it came to hardware testing. The MATLAB environment allowed us to rapidly assemble and run test cases.&amp;#8221; Bill Wilkie, Director of Communications Signal Processing (Europe), Xilinx.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Sigmatix&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Another example of customer success is Sigmatix Inc. "Steepest Ascent's LTE Toolbox gave us much valued confidence in assessing our LTE physical layer performance." said Phil Moorby, creator of Verilog and CTO of Sigmatix, Inc. Moorby continues, "My team's decision to use the capabilities of the LTE Toolbox as reference to validate our LTE designs proved beneficial for risk reduction and accelerating project milestones, a choice I would support again."&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
    LTE Toolbox: The MathWorks MATLAB&amp;#174; (R2006b or later; Windows 32 &amp; 64 Bit, Linux 64 Bit)&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE Blockset: The MathWorks Simulink&amp;#174;&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE Toolbox User Guide&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
The extensive Toolbox Help and LTE background documentation is available online here.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Purchasing&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
For sales queries, licensing options and quotes contact sales@steepestascent.com . &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Trial Downloads and Product Literature&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
What's new in v.3.5.0   	LTE_Toolbox_whats_new_in_v3.5.0.pdf 	0.05 MB&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE Toolbox Blockset Leaflet 	LTE_Toolbox_Blockset_Leaflet_v2.0.pdf 	0.9 MB&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
LTE Toolbox v3.5 Datasheet 	LTE_Toolbox_datasheet_v3.5.pdf 	0.05 MB&lt;/p&gt;&lt;p&gt;
LTE Toolbox Trial v3.5.1 - Win 32 bit* 	LTE_Toolbox_trial_installer_v3.5.1.1222.exe 	20.2 MB&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE Toolbox Trial v3.5.1 - Win 64 bit*&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE_Toolbox_trial_installer_x64_v3.5.1.1222.exe&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
	23.6 MB&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE Toolbox v3.5.1 - Linux 64 bit 	Available; please enquire.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;*Trialware support: upon installation this download will offer you a 14 day evaluation license which will be sent to you by email. In the Trial version all LTE Toolbox functions are supplied as P-code and there are a number of parameter limitations, most notably, only a fixed number of non-standard bandwidths are enabled. These Trial versions are not intended for existing customers. Requires MATLAB R2006b or later. The architecture (32/64 bit) of the Toolbox must match that of the MATLAB installation.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE Toolbox Demos&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Download the Toolbox trial to see the demo m-code.&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* Downlink conformance test bench demo: This example demonstrates how to use the Downlink Conformance Test Bench to analyse the LTE Toolbox performance under LTE standard defined Fading Channel Models for a range of signal to nose ratios (SNRs).&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* Transmit diversity conformance test demo: Demonstrates how a MIMO transmit diversity case conformance test can be modeled using functions from LTE toolbox.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* PUSCH conformance test demo: Demonstrates how a PUSCH performance conformance test can be modeled using functions from the LTE toolbox.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* SIB1 recovery: Demonstrates recovery of System Information (SIB1 and MIB) from an eNodeB transmission using the LTE Toolbox.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* PDSCH BER demo: Demonstrates how to draw Physical Downlink Shared Channel (PDSCH) bit error rate curves under Additive White Gaussian Noise (AWGN) using the PDSCH BER tool.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* MIMO channel estimation demo: Demonstrates how a MIMO transmit/receive chain can be modelled using the LTE toolbox.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* PRACH false alarm demo: Demonstrates how to perform the PRACH false alarm rate conformance test.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* PRACH detection demo: Demonstrates how to perform the PRACH detection conformance test.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* Downlink EVM demo: Performs a TS36.104 Annex E EVM measurement on a downlink signal.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* Uplink EVM demo: Performs a TS36.101 Annex F EVM and in-band emissions measurement on an uplink signal.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* UE-specific beamforming demo: Shows how the LTE Toolbox can be configured to support Release 8 UE-specific beamforming.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* HARQ-ACK on PUSCH demo: Demonstrates how a HARQ-ACK on PUSCH conformance test can be modeled using from the LTE toolbox.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* Equalization demo: Shows how a simple transmitter-channel-receiver simulation may be created using functions from the LTE toolbox.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* DL-SCH HARQ demo: Demonstrates the H-ARQ process for DL-SCH transmission.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* PDCCH decoding demo: Demonstrates the transmission and reception of PDCCH using LTE toolbox functions.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* Mixed PUCCH demo: Shows how to transmit and receive a mixture of PUCCH Format 1 and PUCCH Format 2 in the same resource block.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* Multi-user PUCCH demo: Demonstrates how a multi-user PUCCH conformance test can be modeled using functions from the LTE toolbox.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* Single-user PUCCH 1a demo: Demonstrates how a single-user PUCCH Format 1a conformance test can be modeled using from the LTE toolbox.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* Single-user PUCCH 2 demo: Single-user PUCCH 2 demo: Demonstrates how a single-user PUCCH Format 2 conformance test can be modeled using from the LTE toolbox.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* SRS configuration demo: Demonstrates how to configure UE and cell-specific SRS aspects.&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;* DL-SCH demo:  Shows DL-SCH, DCI and CFI coding and mapping to physical channels (PDSCH, PDCCH and PCFICH).&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Papers and Articles&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE Portal 	The LTE/ LTE-Advanced Guide May 2010&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Improving throughput performance in LTE by channel estimation noise averaging&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE_Portal_Article_May_2010.pdf (1.21 MB)&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;DSP Valley 	Newsletter 5 October-November 2009&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Steepest Ascent gets Physical with LTE on your Desktop&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;DSP_Valley_Article_October_2009.pdf (0.07MB)&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Steepest Ascent 	September 2010&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE System Information Acquisition Using the LTE Toolbox Article&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;SA_ LTE_System_Information_Acquisition_using _LTE_Toolbox.pdf (0.09MB)&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Presentations&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;DCKTN LTE Wireless Event&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;13th May 2010 Bristol&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;SA_Introduction_to_LTE.pdf (1.04 MB)&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;DCKTN/ UKTI Spectral Efficiency Workshop&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;10th September 2010 Reading&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;SA_LTE_and_LTE_Advanced.pdf (0.30MB)&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Demo Videos&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE Overview 	LTE overview and Steepest Ascent's LTE capabilities&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE Blockset 	LTE receiver performance analysis using 3G Evolution Lab- LTE Blockset&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE Toolbox 	LTE Channel Estimation using 3G Evolution Lab- LTE Toolbox&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Product Overview&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
The toolbox features functions to perform channel coding/decoding and modulation/demodulation operations implementing the full physical layer transmit/receive processing chain, from transport channels and control information to OFDM and SC-FDMA modulated waveforms. Receive models are offered to recover the transmitted signals. Channel coding for transport channels and control information is available for uplink and downlink. Test Models and Reference Measurement Channel (RMCs) waveform generators are available to easily generate reference waveforms.&lt;/p&gt;&lt;p&gt;
The current version supports v8.8.0/v8.9.0 of the 3GPP TS36.21x standard series. Our development roadmap includes tracking compliance from Release 8 through Release 10 and beyond.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Features&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
    3GPP Release 8 E-UTRA physical layer implementation conforming to TS36.211, TS36.212 and TS36.213&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;FDD and TDD duplexing mode&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Downlink and uplink support&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
    Complete support for 1, 2 and 4 antenna transmissions including all MIMO layering and precoding options&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Full control of all parameters via MATLAB&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;All physical layer steps available as individual functions/blocks:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
        Transport channel coding/ decoding&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Scrambling/ descrambling&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
        Symbol Modulation/ demapping&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Resource element mapping&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
        OFDM and SC-FDMA &lt;/p&gt;&lt;/span&gt;
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         <author>Steepest Ascent</author>
         <guid isPermaLink="false">http://tech.opensystemsmedia.com/lte-advanced/news/id/?31169</guid>
         <pubDate>Thu, 16 Feb 2012 16:46:40 +0000</pubDate>
      <feedburner:origLink>http://tech.opensystemsmedia.com/lte-advanced/news/id/?31169</feedburner:origLink></item>
      <item>
         <title>Eurocom offers complete line of Quadro based 15.6", 17.3" and 18.4" notebooks with NVIDIA Quadro 3000M, 4000M and 5010M for Engineering on-the-Go</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/jBQ5RqPd9og/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;Eurocom, (&lt;a rel="nofollow" target="_blank" href="http://www.eurocom.com"&gt;www.eurocom.com&lt;/a&gt;) a developer of long lifespan, fully upgradable Notebooks, high performance Mobile Workstations and Mobile Servers, is offering a complete line of NVIDIA Quadro GPU powered Mobile Workstations from 15.6&amp;#8221; to 18.4&amp;#8221; that are specifically designed for Engineers and Designers. &lt;/p&gt;&lt;p&gt;
Eurocom offers a complete line of NVIDIA Quadro mobile GPU&amp;#8217;s from 3000M, 4000M and 5010M within notebooks ranging from a very small and portable 15.6&amp;#8221; EUROCOM Racer to 17.3&amp;#8221; Eurocom Neptune and Panther to the 18.4&amp;#8221; EUROCOM Leopard 2.0. This enables Eurocom customers to choose the perfect Quadro based system for their professional needs, with up to 4 GB GDDR5 video memory, and 384 CUDA cores. &lt;/p&gt;&lt;p&gt;
Eurocom Mobile Workstations are built to offer unmatched performance, long lifespan and full upgradeability of the processor, memory, storage, operating system and VGA technology, and are designed with the most innovative technology and components available, from workstation class desktop Intel Xeon Processors and RAID 0/1/5/10 support to dual GPU support.&lt;/p&gt;&lt;p&gt;
