Small Form Factors

Themis Computer Names U.K. Distributor to Expand its European Presence For Systems and Embedded Computing Solutions

Themis Computer — Thu, 11 Mar 2010 00:35:11 -0800

Themis Computer announced the selection of Sight Systems, Ltd. to sell its extended operating environment server and single-board computers into government, aerospace, communications, and embedded systems markets. Headquartered in West Sussex, United Kingdom, Sight Systems will sell Themis servers and single-board computer solutions throughout Ireland and United Kingdom.

Established in 1988, Sight Systems is an Original Equipment Manufacturer (OEM) and an Original Design Manufacturer (ODM). As an innovator in industrial computing technology, Sight Systems is proud to be at the forefront of computer companies in the UK to be working towards ISO14001, a government directive that sets out environmental management systems requirements for organizations to operate in a sustainable manner. Some of the products Sight Systems offers have reduced power consumption by over 50% – helping to keep the world a greener place and costing users less to run.

Offering a broad range of solutions from powerful rackmountable and blade systems to compact embedded appliances, Sight Systems provides extensive integration services for users in the government, aerospace, communications, control and automation, and embedded systems markets. Sight Systems’ market expertise, and strong sales and support coverage, were vital factors in Themis’ selection of the company.

Sight Systems will sell Themis’ new UltraSPARCÒ T2-based T2VPX™ OpenVPX computer, and T2BC™ blade server for use in the entire family of IBMÒ BladeCenterÒ. Sight Systems will also sell Themis’ rugged family of COTS servers which provide users high performance in program specific configurations, requiring shock resilience in excess of 25G. Themis servers offer outstanding platform performance, dependability and value, for use in harsh environments. Sight Systems will also sell Themis’ new VMEBus Intel®-based board products, compatible with the Linux®, Windows®, and SolarisÔ Operating Environment, the industry’s leading UnixÒ operating system, Themis’ single-board computers enable users to access thousands of off-the-shelf software solutions.

Craig Blackman, managing director of Sight Systems, commented, "Themis’ extensive product lines and its leadership in embedded systems and rugged servers were very attractive to us. Themis’ products will significantly broaden our systems portfolio, particularly in COTS solutions, in which we have an extensive history of experience. Their success in military, aerospace and telecommunications markets is impressive indeed, due no doubt to the design of its systems to operate reliably in extreme environmental conditions. Themis’ dedication to world-wide technical support and quality matches our philosophies, making us an excellent team."

"I am pleased that Sight Systems, Ltd. will add their market sector expertise to our European Sales organization, stated William E. Kehret, president and CEO of Themis Computer. “Sight Systems provides tailor-made industrial computer systems and they are key distributors for world leading industrial component manufacturers. They are a focused, dynamic and fast growing organization. I trust that Sight Systems will provide premium support to Themis’ customers and prospects, along with a wealth of complementary products and capabilities”, Mr. Kehret added.

Themis Computer’s Environmentally Robust Servers and Single-Board Computers

Themis Computer is a leading provider of highly scalable blade servers, Rugged Enterprise Server™ (RES) systems, and board level embedded computers. Themis products feature rugged construction, high performance, superior scalability and ease of maintenance. Themis offers VME64 and VPX board-level computers featuring the leading processor architectures, including; x86 and Sun UltraSPARC. Themis’ single board computers include single and multiple slot configurations. I/O expansion is available with on-board XMC/PMC sockets and PMC carrier cards.

Themis' high performance servers, single-board computers, and graphics controllers are now being integrated into advanced communications and defense systems, worldwide. The Themis Computer family of COTS board and system products provide the increased processing power and reliability necessary for demanding application environments, while achieving a net reduction in total cost of ownership.

About Sight Systems, Ltd.

Established in 1988, Sight Systems is one of the original industrial computer companies. We’re proud of our history, and have a proven track record of distributing and manufacturing the highest quality products and tailor-made systems for industrial applications. Our flexibility and expertise have helped us to create exciting and effective solutions for some of the UK’s largest organizations across a huge range of markets.

About Themis Computer

Themis Computer is a leading developer and supplier of high performance board and system level products for mission-critical telecommunications, military/aerospace, and industrial embedded applications. Themis provides open standards-based embedded computing platforms that support the Solaris™, Linux®, and Windows® operating systems. Themis' products incorporate features designed to ensure high reliability and availability while reducing the risks of failure caused by extreme environments. An ISO 9001 certified company, Themis Computer practices Total Quality Management (TQM) in all areas of its business, from engineering and manufacturing to customer service. Themis Computer is headquartered in Fremont, California and offers worldwide service and support. For more information please visit www.themis.com or email: info@themis.com.

GE Intelligent Platforms Announces $1.7 Million Contract from Link Simulation and Training

GE Intelligent Platforms — Tue, 09 Mar 2010 17:18:01 -0800

CHARLOTTESVILLE, VA, MARCH 09, 2010 GE Intelligent Platforms, a unit of GE Enterprise Solutions, today announced that it had received an order for automatic video trackers valued at approximately $1.7 million from Link Simulation and Training of Arlington, Texas. The order is for a number of GE ADEPT74 real-time video tracker processing boards that will be employed as a major element of the U.S. Army’s AVCATT (Aviation Combined Arms Tactical Trainer) AH-64D simulation and training system upgrade program.

The GE Intelligent Platforms ADEPT74 is a full-featured automatic video tracker and image processor. It was chosen for its flexibility, powerful processing capability, and the facility to take the input of high-speed digital data directly from electro-optical sensors. A PMC site on the board allows the ADEPT74 greater flexibility for the provision of additional input video formats and image processing functionality.

“This is a significant application of our standard hardware,” said Peter Cavill, General Manager, Military/Aerospace Systems at GE Intelligent Platforms. “The ADEPT74 video tracker provides full emulation of the advanced MTADS targeting system on the latest versions of the Apache Longbow helicopter and allows the delivery of more realistic aircrew training, therefore providing superior efficiency and improved safety for our troops.”

AVCATT is a mobile and reconfigurable virtual simulation system designed to support unit collective and combined arms training. Each AVCATT suite provides six manned modules, reconfigurable to any combination of attack, reconnaissance, lift and/or cargo helicopters. Platforms that can be simulated include AH-64A, AH-64D, OH-58D, UH-60A/L and CH-47D. AVCATT is employed to train both active and reserve component aircrews deploying in support of overseas contingency operations.

About GE Intelligent Platforms

GE Intelligent Platforms is an experienced high-performance technology company and a global provider of software, hardware, services, and expertise in automation and embedded computing. We offer a unique foundation of agile and reliable technology providing customers a sustainable advantage in the industries they serve, including energy, water, consumer packaged goods, government & defense, and telecommunications. GE Intelligent Platforms is headquartered in Charlottesville, VA. For more information, visit www.ge-ip.com.

VersaLogic announces ultra-high performance SBC on PC/104-sized card

VersaLogic — Tue, 09 Mar 2010 05:08:35 -0800

VersaLogic Corp., a Eugene, Oregon-based embedded computer company, today announced the "Wildcat", a very high-performance single board computer (SBC). Built around an Intel® 2nd generation Core™2 Duo processor (SP9300), the entire SBC fits on a single 4.2” x 3.8” (107 mm x 96 mm) board.

Wildcat is designed for applications which require extreme CPU and video processing in a compact package. The SP9300 Core 2 Duo CPU is combined with the GS45 Graphics Memory Controller Hub and ICH9M I/O Controller Hub to form an extremely high-performance system. This powerful SBC is ideally suited for compute-intensive high-end applications such as flight navigation, guidance systems, and medical scanning / imaging. Wildcat is qualified to MIL-STD-202G shock and vibration standards for use in harsh environments.

"VersaLogic's new Wildcat is at the top of its class as the premium solution for applications requiring high-speed processing," said Len Crane, President of VersaLogic. "This kind of processing power, in such a small package, with relatively low power dissipation, will open a new generation of applications. It will also allow multi-CPU systems to be replaced to save a great deal of space, cost, and power in existing applications. This is a very significant step in processing capabilities."

Available in both a standard (0º to +60ºC) and an extended temperature version (-40º to +85ºC), the Wildcat runs at speeds up to 2.27 GHz, with typical power consumption of 19.5 watts. On-board features include up to 4 GB DDR3 RAM, gigabit Ethernet port, four USB 2.0 ports, dual SATA interface, serial port, digital HD audio support, and a latching MiniBlade™ socket for high-reliability flash storage. The board supports analog VGA and LVDS flat panel video interfaces for Extended Desktop, Clone, and Twin display modes, as well as advanced graphics capabilities with 3D video acceleration. Wildcat includes a stackable PCI interface (PCI-104™ standard) and VersaLogic’s SPX™ interface for system expandability.

The Wildcat owes its ability to pack extreme CPU and video performance into a PC/104-sized card to a new Core 2 Duo package. The small form factor (SFF) micro-FCBGA package uses 0.5 mm pitch balls to fit 956 connections in very little space.

Wildcat features Phoenix Technologies’ Embedded BIOS® with OEM enhancements. This field-reprogrammable BIOS supports custom defaults and the Firmbase™ software developers kit (SDK) for security, remote/network booting, and other application functions. Wildcat is compatible with a variety of popular operating systems, including Windows, Windows Embedded, Linux, VxWorks, and QNX.

The Wildcat is customizable, even in low OEM quantities. Customizations include manufacturing to Class 3 specifications, conformal coating, BIOS customization, revision locks, custom labeling, high-G shock and vibration treatment, custom testing and screening, etc. The Wildcat is fully RoHS-compliant.

VersaLogic will begin shipping Wildcat in March of 2010. Pricing is about $1,600 in OEM quantities. For additional information, please visit VersaLogic Corp. at www.VersaLogic.com, email sales@VersaLogic.com, or call toll-free 1-800-824-3163.

About VersaLogic Corporation

A leading supplier of industrial computers since 1976, VersaLogic focuses on high-quality board-level products for embedded OEM applications. Its five-year product availability guarantee and outstanding warranties demonstrate a commitment to service. Product platforms include EBX, PC/104, PC/104-Plus, EPIC™, SUMIT™, and SPX™. For five consecutive years, VersaLogic has received the coveted "Platinum" level vendor rating based on independent user surveys by technology research firm VDC Research Group, Inc. VersaLogic received ISO 9001:2008 certification in 2009 and was one of the first companies in North America to be registered to the 2008 revision of the standard. For more information, visit www.VersaLogic.com.

ATEN Unveils 2-Port USB 2.0 DVI Cable KVM Switch with Windows 7 Support

ATEN International — Sun, 07 Mar 2010 17:58:24 -0800

Taipei, Taiwan - ATEN International, a leading designer, manufacturer and distributor of advanced communication solutions, expands its PETITETM series by introducing a 2-port USB 2.0 DVI KVM Switch - the CS682. This new compact KVM switch allows users to control two USB computers from one USB keyboard, one USB mouse and one DVI monitor. Featuring an unbeatable combination of DVI functionality, multiplatform support, and enhanced user-friendly operations, the CS682 allows users to keep up with the latest innovations in desktop multimedia applications.

For a tidy workplace and trouble-free installation, the CS682 features a compact design and two built-in 1.2m cables. Users can switch between the computers via hotkeys or the innovative remote port selector. The CS682 also offers the latest mouse port-switching function that allows users to simply double-click on the scroll wheel of a USB mouse to change ports.

The CS682 is fully compatible with the DVI-Digital standard. It is also equipped with Video DynaSyncTM technology, which eliminates any problems occurring during computer boot-up and helps maintain monitor settings, thus optimizing resolution and ensuring the best image quality while switching between ports. Furthermore, the CS682 provides great image quality with a resolution of up to 1920 x 1200 and works seamlessly with the increasingly popular wide-screen LCD displays.

The device is compatible with many platforms, including Windows, Mac, Sun and Linux, as well as Windows 7. In addition, it is audio-enabled, supporting microphones and speakers. With a full bass response, the CS682 provides a rich sound experience for 2.1 surround sound systems. As the KVM and audio focus can be switched independently, users can, for example, listen to audio output on one PC while playing video games or working with office applications on another PC.

'Convenience and product quality is what really counts for every computer user. ATEN International is offering a high quality, state-of-the art switch which is perfect for the SOHO environment. A remote port selector, the DVI standard, Windows 7 support and many other innovative features ensure that CS682 users enjoy comfort while multi-tasking, as well as a superior sound and visual experience' - says Kevin Chen, President of ATEN International.

Another user-friendly feature is power on detection, which allows the CS682 to automatically switch to the other powered-on computer when either is shut down. Furthermore, the CS682's USB 2.0 mouse port can be used for a USB hub and USB peripheral sharing, providing yet more convenience for the desktop user.

About ATEN

ATEN International Co., Ltd. is specialized in connectivity solutions in information technology. Established in 1979, ATEN is today considered the leading manufacturer of KVM Switches worldwide. This prominent position was reached by continuously high investment in research and development, resulting in numerous patents and exemplified by the sophisticated ASIC, developed in the ATEN labs and manufactured by ATEN. The product range today covers hundreds of connectivity products, providing complete KVM solutions from entry level to the enterprise market. Among the customers of ATEN are large, companies with global operations, midrange and small businesses, as well as ambitious private users. For further information, please visit www.aten.com

Total Phase Showcases the Beagle(tm) USB 5000 SuperSpeed Protocol Analyzer and the Komodo(tm) CAN Duo Interface at the IIC China Conference

Total Phase — Fri, 05 Mar 2010 01:53:31 -0800

Shenzhen, China (PRWEB) March 4, 2010 -- Total Phase, a leading provider of industry-leading embedded systems tools, will be previewing two new products at the IIC China Conference & Exhibition in Shenzhen on March 4-5, 2010.

Beagle USB 5000 SuperSpeed Protocol Analyzer

Total Phase will be previewing the Beagle™ USB 5000 SuperSpeed Protocol Analyzer, the world's most affordable USB 3.0 analyzer. At less than $10,000, the Beagle USB 5000 SuperSpeed analyzer is a powerful tool, able to capture and display SuperSpeed USB 3.0 data in real time with the industry-recognized Data Center Software.

USB 3.0 presents new challenges for developers which makes an affordable protocol analyzer, like the Beagle USB 500 SuperSpeed analyzer, crucial to successful development of new USB 3.0 products.

Total Phase is also pleased to announce the Komodo™ CAN Duo Interface, a two-channel USB-to-CAN adapter capable of active CAN data transmission and non-intrusive bus monitoring. The competitively priced Komodo CAN Duo Interface is a powerful solution for the automotive, industrial, medical, military industries and more.

Please visit Total Phase at IIC China in Shenzhen on March 4-5 to see demonstrations of these products, as well as our entire suite of field-tested tools for USB, I2C, and SPI.

Helping Developers Deliver USB 3.0 Products

The Beagle USB 5000 SuperSpeed Protocol Analyzer complements Total Phase's existing line of USB analyzers. Developers already familiar with the award-nominated Data Center Software will recognize features including live data display during a capture, real-time class level decoding, and more.

"USB 3.0 presents new challenges for developers," Derek Fung, senior engineer at Total Phase points out, "which makes an affordable protocol analyzer crucial to successful development of new USB 3.0 products. The Beagle SuperSpeed USB analyzer will be a key asset to bringing new products to market on-time and on-budget.

The Beagle USB 5000 SuperSpeed analyzer will be available in Q2/Q3 2010.

Breaking New Ground in CAN

Due in part to customer demand, Total Phase is launching a robust new line of tools for CAN developers. The Komodo CAN Duo Interface is a rugged and reliable industrial solution that features two independently customizable CAN channels, independent galvanic isolation for each channel, bus monitoring with real-time software filtering, and precise timing resolution.

"The Komodo CAN Duo Interface will help engineers save time by providing visibility into any CAN system," adds Etai Bruhis, engineer at Total Phase. "Not only can the Komodo interface send and receive CAN data, it can also act as a high-performance bridge to relay messages directly between two CAN buses."

The Komodo CAN Duo Interface will be competitively priced and available in Q2 2010.

About Total Phase

Total Phase manufactures user-friendly, powerful, and affordable USB, I2C, SPI, and CAN development tools for embedded systems engineers. Total Phase tools combine best-of-breed features such as Windows, Linux, and Mac OS X support, a royalty-free API, free software updates, and free lifetime support.

For more technical information and online videos, please visit www.totalphase.com.

New SBCs and Embedded Systems with the latest Intel(r) Atom(tm) Processor D510

IEI — Thu, 04 Mar 2010 18:01:57 -0800

The IEI PICOe-PV-D510 is a sophisticated half-size CPU card with high performance and low power consumption. The high performance 45 nm dual-core Intel® Atom™ processor D510 with 1 MB L2 cache ensures high data throughputs. The PICOe-PV-D510 supports dual display through a single-channel 18-bit LVDS interface (up to 1366x768 WXGA resolution) and an analog CRT port. The analog CRT port supports resolutions up to 2048x1536 and supports hot plugging. The Intel® Graphics Media Accelerator (GMA) 3150, with GFX core rendering speed of 400 MHz, is integrated in the processor and enhances graphics performance.

The Intel® Atom™ processor D510 is paired with the Intel® 82810HM I/O controller which provides six PCI Express x1 and four PCI interfaces which allow for system expansion and speedy data delivery for real-time control. The system comes with built-in 512 MB 667 MHz DDR2 memory with the option of an additional 1.5 GB via DDR2 SO-DIMMs which improve the data delivery with less data lost and fewer delays.

The PICOe-PV-D510 has a variety of I/O and storage interfaces including two RS-232 serial ports, two PCIe GbE ports, three SATA II ports, seven USB 2.0 ports, one CompactFlash™ Type I/II slot and one audio interface that supports 7.1 channel HD audio via the IEI AC-KIT883HD audio kit.