Eurocom offers Quad buffered stereo support in quad buffered stereo applications with 3D stereoscopic glasses in all Eurocom Mobile Workstations, 3D displays and NVIDIA Quadro high end solutions. The EUROCOM Neptune also comes complete with a built in emitter. The 120Hz 3D signal is outputted to an external monitor via DVI-DL (DVI Dual Link) port.&lt;/p&gt;&lt;p&gt;
Eurocom systems and NVIDIA Quadro mobile graphics with Open GL 4.1 are ideal for professional applications such as: Adobe Creative Suite 5.5, Autodesk 3DS Max, Autodesk Autocad 2011, Autodesk Inventor 2012, Avid Media Composer, Dassault Catia, Dassault Solidworks, Siemens X, ANSYS, MATLAB, Dassault Simulia.&lt;/p&gt;&lt;p&gt;
CUDA or Compute Unified Device Architecture is a parallel computing architecture developed by NVIDIA. CUDA is the computing engine in NVIDIA graphics processing units (GPUs) that are accessible to software developers through variants of industry standard programming languages. The current generation CUDA architecture (Fermi) GPU is designed from the ground up to support more programming languages, NVIDIA has also introduced several new features:&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; NVIDIA Parallel DataCache technology&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; NVIDIA GigaThread engine&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; ECC memory support&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; Native support for Visual Studio&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Benefits of NVIDIA Quadro&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
NVIDIA Quadro professional graphics solutions adhere to higher quality and reliability standards than consumer level graphics cards. NVIDIA Quadro GPUs are designed and built to provide leading performance, reliability, compatibility and stability with applications like Autodesk AutoCAD, 3ds Max, and Dassault Systemes SolidWorks, among many others.&lt;/p&gt;&lt;p&gt;
Like NVIDIA, Eurocom believes NVIDIA Quadro professional graphics cards are the right choice for these types of applications because they provide the dependability that professionals require. NVIDIA and its ISV partners invest a great deal of engineering hours to provide optimized professional application solutions, resulting in a lower likelihood of a driver related software bug interrupting a professional&amp;#8217;s work. Eurocom and NVIDIA recommend that if your livelihood depends on using professional applications, then Quadro professional graphics solutions are the best choice.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Eurocom Notebooks supporting NVIDIA Quadro GPU's&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; 15.6&amp;#8221; &amp;#8211; EUROCOM Racer&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Professional Graphics: NVIDIA Quadro 3000M, 4000M, 5010M&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;3.1 kg/6.82 lbs&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Two storage drive capacity, 2 terabytes, RAID 0/1, SSD, HDD, Hybrid&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Up to 32GB, 4x SODIMM sockets, DDR3-1333/DDR3-1600/DDR3-1866&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Supports Sandy Bridge line of Intel Core i5 and i7 processors; up to Intel Core i7 2960XM Extreme Edition with 8MB of L3 cache&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; 17.3&amp;#8221; &amp;#8211; EUROCOM Neptune&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Professional Graphics: NVIDIA Quadro 3000M, 4000M, 5010M&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;3.90kg/8.58 lbs&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Three storage drive capacity, 3 terabytes, RAID 0/1/5/10, SSD, HDD, Hybrid&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; Up to 32GB, 4x SODIMM sockets, DDR3-1333/DDR3-1600/DDR3-1866&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Supports Sandy Bridge line of Intel Core i5 and i7 processors; up to Intel Core i7 2960XM Extreme Edition with 8MB of L3 cache&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;17.3&amp;#8221; - EUROCOM Panther 2.0&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Professional Graphics: NVIDIA Quadro 3000M, 4000M, 5010M&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;5.3kg/11.66 lbs&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Four storage drive capacity, 4 terabytes, RAID 0/1/5/10, SSD, HDD, Hybrid&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Up to 24GB; 3x SODIMM sockets, supports DDR3-1333/DDR3-1600&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Desktop Processors up to Intel i7-990X Processor Extreme or XEON X5690 series; 4 and 6-cores; LGA1366; 32nm technology; 65W-130W&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; 18.4&amp;#8221; - EUROCOM Leopard 2.0&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Professional Graphics: NVIDIA Quadro 3000M, 4000M, 5010M&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;5.6kg/12.32 lbs&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Four storage drive capacity, 4 terabytes, RAID 0/1/5/10, SSD, HDD, Hybrid&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226;Up to 24GB, 3X SODIMM sockets, DDR3-1333/1600/1866&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; Supports Sandy Bridge line of Intel Core i5 and i7 processors; up to Intel Core i7 2960XM Extreme Edition with 8MB of L3 cache&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;NVIDIA Quadro GPU&amp;#8217;s supported by Eurocom Notebooks&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; NVIDIA Quadro 5010M- 384 CUDA cores, 100W, 4GB GDDR5, Open GL 4.1&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; NVIDIA Quadro 4000M- 336 CUDA cores, 100W, 2GB GDDR5, Open GL 4.1&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;blockquote&gt;&lt;span class="osp-news-bullet-text"&gt;&amp;#8226; NVIDIA Quadro 3000M- 240 CUDA cores, 75W, 2GB GDDR5, Open GL 4.1&lt;/span&gt;&lt;/blockquote&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Eurocom:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Eurocom is a leading developer of long lifespan, fully upgradable notebooks, high performance mobile workstations and mobile servers since 1989. The company has produced many firsts and continues to engineer computer systems and VGA solutions that inspire and enable individuals and companies to reach great possibilities. Eurocom has been a leading innovator in the mobile computer industry since 1989, is currently the only developer in the world offering a Mobile Server solution along with a full line of Mobile Workstation supporting RAID 0/1/5/10 with up to 4 hard drives. For more information on Eurocom please visit (&lt;a rel="nofollow" target="_blank" href="http://www.eurocom.com"&gt;www.eurocom.com&lt;/a&gt;).&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/KwGFyWd0JByj4Hd31TGbjDvvutM/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/KwGFyWd0JByj4Hd31TGbjDvvutM/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/jBQ5RqPd9og" height="1" width="1"/&gt;</description>
         <author>Eurocom</author>
         <guid isPermaLink="false">http://www.smallformfactors.com/news/db/?31162</guid>
         <pubDate>Thu, 16 Feb 2012 16:32:31 +0000</pubDate>
      <feedburner:origLink>http://www.smallformfactors.com/news/db/?31162</feedburner:origLink></item>
      <item>
         <title>NEC to Exhibit M2M Service Enabled by Mobile Cloud and Mobile Broadband Solutions at Mobile World Congress 2012</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/1wOB4VxuIzQ/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;&lt;span class="abstract"&gt;Tokyo, Jan 24, 2012 - NEC Corp. (NEC) announced today that it will attend the Mobile World Congress 2012 at the Fira de Barcelona, Barcelona February 27 - March 1 2012.&lt;/span&gt;&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
NEC will showcase a range of innovative and revenue-generating solutions for mobile operators and enterprises on the concept of "Winning in Verticals with M2M Cloud" at its stand 8A125, Hall 8. In particular, NEC will present its machine-to-machine (M2M) solutions from platform to cloud based applications, end-to-end cloud solutions including vertical applications for healthcare, education, retail and smart home services with combination of M2M cloud services and next-generation mobile broadband solutions: LTE (Long-Term Evolution), femtocell, mobile backhaul and operational support system (OSS).&lt;/p&gt;&lt;p&gt;
"M2M communications via Mobile Cloud is a fast-growing market for NEC", says Takayuki Morita, senior vice president, NEC. "Already utilities, retail, transportation and medical organisations benefit from connecting smart meters, healthcare monitors and telematics devices. NEC's seamless IT and network solutions will help them to capture revenue from the expected massive increase of connected devices."&lt;/p&gt;&lt;p&gt;
In addition, NEC will demonstrate its display solutions, tablet and smart-phones. NEC will also host two forums: "Mobile Cloud" and "LTE".&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Products/Solutions&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Big Data Processing Technology&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
NEC has developed a big data processing platform technology able to batch process and analyse data in shorter time, meeting the increasing customer demand for higher-speed data storage systems. NEC's technology analyses large volumes of data, collected by an ever growing number of sensors and terminals, and provides users with the resulting information in real-time. The technology also reduces power consumption by two-thirds compared to conventional technologies for distributed storage with analysis systems.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Lte&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
NEC will showcase its small cell LTE solutions that help mobile operators around the world to reduce their soaring CAPEX and OPEX spending for LTE rollout strategies. NEC's solutions give back control to mobile operators and enable them to test, adjust and tailor the provision of LTE services according to capacity demand and profitability of high-data rate services. NEC's small cell LTE solutions also supports the business transformation of the many operators that re-examine their strategy, trying to avoid the costly experience with the macro rollout of their 3G networks.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Femtocell&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
As one of the leading companies providing end-to-end femtocell solutions, NEC will demonstrate its femtocell solution, which enables mobile operators to provide premium mobile services and an excellent mobile consumer experience. This is critical to the objectives of mobile operators seeking to address the retention of their mobile subscriber base and customer acquisition.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Mobile backhaul&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
NEC will show its market leading product portfolio of next-generation solutions for packet microwave with innovations in high capacity technologies, new frequencies, and new compact equipment designs. , NEC's portfolio includes seamless integration of networks and computing with best-in-class customer experience and end-to-end SLAs, providing mobile operators with deep coverage in chosen market segments.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Forums&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;LTE Forum&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Date: Tuesday, February 28th, 11:15-12:30 - 12:30-13:30 Lunch&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Title: TBC&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Name: Mr. Keiichi J. Miyahara, Corporate Chief Engineer, NEC&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Date: Wednesday, February 29th, 13:30 - 14:45 - 14:45-15:15 Networking&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Theme 1: Perspective of Mobile Cloud Services&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Name: Mr. Shinya Kukita, Chief Manager of International Sales, NEC&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Theme 2: The M2M Cloud Evolution&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Name: Dr. Heinrich Stuttgen, Vice President, NEC Laboratories Europe&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
For further information or to register for the Forums please visit &lt;a rel="nofollow" target="_blank" href="http://www.nec.com/mwc"&gt;www.nec.com/mwc&lt;/a&gt;.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About NEC Corporation&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
NEC Corporation (TSE: 6701) is a leader in the integration of IT and network technologies that benefit businesses and people around the world. By providing a combination of products and solutions that cross utilize the company's experience and global resources, NEC's advanced technologies meet the complex and ever-changing needs of its customers. NEC brings more than 100 years of expertise in technological innovation to empower people, businesses and society. For more information, visit NEC at &lt;a rel="nofollow" target="_blank" href="http://www.nec.com"&gt;www.nec.com&lt;/a&gt;.&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/1wOB4VxuIzQ" height="1" width="1"/&gt;</description>