The IEI PM-PV-D510 is a sophisticated, low power consumption PC/104 form factor SBC. The single-core Intel® Atom™ processor D510 with a two 512 KB L2 cache is paired with the Intel® 82810HM I/O controller. Versatile graphics support by Intel® Graphics Media Accelerator 3150 is provided through a single-channel 18-bit LVDS interface (up to 1366x768 WXGA resolution) and an analog CRT port. The analog CRT port supports resolutions up to 2048x1536 and supports hot plugging. The small form factor allows systems to be developed for space critical applications. In addition, support for Windows® XP Professional, Windows® XP Embedded, Windows® CE, Linux operating systems make the PM-PV-D510 ideal for embedded systems.

The PM-PV-D510 is designed with plentiful I/O and storage interfaces including one RS-232, one RS-232/422/485, four USB 2.0, one SATA II, one CompactFlash™ Type I/II slot, a PCI-104 slot and one GbE LAN by Intel® 82567V GbE Ethernet PHY.

The IBX-300 is good choice for a fanless and ready-to-use compact embedded system with 160 mm x 125 mm x 44 mm. This system is designed with the Intel® Atom™ processor D510 with 1 MB of cache and is paired with the Intel® 82801HM I/O controller. One GB DDR2 SDRAM system memory and one 2.5” SATA HDD interface are included.

Other features of the Intel® Atom™ processor D510 are two DB-9 connectors to support eight video capture channels totally, which are 8-channel video capture for analog camera (4-channel video capture for each DB-9 connector), Conexant CX25850 multiport composite video decoder (8 inputs) and CX25821 (PCIe x1) media bridge.

For Ethernet, the IBX-300 is designed with the Intel® 82567V GbE Phy and one PCIe interface. The multi communications are PCIe x1 signal via Intel® 82801HM I/O controller, LAN signal via Intel® 82567V GbE Phy and LAN via standard RJ-45 with ACK/LINK LED connector on rear side. In the video and audio communication, IBX-300 has the Intel® GMA 3150 rendering speed of 400MHz on board, and built-in one VGA, one RS-232/422/485 COM port, four USB connectors, two audio jack connectors for line-out and MIC-in, and one WiFi support. It supports analog CRT up to 2048x1536 and hot plug.

For more information, please visit www.ieiworld.com or contact sales@iei.com.tw for further information.

Lanner introduces latest dual-core Intel(r) Atom(tm) processor D510-based network appliance at RSA Conference 2010

Lanner Electronics Inc. — Thu, 04 Mar 2010 09:26:29 -0800

(Taipei, Taiwan- March 4th, 2010) Lanner Electronics, Inc. a leading ODM and OEM of networking platforms, today announced the FW-7565, a new 1U rackmount network appliance built around the new dual-core Intel® Atom™ processor D510 supporting 8 GbE ports. The release of the FW-7565 is timed to coincide with RSA Conference 2010, the industry’s largest gathering of network security personnel.

“The FW-7565 is designed for the cost sensitive entry-level network security segment,” said Terence Chou, the Product Planner for Network Security Appliances “As the first 1U network appliance from Lanner to utilize the dual core Intel® Atom™ processor D510, the FW-7565 delivers greater CPU and network processing sufficient for your network security needs, while consuming minimal power.”

The Intel Atom processor D510 operates at 1.66GHz and includes Intel® HyperThreading Technology. The FW-7565 features up to 8 GbE network ports based on the Intel® network controllers. Customers can choose between multiple NIC options including a 6GbE SKU, 8GbE SKU and by-pass options.

Additionally, the FW-7565 features a front graphic LCM panel, dual USB 2.0 ports, a RJ45 Console Port and a VGA output. There is 1 onboard SO-DIMM socket for up to 2GB of memory, and space for a single 2.5” or 3.5” hard drive disk. Other features include an internal RTC with Li-battery, a WatchdogTimer and a mini PCIe connector for expansion opportunities.

To ensure reliable operation, the FW-7565 comes with two ultra-quiet system fans, one for the 60W power supply and one for the cooling the system, and a passive CPU heat sink.

The FW-7565 is available today for Lanner network appliance customers.

For more information please visit our website www.lannerinc.com/Atom/FW-7565

or contact our sales department at sales@lannerinc.com

About Lanner

Founded in 1986 and publicly listed (TAIEX 6245) since 2003, Lanner Electronics, Inc. is an ISO 9001 certified designer and manufacturer of network application platforms, network video platforms and applied computing hardware for first-tier companies. Lanner's expertise also extends to include driver and firmware support, enabling customers to optimize hardware and software communication to achieve faster time to market. With headquarters in Taipei, Taiwan and branches in the U.S. and China, Lanner is uniquely positioned to deliver custom technical solutions with localized, value-added service. Lanner is an Associate Member of the Intel® Embedded and Communications Alliance, a group of companies committed to developing modular, standards-based solutions based on technologies, processors, products, and services from Intel®.

SFF-SIG Adopts CoreExpress(r) Specification to Strengthen PCIe 2.0-Ready COM Portfolio

SFF-SIG — Thu, 04 Mar 2010 01:22:12 -0800

Nuremberg, Germany, March 2, 2010 - The Small Form Factor Special Interest Group (SFF-SIG), a collaboration of leading suppliers of embedded component, board and system technologies, today announced the adoption and release of the CoreExpress® Specification revision 2.1. CoreExpress was originally developed as a proprietary standard by LiPPERT Embedded Computers GmbH. Under the terms of an agreement between SFF-SIG and LiPPERT, the entire embedded community will now be able to develop CoreExpress modules and applications without regard to confidentiality and without royalties of any kind. Use of the CoreExpress logo will require membership in SFF-SIG.

“The dynamic and vibrant nature of SFF-SIG enabled the group to move rapidly to embrace the CoreExpress Specification”, said Paul Rosenfeld, SFF-SIG President. “Eight companies participated in the review process which was completed within a 90 day window. The structure of SFF-SIG and hard work by its members has given the SIG a strong leadership position in the development and release of next-generation COM standards.”

“I’m thrilled that CoreExpress has achieved the status of an open standard through SFF-SIG”, said Peter Lippert, President of LiPPERT Embedded Computers GmbH. “This is an ideal vehicle to make advanced CoreExpress technology available to the entire embedded community.”

The newly released version of the specification contains a number of enhancements proposed by SFF-SIG members during the evaluation process. These include the support of the emerging DisplayPort interface and the addition of sufficient reserve pins to enable upward compatible support for USB 3.0 in the future. The new version is upward compatible from the current CoreExpress 2.0 version previously published by LiPPERT.

CoreExpress uses a single connector baseboard interface, eliminating the registration problems frequently found with two-connector Computer on Module products. Fully digital to reduce system noise and EMI, CoreExpress is the smallest x86 computer-on-module in the market, measuring a mere 58x65mm. With dedicated interface pins for optional CAN bus support, CoreExpress ushers in a new era of ‘application COMs’ tailored for vertical markets.

Three characteristics establish the CoreExpress Specification as the first of a new generation of Computer on Module. First, the connector used by CoreExpress modules has been confirmed to operate at the speeds required for PCI Express Generation 2. Secondly, the specification contains an option to configure the SDVO interface pins for the new DisplayPort interface. Third, sufficient reserved pins are included in the definition to enable inclusion of at least two USB 3.0 ports in a future release of the specification.

The CoreExpress baseboard interface includes PCI Express (configured as 1 x4 lane or 4 x1 lanes), RGMII Ethernet Interface, 2 SATA ports, 1 CAN bus port, 8 USB 2.0 ports (one of which may be configured as a client), LPC bus, SM bus, High Definition Audio, SDVO (multiplexed with Display Port), 24-bit LVDS flat panel interface, backlight control and an SD/SDIO/MMC 8-bit interface.

The CoreExpress Specification is available for download from the SFF-SIG web site at www.sff-sig.org. CoreExpress modules are available today from LiPPERT Embedded Computers.

About the Small Form Factor SIG

The Small Form Factor Special Interest Group is an international organization devoted to identifying, creating, and promoting standards that help electronics system and device manufacturers and integrators move to small form factor technologies and building blocks in their products, and protect their investments. Benefits of small form factor products include smaller size, reduced power consumption (eco-friendly, “green” products), and greater reliability compared to larger legacy products.

The SIG’s philosophy is to embrace the latest technologies, as well as maintain legacy compatibility and enable smooth transition solutions to next-generation interfaces. For more information about the SFF SIG, visit www.sff-sig.org or e-mail info@sff-sig.org.

CoreExpress is a registered trademark of SFF-SIG. ISM, SUMIT, SUMIT-ISM, COMIT, Pico-ITXe, Pico-I/O and MiniBlade are trademarks of SFF-SIG. All other trademarks are the property of their respective owners.

Boardset Merges COM Express Cores with Triple-Play I/O

Diamond Systems — Wed, 03 Mar 2010 08:19:56 -0800

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and I/O expansion modules targeting real-world applications, today unveiled Magellan, a board-level “embedded-ready subsystem” (ERS) that combines the benefits of computer-on-modules (COMs) with those of stackable single-board computers (SBCs). This announcement means system manufacturers no longer need to design a custom carrier to deploy COM Express modules.

Magellan's CPU core consists of a COM Express CPU module and heatspreader mounted on its bottom side, resulting in optimal thermal management and increased space for I/O functions and connectors.

This innovative design makes it possible for Magellan to integrate dual gigabit Ethernet LAN ports, a 7-30V DC/DC power supply, a full set of peripheral interface header connectors, stackable PCI-104 or SUMIT expansion, and a FeaturePak I/O module socket, in addition to a complete embedded-PC core -- all within the 95 x 125 mm COM Express footprint. Stacking boards in one direction greatly simplifies the thermal design of embedded systems based on high-end CPUs, avoiding costly custom heat pipes and milled aluminum thermal-transfer blocks.

Magellan is offered in a range of models that vary according to the choice of COM Express CPU module and SDRAM capacity (socketed or soldered-on). It can be used either as a highly integrated embedded component, or as a platform for application development and reference designs.

The Magellan baseboard includes connectors and interfaces for USB, serial, gigabit Ethernet, audio, and SATA mass storage devices. It also supports the connection of a wide variety of displays, including CRTs, LVDS-interfaced flat panels, and televisions..

Magellan ERS Availability

Small quantities of the Magellan embedded-ready subsystem are available in 30 days in several models. Development kits that include the Magellan models shown below plus a cable kit and utility software are also available.

About the FeaturePak I/O Modules Standard

The FeaturePak specification defines tiny, application-oriented personality modules – three-fifths the size of a credit card – that snap into low-cost, low-profile sockets on single board computers (SBCs), computer-on-module (COM) baseboards, and full-custom electronic circuit boards. FeaturePak modules interface to the host system via a single low-cost, high-density, 230-pin connector, which carries PCI Express, USB, I2C, and several other host-interface signals, plus up to 100 points of application I/O per module. The FeaturePak host interface is CPU agnostic and is compatible with both Intel- and RISC-architecture systems. Additionally, the modules can easily be integrated into embedded designs along with Qseven, COM Express, SUMIT, PCI/104-Express, EBX, and EPIC. For more information, visit www.featurepak.org.

About Diamond Systems

Founded in 1989, Diamond Systems Corporation is a leading supplier of compact, rugged, wide-temperature embedded computing solutions for a wide range of applications in fixed and mobile environments. The company is the originator of the FeaturePak I/O modules standard, was an early adopter of PC/104 technology and today is one of the leading worldwide suppliers of embedded I/O modules and highly integrated single board computers combining CPU and data acquisition on a single board. Diamond’s extensive product line includes A/D, D/A, digital I/O, serial communications, wired and wireless networking, and power supply modules as well as single-board computers and enclosures. Diamond also offers a full range of system solutions, including the capability to customize boards or systems to meet the needs of a particular application. The privately held company is based in Mountain View, California, in the heart of Silicon Valley. For more information, visit www.diamondsystems.com or call 1-800-36-PC104.

COM Express Modules Take the Heat

Diamond Systems — Wed, 03 Mar 2010 08:14:30 -0800

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and I/O expansion modules targeting real-world applications, today launched a family of COM Express 1.0 compliant computer-on-modules (COMs) based on Intel’s low-power, high-performance Atom and Core processors. Rated for operation over enhanced ( 20o to +71o C) and extended ( 40o to +85o C) temperature ranges, the modules are well suited to a broad range of fixed and mobile applications in the defense, avionics, transportation, energy management, and industrial automation sectors.

Within the industry-standard 3.7 x 4.9-inch (95 x 125 mm) COM Express footprint, the CME-Atom and CME-965 each integrate a high-performance, low-power Intel processor, DDR2 SDRAM, and a complete set of PC-compatible system controllers and interfaces. Both modules provide eight USB 2.0 ports, a gigabit Ethernet LAN interface, high-resolution VGA CRT and LVDS LCD video, audio in and out, and mass storage interfaces. Additionally, both provide PCI Express, 32-bit PCI, and LPC expansion bus signals for connection to external generic or application-specific baseboards.

Supported operating systems currently include Windows XP and Linux 2.6, with support for additional OSes and RTOSes (real-time OSes) available on request.

Pricing and Availability

Small quantities of the CME-Atom and CME-965 COMs are available within 30 days.

Also available are several pre-integrated development kits, which include generic or application-oriented COM Express baseboards, complete sets of interface cables, OS driver software, and comprehensive documentation. Contact Diamond Systems regarding development kit pricing, volume discounts, and application-specific customization services.

About Diamond Systems

JetCard5010G-P Embedded 8+2Giga Managed Switch Board with Low Power Consumption for Embedded Systems Integration

Korenix Technology — Tue, 02 Mar 2010 18:18:30 -0800

Korenix is proud to launch JetCard 5010G-P, the new compact High-Bandwidth Embedded 8+2G Managed Switch Board with 3.3V power source line, specifically designed to fit into small systems in factory floors, manufacturing or process plants and other automation facilities. With 2 Giga SFP combo ports and the MSR network redundancy technology the JetCard 5010G-P is capable of providing extended and reliable redundant gigabit rings with just 5 milliseconds recovery time. Moreover, equipped with advanced management features the embedded switch board with low power consumption ensures outstanding network management and provides automatic topology visualization while becoming the best solution for integration in embedded task-specific systems.

Outstanding Performance through High Bandwidth Interfaces

JetCard 5010G-P is a high-bandwidth embedded managed switch board equipped with eight 10/100-TX and dual 1000Base-X SFP front ports for providing flexible system connectivity in large scale complex networks via various interfaces. Using the 2 Gigabit ports the embedded switch board is capable of providing high-bandwidth fiber/copper uplink networks in widespread automation areas.

Compact Module Size with Low Power Input for Easy Integration

The board size of the switch is as small as 127.4mm x 122.5mm and with 30mm height, which allows users to easily integrate the board into small systems. Using 3.3VDC as power input and delivering 10Watts low power consumption, the embedded system outstands from other embedded switch boards and provides high network performance while delivering power without additional external power inputs.

Advanced Networking and Efficient Management with Auto-Network Topology

To fulfill the advanced management, control and security requirements in factory floors, JetCard 5010G-P incorporates various advanced network management features. With the 5 millisecond recovery time of the Korenix MSR redundancy protocol, the JetCard 5010G-P ensures network reliability while easily forming 4 Fast Ethernet and 1 Gigabit redundant ring networks. Furthermore, the managed high density switch board is capable of equipping embedded systems with 9K Jumbo frame feature for allowing transmitting larger files with fewer segments.

In addition to SNMPv3, the switch board also incorporates LLDP function and perfectly works with the Korenix patented JetView Pro industrial network management software allowing administrators to automatically discover devices and efficiently manage the industrial network performance in mission critical environments. The JetCard 5010G-P combines more advanced Layer2 management protocols, such as the DHCP option 82, 256 VLAN, QoS, IGMP snooping, etc. for efficiently controlling and managing the network performance.

Equipped with advanced management and security features, the smartly-designed compact switch board with flexible interface, low power consumption and -25~70oC wide operating temperature is the perfect solution for integrating in small embedded systems while providing non-stop and high performance data transmission in industrial automation applications.

Major features of JetCard 5010G-P are:

* Embedded Managed Switch Board with 127.4 mm (W)x 122.5mm(D), under 30mm(H) board size

* 8 10/100Base-TX plus 2 Gigabit SFP ports (1000Base-X Fiber)

* 3.3V DC Power Input socket

* Console socket for out-of-band management

* Jumbo Frame up to 9,216 Bytes for large packet transmission

* Korenix Multiple Super Ring and RSTP for network redundancy

* Supports LLDP and JetView Pro i2NMS software for auto topology visualization and efficient group management

* SNMPv1/v2/v3c, RMON for remote management

* Advanced management by up to 8K MAC Table, 256 802.1Q VLAN, IGMP Snooping, GMRP, port Trunking, LACP, DHCP Server, DHCP Option 82 and Rate Control

* Advanced security by 802.1x and Access Control List

Korenix Technology

www.korenix.com; www.korenixembedded.com

+886-2-8911-1000

sales@korenix.com

Diamond Mints "World's First" FeaturePak DAQ Module

Diamond Systems — Tue, 02 Mar 2010 08:24:16 -0800

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and I/O expansion modules targeting real-world applications, today unveiled the world’s first data acquisition I/O module compatible with the newly-introduced FeaturePak embedded I/O expansion module standard. Despite its diminutive size (see actual size photo, below), the FP-DAQ1616 integrates Diamond’s newest and fastest analog I/O technology, and interfaces to host systems via the FeaturePak host interface’s high-speed PCI Express bus interface.

The FP-DAQ1616 provides sixteen 16-bit A/D inputs, sampling at 2MHz and supported with a generous 16K sample FIFO for reliable data collection in any environment. Advanced A/D features include programmable input ranges, polarity, mode, and FIFO threshold. The module also offers sixteen 16-bit D/A output channels, with programmable range and polarity.

Another important of the FP-DAQ1616 is its industry-leading autocalibration technology, with independent calibration factors for each input and output range, which ensures maximum A/D and D/A accuracy across all operating modes and throughout the entire 40oC to +85oC extended operating temperature range.