         <author>NEC</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31160</guid>
         <pubDate>Thu, 16 Feb 2012 16:29:33 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31160</feedburner:origLink></item>
      <item>
         <title>High-power (&amp;gt;100mW), 532nm-wavelength Compact Green Laser Module with High Efficiency and High-Speed Modulation Capability</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/SBNFyRaRSUE/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;Kanagawa and Tokyo, Japan, Jan 19, 2012 - (JCN Newswire) - QD Laser Inc., the Institute for Nano Quantum Information Electronics, the University of Tokyo, and Fujitsu Laboratories Limited today announced the successful development of a high-power 532nm-wavelength compact green laser module with high efficiency and high-speed modulation capability. Combining the near-infrared high-power single-mode laser based on proprietary semiconductor DFB (Distributed feedback) laser technology with wavelength conversion technology realizes a compact laser module of about 0.5cc that can provide high output power. An evaluation of the prototype module confirmed green light output of greater than 100mW under CW (Continuous wave) conditions and high-speed modulation of more than 100MHz. This module shows promise for a wide range of applications such as with florescence microscopes or spectral analysis in life science or biomedical applications, and precise measurements as well as nondestructive inspections in industry. Furthermore, it is also expected to apply to future ultra-compact projectors in consumer electronics. QD Laser is planning to start sample shipments of the new product, QLD0593-P50, with &amp;gt;50mW output power from the 2nd quarter of 2012 and to start mass-production from the 4th quarter.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
A prototype of the green laser module will be exhibited at SPIE Photonics West (Booth#5307), held from January 24, 2012, in San Francisco. This development is supported in part by the New Energy and Industrial Technology Development Organization (NEDO) and Project for Developing Innovation Systems conducted by the Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan.&lt;/p&gt;&lt;p&gt;
Recently, high-power green lasers have been garnering much attention in many fields, including life sciences and with biomedical and industrial applications. Different from near-infrared lasers for optical communications and red and blue lasers for optical storage, semiconductor lasers provide limited output characteristics in the case of green lasers. Therefore, diode pumped solid state (DPSS) lasers are usually used in applications which require high output power at wavelengths around 530nm. In these applications, it is imperative to have improved wavelength stability and high-speed modulation capability as well as low power consumption and compact size.&lt;/p&gt;&lt;p&gt;
QD Laser developed 1064 nm high-power single-mode lasers optimized for wavelength conversion in collaboration with Fujitsu Laboratories and the University of Tokyo. This development was based on the collective core proprietary technologies of semiconductor crystal growth, precise grating fabrication, and device design technology. Furthermore, the newly developed module assembling technology enables precise integration of the laser chip and wavelength conversion crystal. As a result, a high output power of more than 100 mW at a wavelength of 532nm from an ultra-compact package of just 0.5cc was achieved. According to the test results of the prototype module, 100mW output power was obtained with power dissipation of about 900 mW, which means high wall-plug efficiency of more than 10%. For the optical spectral characteristics, narrow linewidth of less than 0.01nm with a high side-mode suppression ratio was obtained, which is particularly suitable for precise measurements using an optical interference or high resolution spectroscopy. In addition, confirmation was made of a high-speed optical modulation capability of more than 100MHz and short pulse of less than 1nsec operation. This was done with a simple direct current modulation scheme, which showed that it could be effective for time resolved spectroscopy and other fields. These unique characteristics of high-power, high-efficiency, and high-speed modulation with compact package are also expected to apply to future display applications like heads-up displays or ultra-compact mobile projectors, which are attracting much attention and growing in the market.&lt;/p&gt;&lt;p&gt;
QD Laser has already started shipping samples of QLD0593-P05, a module with 5mW output power. In addition, it plans to start shipping high power samples of QLD0593-P50, a module with &amp;gt;50mW output power, in April, 2012 with mass production commencing from the 4th quarter of 2012.&lt;/p&gt;&lt;p&gt;
QD Laser markets 1064 nm band DFB laser modules, mainly for industrial applications including as a seed source for fiber lasers, and has already shipped them to more than 30 companies worldwide. QD Laser's in-house epitaxial growth and grating technology provides the flexibility to handle a wide range of wavelength bands and is now extending the wavelength lineup of DFB laser modules from 1030 to 1300nm. QD Laser also has the potential to extend wavelength lineup by combining with a wavelength conversion technology in visible wavelength regions like 515nm and 555nm for special green laser or 560nm and 590nm for yellow to orange colors. QD Laser will continue these unique technical developments to meet market requirements.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Fujitsu Limited&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Fujitsu is a leading provider of information and communication technology (ICT)-based business solutions for the global marketplace. With approximately 170,000 employees supporting customers in over 100 countries, Fujitsu combines a worldwide corps of systems and services experts with highly reliable computing and communications products and advanced microelectronics to deliver added value to customers. Headquartered in Tokyo, Fujitsu Limited (TSE:6702) reported consolidated revenues of 4.5 trillion yen (US$55 billion) for the fiscal year ended March 31, 2011. For more information, please see: &lt;a rel="nofollow" target="_blank" href="http://www.fujitsu.com"&gt;www.fujitsu.com&lt;/a&gt; .&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Fujitsu Laboratories Ltd.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Founded in 1968 as a wholly owned subsidiary of Fujitsu Limited, Fujitsu Laboratories Limited is one of the premier research centers in the world. With a global network of laboratories in Japan, China, the United States and Europe, the organization conducts a wide range of basic and applied research in the areas of Multimedia, Personal Systems, Networks, Peripherals, Advanced Materials and Electronic Devices. For more information, please see &lt;a rel="nofollow" target="_blank" href="http://jp.fujitsu.com/labs/en/"&gt;jp.fujitsu.com/labs/en/&lt;/a&gt;&lt;/p&gt;&lt;/span&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=SBNFyRaRSUE:-MnV8VyDaJo:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=SBNFyRaRSUE:-MnV8VyDaJo:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=SBNFyRaRSUE:-MnV8VyDaJo:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=SBNFyRaRSUE:-MnV8VyDaJo:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=SBNFyRaRSUE:-MnV8VyDaJo:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=SBNFyRaRSUE:-MnV8VyDaJo:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=SBNFyRaRSUE:-MnV8VyDaJo:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=SBNFyRaRSUE:-MnV8VyDaJo:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=SBNFyRaRSUE:-MnV8VyDaJo:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=SBNFyRaRSUE:-MnV8VyDaJo:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/SBNFyRaRSUE" height="1" width="1"/&gt;</description>
         <author>QD Laser</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31157</guid>
         <pubDate>Thu, 16 Feb 2012 16:24:40 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31157</feedburner:origLink></item>
      <item>
         <title>Avnet Electronics Marketing Americas Adds MEMS Oscillators from Discera to Line Card</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/E3eJBhEGiI8/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;Avnet Electronics Marketing Americas, a business region of Avnet, Inc. (NYSE: AVT), today announced it has inked a distribution deal with Discera. As one of the leading developers of micro-electrical mechanical systems (MEMS)-based timing solutions, Discera products offer more features and a wider temperature range than standard quartz products. To find out more about Discera&amp;#8217;s offering, contact an Avnet sales representative or visit Avnet&amp;#8217;s e-Commerce engine, Avnet Express. &lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
Discera offers a wide range of oscillator products utilizing proprietary PureSilicon&amp;#8482; resonator technology. These MEMS oscillators address the performance, size, power and cost requirements of the consumer, enterprise, industrial and communication markets. &lt;/p&gt;&lt;p&gt;
"Avnet's broad distribution network will extend Discera&amp;#8217;s reach throughout the Americas," said Bruce Diamond, Discera&amp;#8217;s chief executive officer. "Our PureSilicon MEMS oscillators have better performance, shorter lead times and higher reliability than quartz-based products. We have made significant progress replacing quartz and are delighted to have Avnet as our ally." &lt;/p&gt;&lt;p&gt;
&amp;#8220;The addition of Discera to Avnet&amp;#8217;s Americas offering brings a unique set of solutions for customers looking to transition from quartz oscillators to a silicon based solution,&amp;#8221; said Steve Boysen, senior vice president, director of interconnect, passive and electromechanical (IP&amp;E) strategic sales, Avnet Electronics Marketing Americas. &amp;#8220;The combination of Discera products with Avnet&amp;#8217;s supply- and design-chain expertise will help fuel our mutual customers&amp;#8217; future designs at lowered costs and more efficient output.&amp;#8221; &lt;/p&gt;&lt;p&gt;
To find our more, or to purchase Discera products, visit the Avnet Electronics Marketing website. &lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/z2JJeFglFqKsrON0HkSWBDJOOKg/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/z2JJeFglFqKsrON0HkSWBDJOOKg/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/E3eJBhEGiI8" height="1" width="1"/&gt;</description>
         <author>Avnet Electronics Marketing</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31155</guid>
         <pubDate>Thu, 16 Feb 2012 15:17:59 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31155</feedburner:origLink></item>
      <item>
         <title>Mantracourt Introduces Wireless Temperature Acquisition Module</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/KeFWZOivktU/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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		&lt;/tr&gt;
		&lt;tr&gt;
			&lt;td align="center" style="padding-top:9px;font-family:Arial, verdana;font-size:9px;color:#343434;"&gt;
											&lt;/td&gt;
		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;The T24-TA wireless temperature module is designed for the collection and processing of temperature data as determined by an external platinum temperature sensor (Pt100). The temperature measuring device records the temperature and periodically transmits the data to a remote receiver. Between transmissions the device is optionally put in a power saving sleep mode to conserve batteries. &lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
"The temperature acquisition module is an important addition to the T24 wireless range of instrumentation products," said Kelly Voysey, Sales and Marketing Manager at Mantracourt. "It will enable the wireless monitoring of platinum temperature sensors, whereby resistance changes with temperature. Along with our other wireless sensor modules, this device will help us provide a complete solution to engineers seeking to remotely monitor and control a given process." &lt;/p&gt;&lt;p&gt;
UK based Mantracourt is a leading manufacturer of industrial measurement technologies and a world leader in the design and manufacture of electronics for measurement technologies, including strain gauge, temperature, resistance, pressure, voltage, current, potentiometer, rate, flow, LVDT and displacement in either analogue, digital or wireless form.&lt;/p&gt;&lt;p&gt;