Other features provided by the tiny FeaturePak module include seven 8-bit digital I/O ports (with a mix of bit wide and byte-wide direction control), two 32-bit up/down counter/timers with programmable input source and gate, four 24-bit pulse-width modulation circuits with 0-100% duty cycle, and a watchdog timer.

Diamond supplies a Universal Driver software toolkit at no extra charge with the FP-DAQ1616 FeaturePak module, to ease the task of supporting its data acquisition functions in applications under Linux, Windows XP, Windows Embedded Standard, and Windows Embedded CE. The toolkit also includes demo programs and example code for each supported OS, to further accelerate application development.

About the FeaturePak I/O Module Standard

FP-DAQ1616 Pricing and Availability

Small quantities of the FP-DAQ1616 data acquisition FeaturePak module are available in 60 days, in both analog I/O and output-only models, priced at $495 and $325, respectively.

About Diamond Systems

Diamond Systems Joins Qseven Consortium

Diamond Systems — Tue, 02 Mar 2010 08:12:31 -0800

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and I/O expansion modules targeting real-world applications, today announced that it has become a Participating Member of the Qseven Consortium, a multi-vendor standards body dedicated to advancing the Qseven computer-on-module (COM) standard.

Through its participation in the Qseven Consortium, Diamond will develop and deliver off-the-shelf and customized board-level subsystems that integrate Qseven embedded computing cores, Diamond’s industry-leading analog, digital, serial, wireless, and other I/O technologies, and flexible expansion via industry-standard FeaturePak modules. These modular application-ready subsystems will assist OEMs in precisely meeting the budget, energy consumption, and performance requirements of their applications, while shortening time-to-revenue and reducing development costs and risks.

“The Qseven COM (computer-on-module) standard packs the latest low-power, embedded processors, chipsets, and standard system interfaces into a highly compact package while eliminating the need for expensive connectors that unnecessarily burden system costs,” noted Diamond Systems Founder and President Jonathan Miller. “Additionally, Qseven COMs and FeaturePak I/O modules are extremely well suited for deployment together on standard and customized application baseboards.”

“We’re excited to welcome Diamond Systems as the newest Participating Member of the Qseven Consortium,” said Martin Danzer of Qseven Consortium Founding Member company congatec AG. “As the originator of the newly introduced FeaturePak I/O module standard, Diamond has added a significant new companion technology for adding off-the-shelf I/O modules to embedded designs based on Qseven embedded computing cores.”

About the Qseven Consortium

The Qseven Consortium, founded in 2007 by congatec AG, Seco s.r.l. and MSC Vertriebs GmbH, is a multi-vendor organization dedicated to advancing use of the Qseven computer-on-module (COM) standard throughout the global embedded computing industry. Qseven COMs adhere to a standardized form-factor of 70mm x 70mm and plug into application baseboards via a single, high-speed, 230-pin MXM connector. Qseven modules integrate all core functions of an embedded computer, including CPU, memory, and interfaces for graphics, audio, mass storage, network, USB and other I/O expansion. The MXM baseboard interface connector carries all signals to and from the Qseven module, including system buses such as PCI Express and LPC, and I/O interface signals for functions such as USB, SATA, gigabit Ethernet, graphics, and audio. The Qseven Consortium currently has 21 Participating Members.

Tiny Embedded I/O Expansion Card Format Taps PCI Express

Diamond Systems — Tue, 02 Mar 2010 08:06:44 -0800

Eight companies in the global embedded computing market jointly unveiled the FeaturePak™ standard and products at the Embedded World tradeshow in Nuremberg today. The FeaturePak specification defines tiny, application-oriented personality modules – three-fifths the size of a credit card – that snap into low-cost, low-profile sockets on single board computers (SBCs), computer-on-module (COM) baseboards, and full-custom electronic circuit boards.

FeaturePak modules interface to the host system via a single low-cost, high-density, 230-pin connector, which carries PCI Express, USB, I2C, and several other host-interface signals, plus up to 100 points of application I/O per module. The host interface is CPU agnostic and is compatible with both Intel- and RISC-architecture systems. Additionally, the modules can easily be integrated into embedded designs along with Qseven, COM Express, SUMIT, PCI/104-Express, EBX, and EPIC.

The companies participating in today’s FeaturePak launch include Diamond Systems Corp., originator of the standard, plus FeaturePak Initiative Charter Members Arbor Technology Corp., Cogent Computer Systems Inc., congatec AG, Connect Tech Inc., Douglas Electronics Inc., Hectronic AB, and IXXAT Automation GmbH. FeaturePak-related products unveiled or announced today at Embedded World by the FeaturePak Initiative’s Charter Members include several FeaturePak I/O modules and FeaturePak-expandable COM baseboards.

“Following the FeaturePak Initiative’s initial launch, we intend to turn the FeaturePak specification, trademark, and logo over to a suitable standards organization so it can become an industry-wide, open-architecture, embedded standard,” said Jonathan Miller, Founder and President of Diamond Systems Corp., which originated the FeaturePak standard and was a charter member of the PC/104 Consortium.

“VDC Research has believed in the modular approach to embedded computing since the introduction of COMs,” commented J. Eric Gulliksen, Senior Analyst with VDC Research Group’s Embedded Hardware and Systems practice. “FeaturePak provides a logical next step to this concept, providing versatile I/O in a standardized, small form factor, interchangeable module, with a value proposition similar to that of COMs. VDC commends Diamond Systems and the other firms involved in the FeaturePak effort for bringing modular embedded computing to an exciting new level.”

"In order to reduce development time and risks, embedded developers are increasingly turning to modular design methodologies that leverage COTS macrocomponents," noted Dr. Jerry Krasner, Chief Analyst at Embedded Market Forecasters. "FeaturePak adds a new -- smaller and flatter -- dimension to what's been previously available in the embedded market. Additionally, it’s CPU, bus, and host form-factor agnostic and can coexist synergistically with both stackable approaches like PC/104 and SUMIT and computer-on-module approaches like COM Express and Qseven."

“The FeaturePak I/O expansion standard will accelerate the development of application-oriented baseboards for Qseven, COM Express, and XTX COMs,” added Gerhard Edi, CEO of congatec AG, which originated the Qseven COM standard and is one of the FeaturePak Initiative Charter Members. “In particular, FeaturePak I/O modules and Qseven COMs jointly provide the lowest profile modular board-level embedded solution available.”

Emerson Network Power and Freescale Semiconductor Collaborate on Power Architecture(r) Technology for Small Form Factor Boards

Emerson Network Power — Tue, 02 Mar 2010 04:32:30 -0800

Embedded World, NUREMBERG, Germany [March 2, 2010] - Emerson Network Power, a business of Emerson and the global leader in enabling Business-Critical Continuity™, and Freescale Semiconductor, a global leader in the design and manufacture of embedded semiconductors, today announced a collaborative effort to deploy Freescale multicore QorIQ processors on modular single-board computers (SBCs) based on the COM Express® small form factor.

The goal of the collaborative initiative is to deliver the power, performance, integration and broad feature sets associated with embedded processors to systems designers targeting the telecom, military, aerospace, medical and factory automation markets. Resulting products are intended to help OEMs simplify design cycles, reduce development costs and speed time-to-market.

The two companies will soon release a white paper on the web site of the PCI Industrial Computer Manufacturers Group (PICMG) that defines how to design systems using Freescale QorIQ processors on modular single-board computers based on the COM Express small form factor.

Based on Freescale's e500 core designed with Power Architecture® technology, QorIQ devices offer a broad range of price, performance and power options that are ideal for a variety of market requirements. QorIQ processors are the next generation successor to the ground breaking PowerQUICC device family, which pioneered the communications processor space.

“The availability of Power Architecture technology-based processors on small form factor boards will expand customer choices and allow OEMs to focus valuable R&D resources on solutions in their market place,” said Joe Pavlat, President of the PCI Industrial Computer Manufacturers Group. “I support the intent to get these ideas incorporated into appropriate standards.”

Computer-on-Modules (COMs) are highly integrated SBCs that provide the core functionality of a system and allow application-specific features to be designed onto a carrier board, creating a semi-custom embedded computing solution. Bringing these two technologies together eliminates the chip-level design effort, simplifying the OEM design cycle and reducing the customer’s hardware design time and cost. OEMs are able to focus on differentiating their product through software and other features and realize revenue sooner.

“With reduced design resources, an increasing number of OEMs are faced with challenging ‘build or buy’ scenarios, encouraging them to adopt SBC solutions in contrast to traditional chip-level design due to their ability to reduce development costs and enable a faster time-to-market,” said Dick DuBois, senior vice president of Emerson Network Power’s Embedded Computing business. “In addition to telecom markets, the combination of the Power Architecture and COM Express form factor will appeal to a broad customer base in military, aerospace, government, medical, automation and industrial.”

“Integrating Freescale’s flagship networking processors into standardized form factors holds the potential to dramatically enhance innovation across a range of markets where high performance and low power are critical,” said Brett Butler, vice president and general manager of Freescale’s Networking Processor Division. “Freescale is pleased to collaborate with Emerson to help take SBC solutions to new levels of performance and energy efficiency.”

About Emerson Network Power

Emerson Network Power, a business of Emerson, is the global leader in enabling Business-Critical Continuity™ from grid to chip for telecommunication networks, data centers, health care and industrial facilities. Emerson Network Power provides innovative solutions and expertise in areas including AC and DC power and precision cooling systems, embedded computing and power, integrated racks and enclosures, power switching and controls, monitoring, and connectivity. All solutions are supported globally by local Emerson Network Power service technicians. For more information on Emerson Network Power’s embedded computing products and services including AdvancedTCA®, COM Express®, CompactPCI®, embedded motherboards, MicroTCA®, VMEbus and OpenSAF® for original equipment manufacturers and systems integrators in the telecommunications, industrial, aerospace/defense and medical markets, visit www.EmersonNetworkPower.com/EmbeddedComputing. Learn more about Emerson Network Power products and services at www.EmersonNetworkPower.com.

About Freescale Semiconductor

Freescale Semiconductor is a global leader in the design and manufacture of embedded semiconductors for the automotive, consumer, industrial and networking markets. The privately held company is based in Austin, Texas, and has design, research and development, manufacturing or sales operations around the world. www.freescale.com.

Curtiss-Wright Controls Introduces its First Rugged 3U OpenVPX(tm) Data Recorder

Curtiss-Wright Controls Electronic Systems — Tue, 02 Mar 2010 03:59:42 -0800

DAYTON, OH – March 2, 2010 -- Curtiss-Wright Controls Electronic Systems, a business group of Curtiss-Wright Controls and a leading designer and manufacturer of rugged deployed systems for the aerospace and defense market, has introduced the new conduction-cooled Vortex VR-7310 3U VPX/VPX-REDI/OpenVPX™ (VITA 46/48/65) data recorder. This small form factor data recorder board enables system designers to quickly and easily integrate high-volume, continuous (streaming) data recording in a small compact package. The VR-7310 is designed for use in a broad range of space, weight and power (SWaP)-constrained critical applications in both manned and unmanned ground, air, and sea vehicles, including signal intelligence, image processing, FLIR radar, sonar, RF tuners, MRI and cameras.

“Today’s advanced sensor systems require the capability to record and retrieve high-speed sensor data in a wide range of harsh environments,” said David Dietz, vice president and general manager of Curtiss-Wright Controls Electronic Systems. “The VR-7310 delivers the high bandwidth and system operability of the VPX and OpenVPX standards, coupled with the size, weight and power advantages of the 3U form factor, to provide an ideal recording system for rugged deployed data management and storage applications.”

The VR-7310 data recorder provides a quick and cost effective way to store and retrieve captured data from a variety of sensor interfaces without interruption. The VR-7310 supports storage includes eight (8) external 6 Gbps SAS/SATA links that enable direct attachment to eight (8) 1.8” or 2.5” drives deployed on disk carrier cards or VPX3-FSM Flash Storage Devices. This high performance 3U VPX recording engine features an on-board XMC/ expansion site, supporting a wide variety of I/O such as Serial Front Panel Data Port (sFPDP), Gigabit Ethernet (GbE), 10GbE and analog I/O, as well as FPGA processing. The board’s AMCC 460SX CPU is supported with 2GB of DDR2 SDRAM memory for recording buffers.

Vortex Software

Curtiss-Wright Controls supports the Vortex data recorder family with software that enables users to easily manipulate or analyze data while it is recorded or during playback. The Vortex software provides full access to a well-defined and fully documented interface to the data before it is written to or read from disk. Curtiss-Wright Controls also provides the XML-RPC API which enables the customer’s application to control system operations including the number of channels to acquire, disk grouping, playback from offsets in the recording, disk group management. For custom applications, the Vortex software provides users with an easy to use API for creating high-speed recording systems with a wide range of I/O options. Application Programming services are available upon request.

The Vortex Family of Storage Solutions

The VR-7310 is the newest member of Curtiss-Wright Controls’ Vortex family of high-performance data recorder and rugged storage systems designed to support the severe environment of military applications that range from high-speed streaming recorders to network centric file servers.

The Vortex family supports applications including instrumentation recording, mission recording, SIGINT/ELINT recording and storage for both rugged and lab environments.

VR-7310 Features:

· Powerful CPU (AMCC 460SX)

· 8 external 6 Gbps SAS/SATA links

· Pluggable IO on XMC site

· VITA 46 3U form factor

· Fully rugged conduction-cooled

· Network Attached Storage (NAS) capability

For information on pricing and availability of the VR-7310, please contact the factory.

For editorial information regarding Curtiss-Wright Controls Electronic Systems products or services, contact John Wranovics, public relations director, Curtiss-Wright Controls, Tel: (925) 640-6402; email. jwranovics@curtisswright.com.

Inquiries: Please forward all Sales and reader service inquiries to Matt Young, Curtiss-Wright Controls Electronic Systems, Tel: (937) 252-5601 x1363; Fax (937) 258-2729; email: systeminfo@curtisswright.com

About Curtiss-Wright Controls Electronic Systems

Curtiss-Wright Controls Electronic Systems is one of the industry’s most comprehensive and experienced single sources for rugged, integrated solutions that are qualified for military platforms. Our product and service expertise includes Motion Control, Network Centric Computing, Rate Sensor Assemblies, Vehicle Management Computers, High-Speed Recording & Storage, and Electronic Manufacturing Services. The Electronic Systems business group serves the defense, aerospace, commercial and industrial markets and is part of Curtiss-Wright Controls, Inc. For more information about Curtiss-Wright Controls Electronic Systems, visit www.cwcelectronicsystems.com.

About Curtiss-Wright Controls, Inc.

Headquartered in Charlotte, N.C., Curtiss-Wright Controls is the motion control segment of Curtiss-Wright Corporation (NYSE: CW). With manufacturing facilities around the world, Curtiss-Wright Controls is a leading technology-based organization providing niche motion control products, subsystems and services internationally for the aerospace and defense markets. For more information, visit www.cwcontrols.com.

Curtiss-Wright Controls Boosts Speed on ADC FMC Card

Curtiss-Wright Controls Embedded Computing — Tue, 02 Mar 2010 03:49:30 -0800

Upgraded ADC510 FMC Card Now Delivers 550MSPS Output

HIGH WYCOMBE, UK – March 2, 2010 -- Curtiss-Wright Controls Embedded Computing, a business group of Curtiss-Wright Controls and a leading designer and manufacturer of commercial off-the-shelf (COTS) VME, VPX, VXS, and CompactPCI products for the aerospace and defense (A&D) market, has announced the availability of a higher performance, faster version of its ADC510 FPGA Mezzanine Card (FMC/VITA 57) module. Now, featuring two enhanced Texas Instruments ADC devices, the ADC510 delivers sampling performance increased to 550MSPS with analog bandwidths >1.7GHz. Available in both air-cooled and conduction-cooled rugged versions, the ADC510 is aimed at DSP applications such as Signal Intelligence (SIGINT), Electronic Counter Measures (ECM), and Radar. The ADC510 makes it easier and faster for system developers to integrate FPGAs into their embedded system designs.

“Ideally suited to SDR and SigInt applications, the faster ADC510 illustrates Curtiss-Wright Control’s continued leadership in practical open standard rugged solutions such as FMC,” said Lynn Patterson, vice president and general manager Curtiss-Wright Controls Embedded Computing. “FMCs enable our customers to have access to new technology with simplified upgrades paths for future solutions which protects their investment.”

The ADC510 now supports two Texas Instruments ADS54RF63 ADC devices with each device supporting a sampling rate up to 550 MSPS and providing 12-bits of digital output. The ADC device interfaces are routed to the FMC connector to enable an FPGA on a baseboard to directly control and receive data. There is a choice of sample clock sources for the ADC510 including an onboard source that supports sampling rates of 300, 320, 400, and 500 MSPS as well as the ability to utilize an external sample clock. Input and output triggers are provided to enable multiple ADC510 modules to be synchronized to increase the number of input channels.

It complements Curtiss-Wright Controls’ growing family of high-speed ADC FMC cards, including the recently announced ADC512, FMC-520 and FMC-XCLK2 providing a complete ADC/DAC solution for DSP applications.

FMCs address the needs of FPGA centric I/O by enabling I/O devices that reside on an industry standard mezzanine card to be attached to, and directly controlled by, FPGAs that reside on a baseboard. The benefits of FMCs are a small footprint, reduced I/O bottlenecks, increased flexibility, and reduced cost by removing redundant interfaces. An FMC module is about half the size of a PMC mezzanine module. To maximize data throughput and minimize latency, the FMC connector has many pins that support high-speed signals for moving data between the FMC and an FPGA on the baseboard. FMCs are ideal for high speed analog I/O, digital I/O, fiber-optics, memory or even a DSP co-processor.

ADC510 Key Features:

· Dual Texas Instruments ADS5463 or ADS54RF63 12-bit analog to digital converters

· Onboard clock generator (300, 320, 400 or 500MSPS), external RF sample clock input.