The Mantracourt T24 wireless telemetry range is a flexible low power radio system designed to enable the transmission of high accuracy measurement data from load cells, inclinometers, accelerometers, temperature, displacement and pressure sensors. With a combination of transmitter and receiver technologies, engineers are able to remotely monitor instrumentation readings.&lt;/p&gt;&lt;p&gt;
"Wireless instrumentation is enabling engineers to undertake measurement and control in ways that were not possible before," said Kelly Voysey. "Whether it is rotating machinery, or equipment located in a hazardous area such as a construction site, or perhaps a temporary installation that would not justify permanent wiring, or maybe even difficult to access locations, our T24 range is enabling engineers around the world to take a new approach to how they can use instrumentation in the field."&lt;/p&gt;&lt;p&gt;
The device transmits on license-free 2.4Ghz, avoiding local radio interference to ensure data integrity and security. &lt;/p&gt;&lt;p&gt;
The module can transmit to a range of receivers including handheld indicators, digital displays, analogue and serial outputs, PC display and wireless printer and it has various powering options. &lt;/p&gt;&lt;p&gt;
Data is provided in real time at variable speeds with a direct line of sight range of 100 or 200 meters, which can be extended with the use of high gain antenna&amp;#8217;s and repeaters. &lt;/p&gt;&lt;p&gt;
The T24-TA wireless temperature-measuring device is also available in a PCB version for OEM integration. &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Mantracourt&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Mantracourt design and manufacture instrumentation for load cells, strain gauges, pressure sensors, torque transducers, flow sensors, temperature sensors, for signal conditioning, display and control using analogue, digital and radio wireless telemetry techniques. Based near Exeter in the South-West of England, Mantracourt Electronics has become firmly established as a key technology provider to many major OEM sensor manufacturers and now has a product range of over 1000 designs. Key to its commercial success is Mantracourt's specialist engineering team that is constantly developing new products using the latest technologies and components. Mantracourt was awarded the Queen's Award for Enterprise in International Trade in 2009. &lt;a rel="nofollow" target="_blank" href="http://www.mantracourt.co.uk/"&gt;www.mantracourt.co.uk/&lt;/a&gt;&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/GfVl6GWI56NNbkMm1vVe6_Mo8SI/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/GfVl6GWI56NNbkMm1vVe6_Mo8SI/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/KeFWZOivktU" height="1" width="1"/&gt;</description>
         <author>Mantracourt Electronics Ltd</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31154</guid>
         <pubDate>Thu, 16 Feb 2012 11:21:17 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31154</feedburner:origLink></item>
      <item>
         <title>Vector Software Expands Support for QNX Neutrino RTOS Certified Plus(tm)</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/n6DXpJso6gw/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;Vector Software, the world&amp;#8217;s leading provider of innovative software solutions for testing safety and mission critical embedded applications, announced today expanded support for the QNX&amp;#174; Neutrino&amp;#174; Real-Time Operating System (RTOS) from QNX Software Systems Limited. This newest integration offers a best-in-class solution for developers of safety and security embedded systems.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The award winning QNX&amp;#174; Neutrino&amp;#174; RTOS is a full-featured, robust operating system that scales down to meet the constrained resource requirements of real-time embedded systems. Microkernel design and modular architecture enables customers to create highly optimized and reliable systems with low total cost of ownership. It offers the embedded industry&amp;#8217;s only field-proven clean strategy for migrating from single-core to multi-core processing.&lt;/p&gt;&lt;p&gt;
QNX Neutrino RTOS Certified Plus&amp;#8482; combines the benefits of the QNX&amp;#174; Neutrino&amp;#174; RTOS Safe Kernel and the QNX Neutrino RTOS Secure Kernel. The RTOS is certified to IEC 61508 Safety Integrity Level 3 (SIL3) and Common Criteria ISO/IEC 15408 Evaluation Assurance Level (EAL) 4+. Its certification credentials combined with its microkernel architecture, full POSIX-compliant API, and adaptive partitioning technology provide the ideal foundation for any system with functional safety and security requirements.&lt;/p&gt;&lt;p&gt;
"The VectorCAST product suite has supported the QNX Neutrino RTOS since 2009. We are delighted to announce our expanded support for QNX&amp;#8221;, said William McCaffrey, Chief Operating Officer for Vector Software, "This latest integration helps our customers accelerate time-to-market by streamlining product planning, design, and validation.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Vector Software, Inc.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Founded in 1989, Vector Software is the world&amp;#8217;s leading provider of innovative software testing solutions for safety and mission critical embedded applications. Vector Software&amp;#8217;s VectorCAST line of products, automate and manage the complex tasks associated with unit, integration, and system level testing. VectorCAST supports the C, C++, and Ada programming languages. Vector Software also offers support, training and consulting services to its customers worldwide. To learn more, visit Vector Software at &lt;a rel="nofollow" target="_blank" href="http://www.vectorcast.com"&gt;www.vectorcast.com&lt;/a&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;VectorCAST Product Family&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;VectorCAST/C++&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;VectorCAST/Ada&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;VectorCAST/RSP&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
 VectorCAST/Cover&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;VectorCAST/Manage&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
 VectorCAST/Requirements Gateway&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Modified Condition / Decision Coverage (MC/DC) module&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
 DO-178B, FDA, and IEC 61508 / ISO 26262 Qualification Packages&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/-H5zt7oaH2k0hvnsZEdL5vbtHNY/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/-H5zt7oaH2k0hvnsZEdL5vbtHNY/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=n6DXpJso6gw:ou00DMd1bFE:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=n6DXpJso6gw:ou00DMd1bFE:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=n6DXpJso6gw:ou00DMd1bFE:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=n6DXpJso6gw:ou00DMd1bFE:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=n6DXpJso6gw:ou00DMd1bFE:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=n6DXpJso6gw:ou00DMd1bFE:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=n6DXpJso6gw:ou00DMd1bFE:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=n6DXpJso6gw:ou00DMd1bFE:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=n6DXpJso6gw:ou00DMd1bFE:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=n6DXpJso6gw:ou00DMd1bFE:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/n6DXpJso6gw" height="1" width="1"/&gt;</description>
         <author>Vector Software</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31131</guid>
         <pubDate>Wed, 15 Feb 2012 15:23:20 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31131</feedburner:origLink></item>
      <item>
         <title>ITTIA DB SQL Anticipates Needs of Innovative Industrial Automation Systems</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/v-bdeD4ee_U/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;&lt;p&gt;Today's industrial automation systems are advancing at an unprecedented pace, and systems designed nowadays in this field require innovative database software to efficiently and safely manage valuable data stored on embedded devices. ITTIA has predicted and recognized the evolution of these systems, and has included in ITTIA DB SQL those vital features needed to support these special-purpose applications. &lt;/p&gt;&lt;p&gt;Developers of industrial automation applications have simply relied on ITTIA DB SQL&amp;#8217;s small footprint database library to store data in an interoperable, maintainable and safe manner. In its latest release, ITTIA DB SQL offers industrial automation software developers an opportunity to benefit from data management standards, including support from a true relational database model &amp;ndash; a key factor available from enterprise databases &amp;ndash; and thus the ability to prevent the risks of data management. &lt;/p&gt;&lt;p&gt;The great performance of ITTIA DB SQL significantly contributes to data querying and access for industrial automation systems. In addition, ITTIA DB SQL offers great flexibility, limits memory fragmentation, maximizes the efficiency of transactions, and supports both on-disk and in-memory data management. As it is necessary for industrial systems to respond rapidly to real-world events, ITTIA DB SQL is reliable, interoperable, and maintainable. &lt;/p&gt;&lt;p&gt;Industrial automation software combines data from multiple sources, which is then employed by several concurrent tasks to make decisions, display the system status to operators, and notify interested parties when an alarm occurs. The reliable, rich concurrency support from ITTIA DB SQL ensures that decisions handled by multiple processes or threads are safe. &lt;/p&gt;&lt;p&gt;Not only can concurrent tasks share access to the same database file through client/server or multi-threading, but ITTIA DB SQL can notify these tasks whenever a row is modified. A notification event occurs only after the change is committed, so the application has full isolated access to the database when processing the event. These events can include a copy of all fields in the row, or only the primary key and modified fields. &lt;/p&gt;&lt;p&gt;A new white paper from ITTIA explains how industrial automation software developers can predict and avoid data management disasters. This white paper addresses various concerns, such as flash media wear, loss of data due to unexpected power failure, and preparation for data growth. &lt;/p&gt;&lt;p&gt;A copy of this white paper is available at: &lt;/p&gt;&lt;p&gt;&lt;a rel="nofollow" target="_blank" href="http://www.ittia.com/about/industrial-automation"&gt;http://www.ittia.com/about/industrial-automation &lt;/a&gt;&lt;/p&gt;&lt;p&gt;A free copy of ITTIA DB SQL is available for evaluation at: &lt;/p&gt;&lt;p&gt;&lt;a rel="nofollow" target="_blank" href="http://www.ittia.com/products/evaluation"&gt;http://www.ittia.com/products/evaluation&lt;/a&gt;&lt;/p&gt;&lt;p&gt;&lt;strong&gt;About ITTIA&lt;/strong&gt;&lt;/p&gt;&lt;p&gt;ITTIA provides software and services for data management, offering standards, ease of use, and flexibility to our customers. Benefits of selecting ITTIA's technologies include leading-edge software, comprehensive documentation, scalability, efficiency, exceptional performance, and low total cost of ownership. Learn how customers such as Freescale Semiconductor, Panasonic, Puget Sound Energy, Fresenius, Boeing, and others have valued from ITTIA by visiting: &lt;a rel="nofollow" target="_blank" href="http://www.ittia.com/"&gt;www.ittia.com&lt;/a&gt;&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/v-bdeD4ee_U" height="1" width="1"/&gt;</description>
         <author>ITTIA</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31136</guid>
         <pubDate>Wed, 15 Feb 2012 00:27:49 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31136</feedburner:origLink></item>
      <item>
         <title>Deeter add Modbus Gateway Integration to Wireless Sensor System</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/UQjknqOTZXI/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;The Deeter Group, has added a Wireless Modbus Gateway to its range of Wireless Sensor Network products. Any users of Modbus communication protocols will find the new Deeter Wireless Modbus Gateway is a simple and cost effective way to connect a Deeter Wireless Sensor network to a Modbus system to monitor physical or environmental conditions, such as liquid levels, temperature, humidity, vibration, pressure and proximity.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
Deeter add Modbus Gateway Integration to Wireless Sensor SystemThe Deeter Wireless Modbus Gateway communicates with the Modbus network via a RS485 port in slave mode; it coordinates the wireless sensor network and manages data acquisition from the sensors using the IEEE 802.15.4&amp;#8482; wireless protocol in the 2.4GHz ISM frequency band.&lt;/p&gt;&lt;p&gt;
A Deeter Wireless Modbus Gateway may be installed as a component of a new control or measurement system or as an extension to an existing wired sensor system in order to add wireless connected sensors.&lt;/p&gt;&lt;p&gt;
Alan Marsh, Sales Manager at Deeter Group Ltd. Comments; &amp;#8221; Modbus has become one of the most popular standard communications protocols used in process control and is now amongst the most commonly available means of connecting industrial electronic devices. Our new Modbus Gateway will allow customers to integrate Deeter Wireless Sensor products into existing or new control systems in locations where wireless has cost, safety and convenience advantages over conventional cable connected systems.&amp;#8221;&lt;/p&gt;&lt;p&gt;
Deeter Wireless products may be used indoors or outside and all are rated to IP64, have an operating temperature range of -20&amp;#186;C to +70&amp;#186;C and compliant to FCC part 15.&lt;/p&gt;&lt;p&gt;
The Deeter Group&amp;#8217;s comprehensive range of wireless sensors and network components may be used to remotely monitor temperature, pressure, flow, humidity, liquid level, float or proximity switches or any sensor connected to a 4-20mA control loop. Deeter wireless sensor networks are very versatile and can range from a simple single sensor measurement to complex multi sensor and multi-vendor systems with mixed sensor inputs and routers to extend wireless range and offer self-healing mesh networks. &lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/UQjknqOTZXI" height="1" width="1"/&gt;</description>
         <author>Deeter Wireless</author>
         <guid isPermaLink="false">http://www.advancedtca-systems.com/news/db/?31087</guid>
         <pubDate>Tue, 14 Feb 2012 17:33:03 +0000</pubDate>
      <feedburner:origLink>http://www.advancedtca-systems.com/news/db/?31087</feedburner:origLink></item>
      <item>
         <title>Dialog Semiconductor VoIP technology adopted by VTech for S-series desktop phones</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/uGL0jgtnrpk/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;Dialog Semiconductor plc has announced that its ultra low power Green VoIP chip family has been adopted by VTech, a leading supplier of cordless and corded phones. Under the terms of the partnership VTech is using Dialog's SC14452 and SC14461 VoIP processors and Rhea software suite to produce a series of VoIP cordless and corded phones.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The first of which, the S-series of single and dual-line phone systems, has been designed for the hotel market and went into mass production in the fourth quarter of 2011. The design win successfully extends Dialog&amp;#8217;s relationship with VTech, which is already using the company&amp;#8217;s DECT IC technology in its digital cordless phones.&lt;/p&gt;&lt;p&gt;
VTech&amp;#8217;s S-series VoIP phones incorporate multi-call and multi-handset capabilities, speakerphone functionality, IEEE802.3af power over Ethernet, and a USB charging facility, together with an array of other advanced hotel phone features. Furthermore, the VTech SIP cordless desktop phones incorporate DECT, CAT-iq and DECT 6.0 with an adjustable coverage area to deliver improved clarity and installation management.&lt;/p&gt;&lt;p&gt;
C.H. Tong, President of VTech Telecommunications Ltd, commented: &amp;#8220;Communications are increasingly done over IP, and our goal is to exceed user expectations with our VoIP telephony products, providing clear and reliable communications solutions. Our S-series phones have been designed first and foremost with audio clarity and ease of use at their heart and Dialog&amp;#8217;s VoIP chips and software are the key to achieving this.&amp;#8221;&lt;/p&gt;&lt;p&gt;
Jalal Bagherli, CEO of Dialog, added: &amp;#8220;VTech is among the world&amp;#8217;s leading brand names, especially in the phone market, and is already a customer for our DECT digital cordless phone ICs. Our close working cooperation has helped us extend our relationship with this second product line and integrate our Green VoIP processors into VTech&amp;#8217;s latest designs.&amp;#8221;&lt;/p&gt;&lt;p&gt;
The Dialog SC14452 is an award-winning VoIP IC with built-in DECT support and has the flexibility to meet the diverse needs of users and manufacturers. It features a 16-bit CompactRISC&amp;#8482; processor and two user-programmable Gen2DSPs to deliver 240-MIPS of computational power. The device uses a low clock frequency to achieve the industry&amp;#8217;s lowest power consumption figures, saving as much as 2W per desktop phone compared with other solutions. It integrates a 32KHz wideband audio codec, Class D amplifier and PAEC (Perfect Acoustic Echo Canceller) to deliver exceptional audio clarity. Its sister device, the SC14461, has all the capabilities of the SC14452 but without DECT support and is aimed at corded desktop models.&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/uGL0jgtnrpk" height="1" width="1"/&gt;</description>
         <author>VTech</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31085</guid>
         <pubDate>Tue, 14 Feb 2012 17:29:49 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31085</feedburner:origLink></item>
      <item>
         <title>Future Mobile Awards for M-Commerce Winners: Gemalto; iMovo; Fiserv; Nokia; &amp; Sybase</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/0IMks62Dy5c/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;&lt;span class="abstract"&gt;HAMPSHIRE, UK: February 13th, 2012: Five companies at the forefront of new developments in Mobile Commerce have been given Juniper Research Future Mobile Awards for Mobile Commerce.&lt;/span&gt;&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
Juniper Research has awarded M-Com, Gemalto, i-movo, Nokia and Sybase 365 with the awards which are given to companies that have made a significant contribution to their sector and are poised to make considerable market impact in the future.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;The awards were broken into six categories:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Mobile Banking: M-Com, part of Fiserv, received the Mobile Banking award for its advanced triple-play product, integrated mCommerce product suite and global coverage. The company offers a dedicated solution for emerging market un-banked and under-banked populations. Also highly commended in this category were Sybase and Fundamo.&lt;/p&gt;&lt;p&gt;
&amp;#8220;With hundreds of financial institutions and millions of consumers already using our mobile banking and payments services, Fiserv is at the forefront of the digital transformation of banking,&amp;#8221; said Adam Clark, SVP and general manager, Mobile Solutions, Fiserv. &amp;#8220;This recognition of our contribution to the mobile banking and payments market space is an honour, and we plan to continue exhibiting the innovation and leadership for which we are known.&amp;#8221;&lt;/p&gt;&lt;p&gt;
Mobile Coupons: i-movo received the Mobile Coupons award for extensive experience with mobile coupons, vouchers and cash transfers, having developed and patented technology to use credit card payment standard messaging to support secure digital voucher processing. Also highly commended in this category were Eagle Eye and Telmap.&lt;/p&gt;&lt;p&gt;
&amp;#8220;Experience, retailer coverage and usage by millions of customers are the key measures of success and are what has established i-movo as the market leader for secure digital vouchers,&amp;#8221; said David Tymm, CEO of i-movo. &amp;#8220;Juniper&amp;#8217;s recognition of this is a tremendous endorsement of our approach and we look forward to the rapid development of the market that Juniper predicts.&amp;#8221;&lt;/p&gt;&lt;p&gt;
NFC: Gemalto received the NFC award for occupying a pivotal position in the NFC market providing both SIM and Trusted Service Manager NFC technology and services on a worldwide basis. Its recent selection for TSM project lead such as for Singapore IDA and ISIS exemplify its success. Also highly commended in this category were Proxama and ViVOtech.&lt;/p&gt;&lt;p&gt;
Mobile Ticketing: Gemalto also received the Mobile Ticketing award for its track record in delivering contactless solutions for mass transit systems for more than 10 years with more than 100 million contactless cards shipped and its continued innovations in the transition to NFC ticketing. Also highly commended in this category were masabi and NeoMedia.&lt;/p&gt;&lt;p&gt;
&amp;#8220;NFC continues to penetrate new markets across the world,&amp;#8221; said Remi De-Fouchier, Senior Vice President, Trusted Services Management at Gemalto. &amp;#8220;Gemalto has been there every step of the way, providing our customers and the mobile NFC ecosystem as a whole with the reliability and security our products and solutions deliver - from our TSM solutions to digital wallet and beyond.&amp;#8221;&lt;/p&gt;&lt;p&gt;
Mobile Money Transfer: Nokia received the Mobile Money Transfer award for its Indian service accessible across all Nokia devices and being preloaded onto all new devices; ease of use across a multitude of devices is essential to a national service gaining critical mass. Also highly commended in this category were Sybase and Fundamo.&lt;/p&gt;&lt;p&gt;
"We are pleased with this Gold award for our Nokia Money family of services which recognises the contributions of the global Nokia team together with our business and market partners," said Rahul Mewawalla, VP and general manager, Nokia Mobile Financial Services. "On their behalf, I would like to thank the Future Mobile Awards judges and express our appreciation for their comments."&lt;/p&gt;&lt;p&gt;
Mobile Payments: Sybase 365, a SAP company, received the Mobile Payments awards for its extensive customer base supported by a comprehensive mCommerce platform enabling a wide range of payments applications strengthened by an extended relationship with IBM. Also highly commended in this category were Ericsson and Aepona.&lt;/p&gt;&lt;p&gt;
&amp;#8220;Sybase 365 is a pioneer of the mobile economies in both developed and emerging markets and we are proud to receive recognition for our commitment and contribution to the mobile payments, money transfer and banking sectors,&amp;#8221; said John Sims, President, Sybase 365. &amp;#8220;At Sybase 365, we have a commitment to delivering innovative solutions that allow financial institutions and mobile service providers to engage their customers in uniquely mobile scenarios that expand opportunities and markets, while delivering value in the lives of consumers.&amp;#8221;&lt;/p&gt;&lt;p&gt;
David Snow, Senior Analyst and Panel Judge at Juniper Research gave more details, "All our award winners and highly commended players have demonstrated either long term commitment or specific innovations within the mobile commerce market over the past year. They are also key and active players in the mobile commerce ecosystem without which the market cannot develop to its full potential."&lt;/p&gt;&lt;p&gt;
The awards were decided by a panel of expert judges based on a number of criteria including: Product range and innovation; Geographic market penetration; Evidence of commercial campaigns; Partnerships and Potential future business development. &lt;/p&gt;&lt;p&gt;
Juniper Research provides research and analytical services to the global hi-tech communications sector, providing consultancy, analyst reports and industry commentary.&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/0IMks62Dy5c" height="1" width="1"/&gt;</description>
         <author>Juniper Research</author>
         <guid isPermaLink="false">http://tech.opensystemsmedia.com/lte-advanced/news/id/?31079</guid>
         <pubDate>Tue, 14 Feb 2012 16:55:33 +0000</pubDate>
      <feedburner:origLink>http://tech.opensystemsmedia.com/lte-advanced/news/id/?31079</feedburner:origLink></item>
      <item>
         <title>Qseven to COM Express(r) Adapter</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/IGOiu38If88/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;&lt;span class="abstract"&gt;Connect Tech&amp;#8217;s Qseven to COM Express&amp;#174; Adapter allows users to install a Qseven module into any COM Express Carrier Board.&lt;/span&gt;&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The Qseven to COM Express&amp;#174; Adapter is transparent to the system, and allows the Qseven module to be added to the COM Express&amp;#174; system without additional setup or software. Users can easily evaluate and integrate the latest generation of low powered Qseven CPU modules in a custom COM Express&amp;#174; carrier.&lt;/p&gt;&lt;p&gt;