· FMC/VITA 57 form factor

· Air- or conduction-cooled rugged versions

Software Support

HDL example code is available for the ADC510 for integration into the HDL development suite for Curtiss-Wright Controls’ FPGA baseboards. The ADC510 is provided with HDL example code to simplify and speed integration into the HDL development suite for integration with Curtiss-Wright Controls’ FPGA host boards.

About FMC (VITA 57)

FMC modules enable I/O devices that reside on an industry standard (VITA 57) mezzanine card to be attached to, and directly controlled by FPGAs that reside on a host board. About half the size of a PMC mezzanine module, FMCs provide a small footprint, reduced I/O bottlenecks, increased flexibility, and reduced cost through the elimination of redundant interfaces. To maximize data throughput and minimize latency, the FMC connector provides numerous I/O pins that support high-speed signals for moving data between the FMC and the FPGA.

Pricing for ADC510 starts at $5,000 US. Availability is off-the-shelf.

For editorial information regarding Curtiss-Wright Controls Embedded Computing Multi Computing products or services, contact John Wranovics, Director of Media Relations, Curtiss-Wright Controls Embedded Computing, Tel: (925) 640-6402; email. jwranovics@curtisswright.com. Web site: www.cwcembedded.com.

Inquiries: Please forward all Sales and reader service inquiries to Jerri-Lynne Charbonneau, Curtiss-Wright Controls Embedded Computing, Tel: (613) 254-5112; Fax: (613) 599-7777; e-mail: sales@cwcembedded.com.

About Curtiss-Wright Controls Embedded Computing

Curtiss-Wright Controls Embedded Computing is the industry’s most comprehensive and experienced single source for embedded solutions, ranging from Processing, Subsystems, Data Communication, DSP, and Video & Graphics to the most advanced board level components and fully integrated custom systems. The Embedded Computing group serves the defense, aerospace, commercial and industrial markets and is part of Curtiss-Wright Controls Inc. For more information about Curtiss-Wright Controls Embedded Computing, visit www.cwcembedded.com.

About Curtiss-Wright Controls, Inc.

Circuits, LLC Now Offers Rigid-Flex

Circuits, LLC — Tue, 02 Mar 2010 03:18:25 -0800

Murrysville, PA. Combining rigid and flexible substrates into a single printed circuit board offers designers the ability to improve reliability by reducing connector counts and complex wiring configurations. With the addition of an innerlayer adhesion promotion system, Circuits, LLC’s engineering team released the rigid-flex PCB manufacturing operations to production to offer a more dependable and cost effective alternative for their customers. Rigid- flex PCBs enable weight-reduction and more compact packaging with improved performance ideal for many military, aerospace and medical applications.

Circuits, LLC is well-equipped to take on rigid-flex PCB processing. The 50,000 square foot fabricating and testing facility houses a built-to-purpose, flow-optimized workspace specifically designed and equipped to produce consistent, high-quality flexible printed circuits with minimum handling and transport. The PCB manufacturing facility features a fully-integrated Class 1,000 clean room, a laser driller/router and a custom plating line configured for the production of complex circuits.

Rather than using a traditional oxide treatment in the manufacture of rigid-flex, Circuits chose an innerlayer adhesion promotion system that combines micro-etching and surface adhesion promotion to influence the flow of the pre-preg resin yielding significant interlaminar bond strength between resin and the copper surface. The COBRA Bond™ process (developed by OMG Electronic Chemicals) is designed to work with multiple types of foils, is scratch resistant and has lower overall processing costs. “The new system offers many benefits for Circuits and their customers,” according to Michael Carano, Global Manager Strategic Business Development and Marketing, OMG Electronic Chemicals, “plus the COBRA Bond™ process meets with Circuits’ “clean manufacturing” strategy because it is more environmentally sound than traditional oxide processes.”.

As both the mechanical and electrical aspects are a consideration when designing rigid-flex applications, Circuits, LLC offers their staff of experts to help customers design for manufacturability early in their process to insure the highest yields possible through the fabrication and the assembly process.

About Circuits, LLC

Circuits, LLC is a quality‐driven, customer‐focused manufacturer of highly reliable built‐to‐spec flexible printed circuit boards serving the defense, industrial, and medical markets with consistent quality and on‐time delivery unsurpassed by competitors.

Circuits, LLC

4060 Norbatrol Court

Murrysville, PA 15668

www.circuits‐corp.com

OMG Electronic Chemicals is a diversified global developer, producer and marketer of value-added specialty chemicals and advanced materials that are essential to complex chemical and industrial processes. Key technology-based end-use applications include affordable energy, portable power, clean air, clean water and proprietary products and services for the microelectronics industry. Headquartered in Cleveland, Ohio, OMG Electronic Chemicals operates manufacturing facilities in the Americas, Europe, Asia and Africa. For more information, visit www.omgi.com.

COBRA Bond™ is a registered trademark of OMG Electronic Chemicals.

###

Emerson Network Power and Freescale Semiconductor Collaborate on Power Architecture(r) Technology for Small Form Factor Boards

Emerson Network Power — Tue, 02 Mar 2010 01:53:54 -0800

NUREMBERG, Germany – Emerson Network Power, a business of Emerson and the global leader in enabling Business-Critical Continuity™, and Freescale Semiconductor, a global leader in the design and manufacture of embedded semiconductors, today announced a collaborative effort to deploy Freescale multicore QorIQ processors on modular single-board computers (SBCs) based on the COM Express® small form factor.

The two companies will soon release a white paper on the Web site of the PCI Industrial Computer Manufacturers Group (PICMG) that defines how to design systems using Freescale QorIQ processors on modular SBCs based on the COM Express small form factor.

Based on Freescale's e500 core designed with Power Architecture® technology, QorIQ devices offer a broad range of price, performance and power options that are ideal for a variety of market requirements. QorIQ processors are the next-generation successor to the groundbreaking PowerQUICC device family, which pioneered the communications processor space.

“The availability of Power Architecture technology-based processors on small form factor boards will expand customer choices and allow OEMs to focus valuable R&D resources on solutions for their markets,” said Joe Pavlat, president of the PCI Industrial Computer Manufacturers Group. “I support the intent to get these ideas incorporated into appropriate standards.”

“With reduced design resources, an increasing number of OEMs are faced with challenging ‘build or buy’ scenarios, encouraging them to adopt SBC solutions in contrast to traditional chip-level design due to their ability to reduce development costs and enable a faster time-to-market,” said Dick DuBois, senior vice president of Emerson Network Power’s Embedded Computing business. “In addition to telecom markets, the combination of Power Architecture technology and the COM Express form factor will appeal to a broad customer base in military, aerospace, government, medical, automation and industrial markets.”

“Integrating Freescale’s flagship networking processors into standardized form factors holds the potential to dramatically enhance innovation across a range of markets in which high performance and low power are critical,” said Brett Butler, vice president and general manager of Freescale’s Networking Processor Division. “Freescale is pleased to collaborate with Emerson to help take SBC solutions to new levels of performance and energy efficiency.”

About Emerson Network Power

Emerson Network Power, a business of Emerson, is the global leader in enabling Business-Critical Continuity™ from grid to chip for telecommunication networks, data centers, health care and industrial facilities. Emerson Network Power provides innovative solutions and expertise in areas including AC and DC power and precision cooling systems, embedded computing and power, integrated racks and enclosures, power switching and controls, monitoring, and connectivity. All solutions are supported globally by local Emerson Network Power service technicians. For more information on Emerson Network Power’s embedded computing products and services including ATCA®, COM Express®, CompactPCI®, embedded motherboards, MicroTCA®, VMEbus and OpenSAF® for original equipment manufacturers and systems integrators in the telecommunications, industrial, aerospace/defense and medical markets, visit www.EmersonNetworkPower.com/EmbeddedComputing. Learn more about Emerson Network Power products and services at www.EmersonNetworkPower.com.

About Freescale Semiconductor

LDRA and Visure Release Embed-X, A Comprehensive Embedded Application Lifecycle Management Solution

LDRA Software — Mon, 01 Mar 2010 22:52:15 -0800

Wirral, UK. 2 March 2010. LDRA, the leading provider of automated software verification tools, and Visure Solutions, market leader in Requirements Definition and Management, announced the release of Embed-X, the first end-to-end application lifecycle management (ALM) system for the embedded space. Embed-X, like other ALM solutions, merges product requirements, business objectives and metrics in a uniform actionable perspective. However, Embed-X also delivers these ALM objectives with full certification support for critical development standards in the avionics, defense, automotive and medical markets while executing on an unrivalled track record of embedded expertise extending 35 years.

Accelerating software complexity has created a multi-headed challenge for software developers. The criticality, complexity and volume of software have ballooned, creating an exponential increase in software risk. Company profits in automotive and medical are crippled by software-defect product recalls while, according to Forrester, avionics and defense projects commonly experience schedule and budget overruns by a factor of two and deliver only 60% of the expected functionality. Up to 85% of these errors stem from a failure to properly manage requirements. Boeing and Airbus maintain that the expense of identifying an error during first flight increases costs up to 900 times than if the error had been identified early in the development process.