The Qseven to COM Express&amp;#174; Adapter can be used for evaluation or field deployment, and allows users systems to transition to Qseven without any respin of their COM Express&amp;#174; Carrier.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Qseven to COM Express&amp;#174; Adapter Features&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Qseven to COM Express&amp;#174; AdapterInterfaces:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;PCI Express Lanes (4 lanes)&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
        SATA (2 channels)&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Gbe&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
        USB (8 ports)&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Sdio&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;HD Audio&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Spi&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;I2c&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Compatible with all COM Express&amp;#174; Types:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
        Type 2, Type 6, Type 1, Type 10, Type 3, Type 4, Type 5&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Operating Temperature: -40&amp;#186;C to 85&amp;#186;C (-40&amp;#186;F to 185&amp;#186;F)&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
    Basic and Compact COM Express&amp;#174; Form Factors&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Compact: 95 x 95 mm&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
        Basic: 95 x 125 mm&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Lifetime warranty and free technical support&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Custom Design Services for the Qseven to COM Express&amp;#174; Adapter&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
At Connect Tech, we recognize the unique requirements of every application. We are dedicated to delivering the right solution to accommodate customer requirements, new industry standards, and engineering design enhancements.&lt;/p&gt;&lt;p&gt;
Connect Tech's team of highly skilled engineers are dedicated, knowledgeable and experienced. They offer several years of experience in custom designs and will work with you to implement a solution that will meet your needs. Our custom design services can be applied at any stage of a project, and our experience ensures that we can deliver a cost-effective, custom solution within a narrow timeline. You can count on us for product quality, expert advice and services that will enhance your business value.&lt;/p&gt;&lt;p&gt;
For more information about our custom design services for the Qseven to COM Express&amp;#174; Adapter , please contact Connect Tech&amp;#8217;s sales department.&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/IGOiu38If88" height="1" width="1"/&gt;</description>
         <author>Connect Tech Inc.</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31076</guid>
         <pubDate>Tue, 14 Feb 2012 16:44:57 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31076</feedburner:origLink></item>
      <item>
         <title>Mobile NFC Metro Tickets to be used by 1 in 8 Mobile Users in the US and Western Europe by 2016</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/9op2uSAhn3Y/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;Hampshire, UK &amp;#8211; 14th February 2012: A new report from Juniper Research has found that 1 in 8 (13%) of North American and Western European mobile users will use their NFC-enabled mobile phone as a metro rail or bus ticket by 2016, compared with less than 1% today. Worldwide, mobile users are now beginning to adopt mobile tickets as an integrated part of their mobile lifestyle, whether for airline, road or rail transport, sporting or entertainment event access.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Key Advantages of NFC and Mobile Tickets&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
The report found that, while mobile tickets of all types are growing in popularity, the ability to &amp;#8220;tap&amp;#8221; an NFC phone containing a mobile ticket against an entrance gate has tremendous user appeal. For operators, a mobile phone ticket also provides new marketing and sales opportunities previously not available using paper or contactless smartcard tickets.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Thorough User Trials Vital&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
The report warns, however, that NFC Ticketing must be thoroughly tested before being launched to the public. For metro and bus tickets in particular, speed of passenger processing is of the essence and queues must not be allowed to build up as a result of ticket processing delays either in mobile phones, gating or back office systems.&lt;/p&gt;&lt;p&gt;
According to report author David Snow, &amp;#8220;NFC mobile ticketing is still in its early stages, but it holds great promise across the entire mobile ticketing market. Metro ticketing is leading the way as an NFC ticket is a natural evolution from a contactless transport card and can leverage the existing infrastructure. Add to this the option of simultaneous payment and you have created a compelling user experience.&amp;#8221;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Other findings from the report include:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Worldwide mobile ticketing transactions are set to quadruple to 23 billion by 2016&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
By 2016, NFC mobile tickets will represent more than 50% of all mobile ticketing revenue&lt;/p&gt;&lt;p&gt;
The Mobile Ticketing whitepaper is available to download from the Juniper website together with further details of the study &amp;#8216;Mobile Ticketing Evolution: NFC, Forecasts &amp; Markets 2012-2016&amp;#8217;.&lt;/p&gt;&lt;p&gt;
Juniper Research provides research and analytical services to the global hi-tech communications sector, providing consultancy, analyst reports and industry commentary.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Jess Hanslip&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Juniper Research&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;T: +44(0)1256 830 001&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
E: jess.hanslip@juniperresearch.com&lt;/p&gt;&lt;p&gt;
Juniper Research was founded in 2001 by the Wireless Industry Consultant Tony Crabtree, in the midst of the telecoms and dot-com crash. The business was fully incorporated in February of 2002 and has since grown to become one of the leading analyst firms in the wireless sector.&lt;/p&gt;&lt;p&gt;
 Juniper specialises in identifying and appraising new high growth market sectors within the mobile ecosystem. Market sizing and forecasting are the cornerstones of our offering, together with competitive analysis, strategic assessment and business modelling.&lt;/p&gt;&lt;p&gt;
We endeavour to provide independent and impartial analysis of both current and emerging opportunities via a team of dedicated specialists - very knowledgeable, experienced and experts in their field.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;In terms of structure, Juniper is organised along five main streams:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Mobile Content &amp; Applications&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Mobile Commerce&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Handsets &amp; Devices&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Mobile Markets &amp; Strategies&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Networks &amp; Technologies&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Each stream offers a blend of blogs, free whitepapers and paid-for research - normally in the form of research reports, strategic briefings and databases. Clients range from mobile operators and service providers through to content providers, vendors and financial institutions. Juniper's client base spans the globe, with the majority of its clients in North America, the Far East and Europe.&lt;/p&gt;&lt;/span&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=9op2uSAhn3Y:LW3BY6kRl6E:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=9op2uSAhn3Y:LW3BY6kRl6E:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=9op2uSAhn3Y:LW3BY6kRl6E:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=9op2uSAhn3Y:LW3BY6kRl6E:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=9op2uSAhn3Y:LW3BY6kRl6E:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=9op2uSAhn3Y:LW3BY6kRl6E:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=9op2uSAhn3Y:LW3BY6kRl6E:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=9op2uSAhn3Y:LW3BY6kRl6E:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=9op2uSAhn3Y:LW3BY6kRl6E:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=9op2uSAhn3Y:LW3BY6kRl6E:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/9op2uSAhn3Y" height="1" width="1"/&gt;</description>
         <author>Juniper Research</author>
         <guid isPermaLink="false">http://tech.opensystemsmedia.com/lte-advanced/news/id/?31075</guid>
         <pubDate>Tue, 14 Feb 2012 16:42:55 +0000</pubDate>
      <feedburner:origLink>http://tech.opensystemsmedia.com/lte-advanced/news/id/?31075</feedburner:origLink></item>
      <item>
         <title>Personal health data better protected by ISO standard</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/kd-1ouek8Zs/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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					&lt;img id="image1" alt="" align="right" border="0" width='210' title="Click to zoom" src="http://i.opensystemsmedia.com/?bg=ffffff&amp;fltr[0]=usm|40|4&amp;q=93&amp;w=210&amp;src=http%3A%2F%2Fosmnewsphotos.s3.amazonaws.com%2F4f3a8ed93a56f%2Fref1504_x180.jpg"/&gt;
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			&lt;td align="center" style="padding-top:9px;font-family:Arial, verdana;font-size:9px;color:#343434;"&gt;
											&lt;/td&gt;
		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;ISO has published a new technical specification which will increase protection of personal health information processed, stored and transferred by computer systems for subsequent use by clinicians and others in healthcare organizations. ISO/TS 14265:2011, Health informatics &amp;#8211; Classification of purposes for processing personal health information, defines a set of high-level categories of purposes for which such personal health information can be processed .&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
Electronic health records (EHRs) are used more and more. They involve the systematic electronic collection of health information about individual patients or populations, such as information about the physical or and mental health of an individual or provision of health services.&lt;/p&gt;&lt;p&gt;
Health information is usually documented by healthcare professionals as part of the process of delivering care, and subsequently used to support the continuing care of each patient. However, EHR information might also be needed and used to enable the healthcare organization (such as a hospital) to manage its services better and more safely, and for a wider range of purposes such as public health, education and research.&lt;/p&gt;&lt;p&gt;
Information may at times need to be shared with other organizations (e.g. between a hospital and a general practitioner). For ethical and legal reasons, information should only be used for the purposes for which it was collected or created. Up to now there has been no standard listing of the possible kinds of purpose of use of personal health information.&lt;/p&gt;&lt;p&gt;
ISO/TS 14265:2011, provides a framework for classifying the various specific purposes that can be defined and used by individual policy domains (e.g. healthcare organizations, regional health authorities, jurisdiction countries) as an aid to the consistent management of information in the delivery of healthcare services and for the communication of electronic health records across organizational and jurisdictional boundaries.&lt;/p&gt;&lt;p&gt;
Elaine Sawatsky and Dipak Kalra, Project leaders of the committee that developed the standard comment: &amp;#8220;This important piece of work is now available to help organizations understand how to manage the personal health information that they hold, and how to ensure that the information is used appropriately and consistently.&amp;#8221;&lt;/p&gt;&lt;p&gt;
ISO/TS 14265:2011, Health informatics &amp;#8211; Classification of purposes for processing personal health information, was developed by ISO/TC 215, health informatics. It is available from ISO national member institutes (see the complete list with contact details). It may also be obtained directly from the ISO Central Secretariat, price 80 Swiss francs respectively through the ISO Store or by contacting the Marketing, Communication &amp; Information department (see right-hand column).&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/yN46cA7z0G2fjQ5OjD_W92_7mHE/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/yN46cA7z0G2fjQ5OjD_W92_7mHE/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/kd-1ouek8Zs" height="1" width="1"/&gt;</description>
         <author>ISO</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31074</guid>
         <pubDate>Tue, 14 Feb 2012 16:35:43 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31074</feedburner:origLink></item>
      <item>
         <title>Expand the capabilities of your SUMIT-104 System with Connect Tech's new SUMIT to PCIe/104 Adapter</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/Sy2xQm18mTk/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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		&lt;tr&gt;
			&lt;td align="center" style="padding-top:9px;font-family:Arial, verdana;font-size:9px;color:#343434;"&gt;
											&lt;/td&gt;
		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;&lt;span class="abstract"&gt;Connect Tech&amp;#8217;s SUMIT to PCIe/104 Adapter allows for easy integration of PCIe/104 or PCI/104-Express cards into an existing SUMIT-104 system.&lt;/span&gt;&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The SUMIT to PCIe/104 Adapter is fully compatible with any Legacy Type-1 or Type-2 SUMIT-104 system, and allows x1 and x4 lane PCIe/104 or PCI/104-Express peripherals to be used with SUMIT cards in a SUMIT-104 stack. Additional signals available on the PCIe/104 bus include SMbus and 2 x USB. Additional accessible signals include 2 x USB ports via on-board Mini-USB connector (optional).&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;SUMIT to PCIe/104 Adapter Features&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Compatible with Type-1 or Type-2 SUMIT-104 systems&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
    Access to additional auxiliary SUMIT-104 signals&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Bus Connectors: SUMIT A and B, PCIe/104 x 1&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
    Optional: 2 x USB (from SUMIT) via Mini USB connectors&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Operating Temperature: -40&amp;#186;C to 85&amp;#186;C (-40&amp;#186;F to 185&amp;#186;F)&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
    Dimensions:&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Length: 9.02 cm/3.55&amp;#8221;&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
        Height: 9.6 cm/3.78&amp;#8221;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Lifetime warranty and free technical support&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Custom Design Services for the SUMIT to PCIe/104 Adapter&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
At Connect Tech, we recognize the unique requirements of every application. We are dedicated to delivering the right solution to accommodate customer requirements, new industry standards, and engineering design enhancements.&lt;/p&gt;&lt;p&gt;
Connect Tech's team of highly skilled engineers are dedicated, knowledgeable and experienced. They offer several years of experience in custom designs and will work with you to implement a solution that will meet your needs. Our custom design services can be applied at any stage of a project, and our experience ensures that we can deliver a cost-effective, custom solution within a narrow timeline. You can count on us for product quality, expert advice and services that will enhance your business value.&lt;/p&gt;&lt;p&gt;
For more information about our custom design services for the SUMIT to PCIe/104 Adapter, please contact Connect Tech&amp;#8217;s sales department.&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/Sy2xQm18mTk" height="1" width="1"/&gt;</description>
         <author>Connect Tech Inc.</author>
         <guid isPermaLink="false">http://www.smallformfactors.com/news/db/?31073</guid>
         <pubDate>Tue, 14 Feb 2012 16:30:55 +0000</pubDate>
      <feedburner:origLink>http://www.smallformfactors.com/news/db/?31073</feedburner:origLink></item>
      <item>
         <title>WEBINAR: Learn to Develop UIs and Applications with Qt Commercial</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/kr-Sdq3rPvw/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;&lt;span class="abstract"&gt;Join us on February 29th, March 1st or March 2nd for a web seminar that explores the use of Qt Commercial for UI and application development.&lt;/span&gt;&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
Thousands of leading companies in more than 70 industries have chosen Qt to build advanced applications and devices. Qt Commercial is the strategic development choice for leading companies and projects looking to shorten time to market, increase efficiency, drive creativity and extend outreach.&lt;/p&gt;&lt;p&gt;
This webinar is a great opportunity to learn about Digia, Qt Commercial and get first-hand information from our Qt expert on how you can start developing with the leading UI and application framework. It will give a thorough introduction to the framework and help those who are considering using Qt Commercial in their next project to make an informed decision.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Learn more about Qt Commercial: qt.digia.com.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
We hope you can join us for the webinar. Please use the appropriate links below to register for the webinar.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Date: Wednesday, Feb 29, 2012 &amp;#8211; Register here&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Time: 09:00am CST&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Duration: 45 minutes&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Date: Thursday, March 1, 2012 &amp;#8211; Register here&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Time: 09:00am EST&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Duration: 45 minutes&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Date: Friday, March 2, 2012 &amp;#8211; Register here&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Time: 09:00am PST&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Duration: 45 minutes&lt;/h3&gt;&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/kr-Sdq3rPvw" height="1" width="1"/&gt;</description>
         <author>OpenSystems Media</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31072</guid>
         <pubDate>Tue, 14 Feb 2012 16:28:55 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31072</feedburner:origLink></item>
      <item>
         <title>Holt Integrated Circuits CAN Controller Passes Conformance Test at C&amp;S Group GmbH</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/q4TDzrQMERY/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;Mission Viejo, California (February 14, 2012) &amp;#8211; Holt Integrated Circuits, a leading supplier of data bus components for commercial and military avionics, today announced independent validation of its CAN controller family at C&amp;S group in Germany. C&amp;S group GmbH, an ISO/IEC 17025 accredited test house, is the industry recognized authority for validation of CAN controllers according to protocol specification ISO 11898. &lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The validation was performed to test specification ISO 16845:2004. In addition, C&amp;S group performed additional conformance tests not covered by the original ISO test specification. Validation of Holt's CAN controller at C&amp;S group guarantees conformance and correct protocol response when operating within a CAN network. A copy of the final test report is available upon request.&lt;/p&gt;&lt;p&gt;
"Holt is excited to offer this new CAN controller to the industrial market," said Anthony Murray, Director of Business Development at Holt. "Holt's track record in avionics makes us an ideal choice for demanding industrial applications."&lt;/p&gt;&lt;p&gt;
 Holt's HI-5110 CAN controller is the industry's first to integrate the analog transceiver on the same chip as the digital protocol engine. This provides a compact single-chip interface between the physical bus and upper layer protocols such as DeviceNet and CANopen. Additional attractive features include deeper FIFOs, a flexible frame filtering scheme tailored to DeviceNet applications and short-circuit survival to &amp;#177;58V. A protocol-only version, HI-5111, is also available, as are development kits, standalone transceivers and software. The devices are available in -40&amp;#176;C to +85&amp;#176;C and -55&amp;#176;C to +125&amp;#176;C temperature ranges and are offered in 18 pin SOIC or compact 7mm x 7mm 44-pin QFN packages (HI-5113).&lt;/p&gt;&lt;p&gt;
All controllers are available immediately, priced from $4.85 in 1K quantities. Standalone transceivers&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;(HI-5000 family) are also offered, priced from $1.10 in 1K quantities.&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
To request additional information, readers should contact Holt at (949) 859-8800, by e-mail at info@holtic.com, or visit the Holt website at &lt;a rel="nofollow" target="_blank" href="http://www.holtic.com"&gt;www.holtic.com&lt;/a&gt;.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Download Word Document&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About Holt Integrated Circuits&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
Located in Mission Viejo, CA, Holt Integrated Circuits is a major supplier of ICs for avionics and military data bus and display applications. The company's products are specified by more than 400 manufacturers worldwide and are employed in flight control, navigation, engine management, oil exploration, communications, safety equipment, and in-flight entertainment systems. &lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Holt Integrated Circuits is an ISO 9001:2008 registered supplier.&lt;/h3&gt;&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/a2mZ7V_N3_WZq0u9taRp2Bd_TEo/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/a2mZ7V_N3_WZq0u9taRp2Bd_TEo/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/q4TDzrQMERY" height="1" width="1"/&gt;</description>
         <author>Hoit Integrated Circuits, Inc.</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31071</guid>
         <pubDate>Tue, 14 Feb 2012 16:26:06 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31071</feedburner:origLink></item>
      <item>
         <title>iPOS3602 MX: A Micro-sized Intelligent Drive Solution for Faster Assembly and Installation</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/bXJN_5h0OEY/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;The iPOS line of highly flexible Technosoft intelligent drives has been expanded with a new, micro-sized pluggable servo drive: iPOS3602 MX. Particularly developed for motion control applications where space is critical, this drive can be integrated &amp;#8211; within seconds &amp;#8212; to the user&amp;#8217;s motherboard or PCB machine. All basic motor control functions, as well as motion control and PLC features, are embedded onto this remarkably small drive (55 x 26 x 13 mm, 10 g). Equipped with CAN / CANopen and optionally with EtherCAT interfaces, iPOS3602 MX provides a flexible, compact solution adapted to the decentralized control of any rotary or linear brushless, DC brush or step motor up to 75 W (36 V, 2 A).&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
The drive's setup, tuning and motion programming is fast with EasyMotion Studio and Technosoft Motion Language (TML). Thanks to its embedded intelligence, iPOS3602 MX is able to run complex motion commands directly at drive level. Using the TML language, multiple operations can be executed with iPOS3602 MX: setting of various motion modes (profiles, PVT, PT, electronic gearing or camming, etc.), change of motion modes and/or parameters, execution of homing sequences or program flow control. At the same time, iPOS3602 MX can handle digital I/O and analog input signals, execution of arithmetic and logic operations, and transfer of data between axes. The iPOS drive accepts incremental (quadrature or sine / cosine) encoders and digital or linear Halls signals as position feedback. SSI, BiSS, EnDAT absolute encoders and resolver interfaces are available through an additional extension. &lt;/p&gt;&lt;p&gt;
iPOS3602 MX can be set to operate in various communication modes: CANopen, EtherCAT and TMLCAN. When CANopen or EtherCAT mode is selected, the drive may be controlled via the appropriate masters. As a bonus, iPOS offers to the master the option to call complex motion sequences pre-stored in the drive's memory. When TMLCAN mode is used, iPOS3602 MX operates in standalone mode, and may play the role of a master. If higher level coordination is needed, then iPOS3602 MX can be controlled through a PC or a PLC using one of the available TML_LIB motion libraries.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Specifications can be found at:&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