To enable companies to cope with the exorbitant costs systemic in current development processes, LDRA and Visure have designed Embed-X to streamline software development to deliver 50% cost savings. This industry-first embedded application lifecycle management for critical systems coordinates software engineering by integrating project management, requirements management, architecture, coding, software configuration management and testing. ALM solutions automate and enforce processes between the stages of development, manage relationships between assets used or produced by the software, and offer transparency and metrics through reports on development as it progresses.

“For the first time, software developers will be able to manage the micro-detail fundamental to embedded applications,” noted Baldo Rincón, Managing Director of Visure Solutions. “Embed-X shares requirements and system components and creates an open forum between software developers and engineers taking care of mechanical and electrical details. Because of bidirectional Lifecycle Traceability, requirements are no longer isolated in repositories, but dynamically updated throughout the system.”

Building on LDRA’s strengths in the critical software marketplace and Visure’s experience delivering requirements solutions, Embed-X is geared to meet the demands of safety-critical development standards. Incorporating LDRA’s patent-pending verification management technology, Embed-X will help system engineering, development and production organizations by coherently tracing requirements through static and dynamic analysis to unit testing and system verification to achieve a fully certified application. Embed-X offers compliance with

DO-178B, MISRA, and security standards, such as CERT C and the Homeland Security Agency’s Common Weakness Enumerations (CWE).

“Developers in the safety- and mission-critical space face some of the most stringent certification requirements,” noted Ian Hennell, LDRA Operations Director. “Many companies still attempt to track many of the processes needed for certification manually—a feat often met with disaster. Embed-X automates those processes, removes redundancies between development teams and provides transparency and metrics into the processes to project managers and developers alike.”

Knowing the cost-sensitivity of the embedded market, LDRA and Visure has eased adoption by providing a target license package that incorporates customization and training. Common interfaces seamlessly link the various stages of Embed-X to provide a uniform product GUI. Now, instead of dealing with individual tools for project planning, requirements engineering, change management, product and certification documentation and verification, these activities are synchronized by Embed-X across a network of collaborative users.

“Embed-X represents a breakthrough for the embedded world,” stated Hennell. “Embed-X makes the entire development process visible and its assets tangible. Embed-X will not only slash development and certification costs, it will also greatly enhance management processes.”

About LDRA

For more than thirty years, LDRA has developed and driven the market for software that automates code analysis and software testing for safety-, mission-, security- and business- critical markets. Working with clients to achieve early error identification and full compliance with industry standards, LDRA traces requirements through static and dynamic analysis to unit testing and verification for a wide variety of hardware and software platforms. Boasting a worldwide presence, LDRA is headquartered in the UK with subsidiaries in the United States and an extensive distributor network. For more information on the LDRA tool suite, please visit: www.ldra.com.

About Visure Solutions

Visure Solutions, “The Requirements Company”, is the market leader in Requirements Definition and Management. Requirements are the most critical element in the development of complex systems and problems derived from their mismanagement have a very high incidence in lowering quality and productivity, increasing development costs and time to market.

With IRQA as our centralized requirements platform, Visure offers specialised and innovative solutions that are easy to use in the implementation of efficient processes for the requirements definition and management, and thereby guarantee the highest quality in the development of the products, systems and services of our clients. Visure is headquartered in Spain and provides a large distributor network throughout the world. For more information, please visit www.visuresolutions.com.

Please send reader enquiries to:

Mark James

LDRA, Portside, Monks Ferry, Wirral, CH41 5LH, UK

Email: mark.james@ldra.com

Ana Malumbres

Visure Solutions C/Labradores, 1, 4th Floor, 28760 Tres Cantos, Madrid, Spain

E-mail: amalumbres@visuresolutions.com

Lanner Releases Embedded System Powered by the latest Intel(r) Atom(tm) Processor D510

Lanner Electronics Inc. — Mon, 01 Mar 2010 16:51:03 -0800

(Taipei, Taiwan March 2nd 2010, 4:01pm) Today Lanner Electronics Inc., a 24 year veteran manufacturer of Industrial computers, released the LEC-7100, a fanless industrial computer powered by the new dual core Intel® Atom™ processor D510 at 1.66GHz. The LEC-7100 comes equipped with VGA, DVI-D, 4 x USB and 2 x LAN ports, along with wireless capabilities. This embedded system is designed to be easily deployable for a variety of industrial and commercial applications.

“We’re very excited about the new dual core Intel® Atom™ processor and the advantages it brings to our fanless computers,” said Spencer Chou, Product Planner, Embedded Business Group, Lanner Electronics. “As a member of the Intel® Embedded Alliance, Lanner is able to utilize the latest Intel technologies to develop cutting-edge embedded products like the new Lanner LUGE 7100. The LEC-7100 is a versatile network-ready computer with all the interfaces needed for a wide variety of end-use applications, and with the new 1.66GHz Intel® Atom™ processor, we’ve developed a powerful solution that improves on all aspects of the fanless design, including performance, stability, power consumption and price.”

“The Intel® Atom™ processor D510 is power-optimized and delivers robust performance-per-watt for cost-effective embedded solutions,” says Jonathan Luse, marketing director, Intel Low Power Embedded Products Division. “Embedded platforms built with the new multi-threaded Intel Atom processor can deliver a combination of low power consumption, high performance and a smaller, more efficient footprint due to the integration of the graphics and memory controllers on the chip, opening new design and application opportunities for developers.”

The LUGE LEC-7100 includes multiple audio and video interfaces, two gigabit LAN network ports, and two storage interfaces – CompactFlash Type I/II and SATA HDD. Another stand out feature in the LEC-7100 is the ability to communicate wirelessly. There is a 3G/GPS module attached through a mini PCIe socket, as well as WiFi ready hardware.

Additionally, the LEC-7100 features both VGA and DVI-D video ports, delivering increased flexibility for dual display applications such as digital signage, point of sales, kiosk and jackpot displays.

The Lanner LEC-7100 embedded computer is designed for flexible deployment in any scenario. Its robust fanless design makes the LEC-7100 an ideal solution for video applications such as digital signs, outdoor advertising and kiosk systems. The onboard 1.66GHz dual core Intel® Atom™ processor D510 provides outstanding performance with very low power consumption and minimal cooling requirements, resulting in improved stability and longevity and providing a higher return on investment.

For more information please visit our website: www.lannerinc.com/embedded/LEC-7100.

Or contact our sales department: sales@lannerinc.com

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About Lanner

*Intel and Intel Atom are trademarks of Intel Corporation in the U.S. and other countries.

Lanner's Fanless Digital Signage Platform With Dual Display Support and S-Video Connection

Lanner Electronics Inc. — Mon, 01 Mar 2010 09:36:13 -0800

(Taipei, Taiwan) Lanner has released the LEC-7030, an interactive platform aimed at the narrowcasting segment of the digital signage market. New features of the LEC-7030 include both S-Video and RCA Audio inputs. Additional features include an onboard 1.6GHz Intel Atom with VGA and DVI-D video outs.

The VGA and DVI-D video outputs can be connected to any digital signage screen to produce vivid video and audio. Utilizing both outputs can increase the surface area of the message and can increase signage effectiveness. Applications include high impact advertising screens in locations such as shopping malls, tourist destinations and mass transport.

By designing the LEC-7030 to have both analog S-Video and RCA Audio inputs, Lanner has enabled additional signage functionality. By setting an external camera connected via the S-Video port, this platform can record data regarding customer viewership- allowing you to act upon that data to increase your signage effectiveness. Unlike IP cameras, the S-Video input can provide high quality video footage at a low price, without effecting network capabilities.

Hardware specifications for the LEC-7030 include an onboard 1.6GHz Intel Atom (N270) and an Intel 945GSE+ICH7M chipset. The LEC-7030 can hold up to 2GBs of RAM through a single SODIMM socket. It supports one 2.5” SATA HDD, DOM, and CompactFlash.

As for I/O ports there are 2 x RS-232 COM, 1 x Digital I/O, 4 x USB 2.0 and 1 RJ45 GbE port.

In addition to the RCA inputs there are RCA outputs for high quality sound.

With industrial components, the LEC 7030 has been tested for a temperature range between -10 degrees to 55 degrees Celsius. It is compatible with both Linux kernel 2.14.6 and above, along with both Windows XPE and Windows XP 32-bit.

For more information please visit the product page at: www.lannerinc.com/interactive/LEC-7030

Or contact our sales department at: sales@lannerinc.com

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About Lanner

Founded in 1986 and publicly listed (TAIEX 6245) since 2003, Lanner Electronics, Inc. is an ISO 9001 certified designer and manufacturer of applied computing hardware for first-tier companies. Lanner's expertise enables customers to optimize hardware and software communication to achieve faster time to market. With headquarters in Taipei, Taiwan and branches in the U.S. and China, Lanner is uniquely positioned to deliver customized solutions with localized, value-added service. Lanner is an Associate Member of the Intel® Embedded and Communications Alliance, a group of companies committed to developing modular, standards-based solutions based on technologies, processors, products, and services from Intel®.