&lt;a rel="nofollow" target="_blank" href="http://www.technosoftmotion.com/products/OEM_PROD_iPOS3602_3604.htm"&gt;www.technosoftmotion.com/products/OEM_PROD_iPOS[...]&lt;/a&gt; &lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/5OqlqTSr8eFNai8whcXzcCBLmFI/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/5OqlqTSr8eFNai8whcXzcCBLmFI/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/bXJN_5h0OEY" height="1" width="1"/&gt;</description>
         <author>TECHNOSOFT</author>
         <guid isPermaLink="false">http://www.dsp-fpga.com/news/db/?31068</guid>
         <pubDate>Tue, 14 Feb 2012 15:49:46 +0000</pubDate>
      <feedburner:origLink>http://www.dsp-fpga.com/news/db/?31068</feedburner:origLink></item>
      <item>
         <title>DNA Electronics CEO Professor Chris Toumazou To Address Scripps "Future of Genomic Medicine" Conference</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/rV3QQ_-DVP4/</link>
         <description>&lt;span class='body'&gt;&lt;p&gt;London, United Kingdom, February 14th 2012 &amp;#8211; DNA Electronics Ltd. a developer of semiconductor solutions for real-time DNA and RNA detection, today announces that DNA Electronics Chairman and CEO Professor Chris Toumazou FRS will be an invited speaker at the upcoming &amp;#8220;The Future of Genomic Medicine V&amp;#8221; conference presented by the Scripps Translational Science Institute (March 1-2 2012, La Jolla, California). &lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
Professor Toumazou will be speaking as part of the &amp;#8220;Hot Topics in Genomic Medicine&amp;#8221; track, addressing a key presentation on &amp;#8220;DNA Transistors and Handheld Sequencing&amp;#8221; to the conference audience of physicians, healthcare professionals, human geneticists, genomic scientists and researchers. Prof. Toumazou&amp;#8217;s presentation will explore how scalable semiconductor solutions for real-time nucleic acid detection can enable faster, simpler and more cost-effective DNA analysis platforms. &lt;/p&gt;&lt;p&gt;
DNA Electronics &amp;#8211; a spin-out of Imperial College London &amp;#8211; was founded by semiconductor healthcare pioneer Prof. Toumazou, the inventor of the company&amp;#8217;s core technology that allows ion-sensitive CMOS transistors to be switched on and off with DNA. Prof. Toumazou&amp;#8217;s innovation has culminated in the world&amp;#8217;s first DNA logic on standard CMOS technology. DNA Electronics has worldwide non-exclusive licensing agreements with Roche&amp;#8217;s 454 Life Sciences and Ion Torrent (Life Technologies Inc.), providing access to DNA Electronics&amp;#8217; proprietary semiconductor technology portfolio, which enables sensitive detection of nucleotide incorporation during sequencing.&lt;/p&gt;&lt;p&gt;
The fifth Future of Genomic Medicine conference will focus on the extraordinary advances that are occurring in the field, which include whole genome and exome sequencing, pharmacogenomics, and advances in cancer treatment as an outgrowth of genomics. The 2012 conference features a two-day curriculum from a renowned faculty representing the country&amp;#8217;s leading institutions, headed by Director of Scripps Translational Science Institute Eric Topol M.D.&lt;/p&gt;&lt;p&gt;
Part of San Diego, California-based Scripps Health, the Scripps Translational Science Institute (STSI) is a unique community collaboration that initiates research that moves basic science from the lab to the patient bedside. STSI is supported by the NIH flagship program, Clinical and Translational Science Award (CTSA).&lt;/p&gt;&lt;p&gt;
Collaborators in the STSI consortium include Scripps Health; The Scripps Research Institute; the Burnham Institute for Medical Research; Children&amp;#8217;s Hospital of Philadelphia; Genomics Institute of the Novartis Research Foundation; The J. Craig Venter Institute; Salk Institute for Biological Studies; San Diego State University; San Diego Supercomputer Center; and The Neurosciences Institute.&lt;/p&gt;&lt;p&gt;
For full details of &amp;#8220;The Future of Genomic Medicine V&amp;#8221; conference, please visit the website: &lt;a rel="nofollow" target="_blank" href="http://www.scripps.org/events/future-of-genomic-medicine-v"&gt;www.scripps.org/events/future-of-genomic-medici[...]&lt;/a&gt;&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About DNA Electronics&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
DNA Electronics is a developer of semiconductor solutions for real-time nucleic acid detection which enables faster, simpler and more cost-effective DNA analysis platforms. The company&amp;#8217;s IP portfolio includes techniques for monitoring nucleotide insertions using ion-sensitive transistors, enabling label-free electronic DNA sequencing and diagnostics platforms using standard CMOS microchip technology. DNA Electronics (DNAe) has developed the Genalysis&amp;#174; platform of disposable silicon chip-based solutions for real-time nucleic acid sequence detection at the point of care, providing end users with technology as yet unavailable outside a laboratory. &lt;/p&gt;&lt;p&gt;
DNAe&amp;#8217;s Genalysis&amp;#174; portfolio of silicon-based point-of-care solutions delivers fast and accurate handheld gene tests with all the appeal of consumer electronics: anytime, anywhere. Interchangeable, disposable &amp;#8220;lab-on-chip&amp;#8221; cartridges can be tailored to any sequence of interest, making this a customizable semiconductor technology amenable to a wide variety of applications and markets. The ability to accurately detect a gene sequence in real-time using a standalone, fully portable, low power electronic readout presents disruptive new opportunities in diagnostics, data capture and therapy.&lt;/p&gt;&lt;/span&gt;
&lt;p&gt;&lt;a href="http://feedads.g.doubleclick.net/~a/wOUniqbpg30PIct7zFeV7s-MrxQ/0/da"&gt;&lt;img src="http://feedads.g.doubleclick.net/~a/wOUniqbpg30PIct7zFeV7s-MrxQ/0/di" border="0" ismap="true"&gt;&lt;/img&gt;&lt;/a&gt;&lt;br/&gt;
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&lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=rV3QQ_-DVP4:_OrHDqAkyc8:yIl2AUoC8zA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=yIl2AUoC8zA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=rV3QQ_-DVP4:_OrHDqAkyc8:lkJl0DYmYII"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=rV3QQ_-DVP4:_OrHDqAkyc8:lkJl0DYmYII" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=rV3QQ_-DVP4:_OrHDqAkyc8:V_sGLiPBpWU"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=rV3QQ_-DVP4:_OrHDqAkyc8:V_sGLiPBpWU" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=rV3QQ_-DVP4:_OrHDqAkyc8:7Q72WNTAKBA"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=7Q72WNTAKBA" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=rV3QQ_-DVP4:_OrHDqAkyc8:TzevzKxY174"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=TzevzKxY174" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=rV3QQ_-DVP4:_OrHDqAkyc8:gIN9vFwOqvQ"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?i=rV3QQ_-DVP4:_OrHDqAkyc8:gIN9vFwOqvQ" border="0"&gt;&lt;/img&gt;&lt;/a&gt; &lt;a href="http://m.opensystemsmedia.com/~ff/sff?a=rV3QQ_-DVP4:_OrHDqAkyc8:qj6IDK7rITs"&gt;&lt;img src="http://feeds.feedburner.com/~ff/sff?d=qj6IDK7rITs" border="0"&gt;&lt;/img&gt;&lt;/a&gt;
&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/rV3QQ_-DVP4" height="1" width="1"/&gt;</description>
         <author>DNA Electronics</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31066</guid>
         <pubDate>Tue, 14 Feb 2012 13:39:45 +0000</pubDate>
      <feedburner:origLink>http://www.embedded-computing.com/news/db/?31066</feedburner:origLink></item>
      <item>
         <title>connectBlue(tm) Releases a Turnkey Bluetooth Low Energy Module</title>
         <link>http://m.opensystemsmedia.com/~r/sff/~3/RkQpOEUw_TM/</link>
         <description>&lt;span class='body'&gt;	&lt;table width="5" border="0" align="right" cellpadding="2" cellspacing="0"&gt;		&lt;tr&gt;
			&lt;td style="padding-left:8px;"&gt;
				
				
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					&lt;img id="image2" alt="" align="right" border="0" width='210' title="Click to zoom" src="http://i.opensystemsmedia.com/?bg=ffffff&amp;fltr[0]=usm|40|4&amp;q=93&amp;w=210&amp;src=http%3A%2F%2Fwww.connectblue.com%2Ffileadmin%2FConnectblue%2FWeb2006%2FImages%2FPress_Image_downloads%2FOLP425-low.jpg"/&gt;
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		&lt;/tr&gt;          	&lt;/table&gt;&lt;p&gt;connectBlue launches a new Bluetooth module based on the latest Bluetooth Specification Version 4.0, featuring Bluetooth low energy technology. The Bluetooth low energy platform module OLP425 offers a unique set of features and functionality that provides customers with a turnkey complete solution. The OLP425 can either be delivered as is with digital and analog GPIOs or complete with battery, temperature sensor, accelerometers, and humidity sensor.&lt;/p&gt;&lt;p&gt;&lt;span id="Ad-ABD-1" style="display:none;float:left;"&gt;&lt;/span&gt;
&lt;/p&gt;&lt;p&gt;
Bluetooth low energy technology was introduced in 2010 in the Bluetooth v4.0 Specification. Bluetooth low energy technology is rapidly being integrated in small mobile Android / Apple iOS / Windows devices thanks to the unique features of an extremely long battery lifetime, fast connection times and interoperability focus provided by the standard. Industrial and medical customers can now easily utilize "apps" for Human Machine Interface (HMI), gateway and data acquisition functionality. In the past they had to rely on application tailored tools; now they can use a smart phone instead.&lt;/p&gt;&lt;p&gt;
"But we can offer more than "just" the Bluetooth low energy advantages," says Rolf Nilsson, CEO of connectBlue. "Our new OLP425 module is a unique low energy platform; our hardware is either delivered out-of-the-box or it is extra-equipped with added features. The customers then embed their own application software. All in all &amp;#8211; our new module provides a complete and cost efficient Bluetooth low energy experience."&lt;/p&gt;&lt;p&gt;
connectBlue's Bluetooth low energy platform module OLP425 is delivered with a number of digital and analogue GPIOs. The module can be equipped to support additional customer requirements with a coin cell battery, temperature sensor, accelerometers, and humidity sensor. Using the IAR Embedded Workbench, the customers then embed their own application software in the Bluetooth low energy platform module OLP425. Such possible customer application software includes machine / device access and asset management, data conversion, data acquisition, and logic.&lt;/p&gt;&lt;p&gt;
Since Bluetooth low energy technology is particularly suitable for small, mobile devices, connectBlue is introducing a new smaller connectBlue module standard with the Bluetooth low energy platform module OLP425. The Bluetooth low energy platform module OLP425 is radio type approved for FCC, IC and R&amp;TTE, compliant with EMC, Safety and Medical standards, and Bluetooth 4.0 qualified. These certificates allow customers to save on development resources and easily integrate wireless communication without having to go through lengthy and costly approval and qualification processes.&lt;/p&gt;&lt;p&gt;
An application scenario for the Bluetooth low energy platform module OLP425 is the collaboration between connectBlue and Tridentify (which was announced on October 12, 2011). The solution revolutionizes the handling of blood bags as it allows blood banks to increase blood availability, tracking and quality.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;Caption&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
connectBlue's new Bluetooth low energy platform module OLP425 opens up possibilities for new applications which were previously not possible with the existing wireless technologies. Thanks to its small form factor, ultra-low power usage, full certification and testing, the low energy platform offers a turnkey wireless functionality either out-of-the-box with GPIOs or custom designed with a coin cell battery, temperature sensor, accelerometer, and humidity meter.&lt;/p&gt;&lt;p&gt;&lt;h3 class="heading-1"&gt;About connectBlue&lt;/h3&gt;&lt;/p&gt;&lt;p&gt;
connectBlue&amp;#8482; is a leading provider of robust Industrial and Medical wireless solutions, designed and tested for the most demanding applications and environments. Based on Bluetooth technology, Wireless LAN (WLAN) and IEEE 802.15.4 / ZigBee, connectBlue provides ready-to-use products and modules as well as custom design solutions. connectBlue has its head office in Sweden and local offices in Germany and USA. For more information, please visit &lt;a rel="nofollow" target="_blank" href="http://www.connectblue.com"&gt;www.connectblue.com&lt;/a&gt;&lt;/p&gt;&lt;/span&gt;
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&lt;/div&gt;&lt;img src="http://feeds.feedburner.com/~r/sff/~4/RkQpOEUw_TM" height="1" width="1"/&gt;</description>
         <author>connectBlue</author>
         <guid isPermaLink="false">http://www.embedded-computing.com/news/db/?31117</guid>
         <pubDate>Tue, 14 Feb 2012 07:12:12 +0000</pubDate>
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